Method for fabricating BGA package using substrate with patterned solder mask open in die attach area

Claim 1

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a first outline; providing a substrate comprising a first surface having a plurality of conductors, and a second surface having a die attach area; depositing a photoimageable mask material on the first surface and on the second surface; exposing and developing the mask material to form a first mask on the first surface; exposing and developing the mask material to form a second mask on the second surface comprising an opening having an outline substantially matching the first outline to define an open die attach area on the substrate; and bonding the die directly to the substrate by forming an adhesive layer between the die and the substrate in the open die attach area to improve an adhesion of the die to the substrate.

Claim 2

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a first outline; providing a substrate comprising a first surface having a plurality of conductors, and a second surface having a die attach area; depositing a photoimageable mask material on the first surface and on the second surface; exposing and developing the mask material to form a first mask on the first surface; exposing and developing the mask material to form a second mask on the second surface comprising an opening having an outline substantially matching the first outline to define an open die attach area on the substrate; and bonding the die directly to the substrate by forming an adhesive layer between the die and the substrate in the open die attach area to improve an adhesion of the die to the substrate.

Claim 5

A method for fabricating a semiconductor package comprising: providing a semiconductor die; providing a substrate comprising a first surface with a plurality of conductors, a second surface with a die attach area, and a bonding opening extending from the first surface to the second surface; depositing a photoimageable mask material on the substrate substantially covering the first surface and the second surface; exposing and developing the mask material to form a first mask on the first surface comprising a first opening on the bonding opening and at least a portion of the conductors; exposing and developing the mask material to form a second mask on the second surface comprising a second opening which defines a die attach area on the substrate proximate to the bonding opening; bonding the die circuit side down to the die attach area by forming an adhesive layer between the die and the substrate in the die attach area; and forming a plurality of electrical paths in the bonding opening between the die and the conductors.

Claim 6

A method for fabricating a semiconductor package comprising: providing a semiconductor die; providing a substrate comprising a first surface with a plurality of conductors, a second surface with a die attach area, and a bonding opening extending from the first surface to the second surface; depositing a photoimageable mask material on the substrate substantially covering the first surface and the second surface; exposing and developing the mask material to form a first mask on the first surface comprising a first opening on the bonding opening and at least a portion of the conductors; exposing and developing the mask material to form a second mask on the second surface comprising a second opening which defines a die attach area on the substrate proximate to the bonding opening; bonding the die circuit side down to the die attach area by forming an adhesive layer between the die and the substrate in the die attach area; and forming a plurality of electrical paths in the bonding opening between the die and the conductors.

Claim 9

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a face; providing a substrate comprising a first surface and a second surface; providing a plurality of conductors on the first surface; forming a first mask on the first surface comprising a plurality of via openings aligned with the conductors; forming a second mask on the second surface comprising an opening defining a die attach area on the substrate; bonding the die face down to the substrate by forming an adhesive layer between the face of the die and the substrate in the die attach areas; forming a plurality of electrical connections between the die and the conductors; forming an encapsulating material on the second surface that substantially covers the die and the second mask; and bonding a plurality of solder balls in the via openings to the conductors.

Claim 10

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a face; providing a substrate comprising a first surface and a second surface; providing a plurality of conductors on the first surface; forming a first mask on the first surface comprising a plurality of via openings aligned with the conductors; forming a second mask on the second surface comprising an opening defining a die attach area on the substrate; bonding the die face down to the substrate by forming an adhesive layer between the face of the die and the substrate in the die attach areas; forming a plurality of electrical connections between the die and the conductors; forming an encapsulating material on the second surface that substantially covers the die and the second mask; and bonding a plurality of solder balls in the via openings to the conductors.

Claim 13

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a first outline; providing a substrate comprising a first surface and a second surface; providing a plurality of conductors on the first surface; depositing a photoimageable mask material on the first surface, on the conductors, and on the second surface; exposing and developing the mask material on the first surface to form a first mask having a plurality of via openings to the conductors; exposing and developing the mask material on the second surface to form a second mask comprising an opening having a second outline substantially matching the first outline to define a die attach area on the substrate; and attaching a semiconductor die directly to the die attach area by forming an adhesive layer between the die and the substrate to improve an adhesion of the die to the substrate.

Claim 14

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a first outline; providing a substrate comprising a first surface and a second surface; providing a plurality of conductors on the first surface; depositing a photoimageable mask material on the first surface, on the conductors, and on the second surface; exposing and developing the mask material on the first surface to form a first mask having a plurality of via openings to the conductors; exposing and developing the mask material on the second surface to form a second mask comprising an opening having a second outline substantially matching the first outline to define a die attach area on the substrate; and attaching a semiconductor die directly to the die attach area by forming an adhesive layer between the die and the substrate to improve an adhesion of the die to the substrate.

Claim 19

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a face; providing a substrate comprising a first surface, a second surface, and a wire bonding opening extending from the first surface to the second surface; providing a plurality of conductors on the first surface comprising a plurality of ball bonding pads and a plurality of wire bonding pads; substantially covering the first surface and the second surface with a photoimageable mask material; exposing and developing the mask material on the first surface to form a first mask comprising a plurality of via openings to the ball bonding pads and a first opening on the wire bonding pads; exposing and developing the mask material on the second surface to form a second mask comprising a second opening defining a die attach area on the substrate; attaching a semiconductor die face down to the die attach area by forming an adhesive layer between the face and the substrate; placing solder balls in the via openings and bonding the balls to the ball bonding pads; and wire bonding a plurality of wires through the wire bonding opening to the die and through the first opening to the wire bonding pads.

Claim 20

A method for fabricating a semiconductor package comprising: providing a semiconductor die having a face; providing a substrate comprising a first surface, a second surface, and a wire bonding opening extending from the first surface to the second surface; providing a plurality of conductors on the first surface comprising a plurality of ball bonding pads and a plurality of wire bonding pads; substantially covering the first surface and the second surface with a photoimageable mask material; exposing and developing the mask material on the first surface to form a first mask comprising a plurality of via openings to the ball bonding pads and a first opening on the wire bonding pads; exposing and developing the mask material on the second surface to form a second mask comprising a second opening defining a die attach area on the substrate; attaching a semiconductor die face down to the die attach area by forming an adhesive layer between the face and the substrate; placing solder balls in the via openings and bonding the balls to the ball bonding pads; and wire bonding a plurality of wires through the wire bonding opening to the die and through the first opening to the wire bonding pads.