Patent US6048919A successfully refreshed from Google Patents.
US6048919A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermally conductive composite material
Assignee: Ticona Polymers Inc
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Filing: 1999-01-29
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Granted: 2000-04-11
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Expires: 2019-01-29
Abstract
Abstract A conductive molding composition, with a thermal conductivity above 22 W/m DEG K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
Inventors
- 👤 Kevin A. McCullough
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:03
CPC Classifications
C; C08; C08K; C08K3/00; C08K3/38; C08K7/00; C08K3/01; C08K3/013; C08K2201/00; C08K2201/014; C08K2201/016
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
82 words
A high thermally conductive molding composition having a thermal conductivity above 22 W/m° K. and being net-shade moldable, comprising: a polymer base matrix of, by volume, between 30 and 60 percent; a first thermally conductive filler, by volume, between 25 and 60 percent; said first thermally conductive filler having an aspect ratio of at least 10:1; and a second thermally conductive filler, by volume, between 10 and 25 percent; said second thermally conductive filler having an aspect ratio of less than 5:1.
Claim 2
Dependent Claim
82 words
A high thermally conductive molding composition having a thermal conductivity above 22 W/m° K. and being net-shade moldable, comprising: a polymer base matrix of, by volume, between 30 and 60 percent; a first thermally conductive filler, by volume, between 25 and 60 percent; said first thermally conductive filler having an aspect ratio of at least 10:1; and a second thermally conductive filler, by volume, between 10 and 25 percent; said second thermally conductive filler having an aspect ratio of less than 5:1.
Claim 3
Dependent Claim
16 words
The molding composition of claim 1, wherein said polymer base matrix is a liquid crystal polymer.
Claim 4
Dependent Claim
17 words
The molding composition of claim 1, wherein said first thermally conductive filler is of a flake configuration.
Claim 5
Dependent Claim
17 words
The molding composition of claim 1, wherein said first thermally conductive filler is of a rice configuration.
Claim 6
Dependent Claim
17 words
The molding composition of claim 1, wherein said first thermally conductive filler is of a strand configuration.
Claim 7
Dependent Claim
17 words
The molding composition of claim 1, wherein said first thermally conductive filler is of a whisker configuration.
Claim 8
Dependent Claim
28 words
The molding composition of claim 1, wherein said first thermally conductive filler is a metallic material selected from the group consisting of aluminum, alumina, copper, magnesium and brass.
Claim 9
Dependent Claim
15 words
The molding composition of claim 1, wherein said first thermally conductive filler is carbon material.
Claim 10
Dependent Claim
16 words
The molding composition of claim 1, wherein said second thermally conductive filler is spheroid in shape.
Claim 11
Dependent Claim
17 words
The molding composition of claim 1, wherein said second thermally conductive filler is of a grain configuration.
Claim 12
Dependent Claim
28 words
The molding composition of claim 1, wherein said second thermally conductive filler is a metallic material selected from the group consisting of aluminum, alumina, copper, magnesium and brass.
Claim 13
Dependent Claim
15 words
The molding composition of claim 1, wherein said second thermally conductive filler is boron nitride.
Claim 14
Dependent Claim
14 words
The molding composition of claim 1, wherein said second thermally conductive filler is carbon.
Claim 15
Dependent Claim
42 words
The molding composition of claim 1, wherein said polymer base is of approximately 50 percent by volume; said first thermally conductive filler is of approximately 35 percent by volume; and said second thermally conductive filler is of approximately 15 percent by volume.
Claim 16
Dependent Claim
63 words
A thermally conductive polymer composition, having a thermal conductivity over 22 W/m° K. and being net-shape moldable, comprising a mixture of a polymer and a first thermally conductive filler material and a second thermally conductive filler material; said first thermally conductive filler material having an aspect ratio greater than 10:1; said second thermally conductive filler material having an aspect ratio less than 5:1.
Claim 17
Dependent Claim
63 words
A thermally conductive polymer composition, having a thermal conductivity over 22 W/m° K. and being net-shape moldable, comprising a mixture of a polymer and a first thermally conductive filler material and a second thermally conductive filler material; said first thermally conductive filler material having an aspect ratio greater than 10:1; said second thermally conductive filler material having an aspect ratio less than 5:1.
Claim 18
Dependent Claim
14 words
The polymer composition of claim 15, wherein said polymer is a liquid crystal polymer.
Claim 19
Dependent Claim
16 words
The polymer composition of claim 15, wherein said first thermally conductive filler material is carbon flakes.
Claim 20
Dependent Claim
17 words
The polymer composition of claim 15, wherein said second thermally conductive filler material is boron nitride grains.
Claim 21
Dependent Claim
53 words
A thermally conductive composition, having a thermal conductivity over 22 W/m° K. and being net-shape moldable, comprising: a polymer base matrix material; a first thermally conductive filler material having an aspect ratio configuration of at least 10:1; and a second thermally conductive filler material having an aspect ratio configuration of 5:1 or less.
Claim 22
Dependent Claim
53 words
A thermally conductive composition, having a thermal conductivity over 22 W/m° K. and being net-shape moldable, comprising: a polymer base matrix material; a first thermally conductive filler material having an aspect ratio configuration of at least 10:1; and a second thermally conductive filler material having an aspect ratio configuration of 5:1 or less.
Claim 23
Dependent Claim
83 words
A thermally conductive injection molding composition having a thermal conductivity above 22 W/m° K. and being net-shape moldable, comprising: a metallic base matrix material; a first thermally conductive filler material having an aspect ratio configuration of at least 10:1; said first thermally conductive filler being carbon fiber; and a second thermally conductive filler material having an aspect ratio configuration of 5:1 or less; said second thermally conductive filler being made of a material selected from the group consisting of carbon and boron nitride.
Claim 24
Dependent Claim
83 words
A thermally conductive injection molding composition having a thermal conductivity above 22 W/m° K. and being net-shape moldable, comprising: a metallic base matrix material; a first thermally conductive filler material having an aspect ratio configuration of at least 10:1; said first thermally conductive filler being carbon fiber; and a second thermally conductive filler material having an aspect ratio configuration of 5:1 or less; said second thermally conductive filler being made of a material selected from the group consisting of carbon and boron nitride.
Claim 25
Dependent Claim
101 words
A high thermally conductive injection molding composition having a thermal conductivity above 22 W/m° K. and being net-shape moldable, comprising: a polymer base matrix of, by volume, between 30 and 60 percent; a first thermally conductive filler, by volume, between 25 and 60 percent; said first thermally conductive filler having an aspect ratio of at least 10:1 and a thermal conductivity of approximately 800 W/m° K.; and a second thermally conductive filler, by volume, between 10 and 25 percent; said second thermally conductive filler having an aspect ratio of less than 5:1 and a thermal conductivity of approximately 400 W/m° K.
Claim 26
Dependent Claim
101 words
A high thermally conductive injection molding composition having a thermal conductivity above 22 W/m° K. and being net-shape moldable, comprising: a polymer base matrix of, by volume, between 30 and 60 percent; a first thermally conductive filler, by volume, between 25 and 60 percent; said first thermally conductive filler having an aspect ratio of at least 10:1 and a thermal conductivity of approximately 800 W/m° K.; and a second thermally conductive filler, by volume, between 10 and 25 percent; said second thermally conductive filler having an aspect ratio of less than 5:1 and a thermal conductivity of approximately 400 W/m° K.
Claim 27
Dependent Claim
103 words
A high thermally conductive injection molding composition having a thermal conductivity above 22 W/m° K. and being net-shape moldable, comprising: a polymer base matrix of, by volume, between 30 and 60 percent; a first thermally conductive filler, by volume, between 25 and 60 percent; said first thermally conductive filler having an aspect ratio of at least 10:1 and a thermal conductivity of at least 800 W/m° K.; and a second thermally conductive filler, by volume, between 10 and 25 percent; said second thermally conductive filler having an aspect ratio of less than 5:1 and a thermal conductivity of at least 400 W/m° K.
Claim 28
Dependent Claim
103 words
A high thermally conductive injection molding composition having a thermal conductivity above 22 W/m° K. and being net-shape moldable, comprising: a polymer base matrix of, by volume, between 30 and 60 percent; a first thermally conductive filler, by volume, between 25 and 60 percent; said first thermally conductive filler having an aspect ratio of at least 10:1 and a thermal conductivity of at least 800 W/m° K.; and a second thermally conductive filler, by volume, between 10 and 25 percent; said second thermally conductive filler having an aspect ratio of less than 5:1 and a thermal conductivity of at least 400 W/m° K.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-11 | 2003-10-11 | 2004-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-11 | 2007-10-11 | 2008-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-11 | 2011-10-11 | 2012-04-11 | $7700.00 | Window Closed / Lapsed |