US5796586A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate board having an anti-adhesive solder mask
Assignee: National Semiconductor Corp
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Filing: 1996-08-26
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Granted: 1998-08-18
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Expires: 2016-08-26
Abstract
Abstract Discloses is a method for making substrate boards for use in packaging semiconductor devices. The substrate board has a plurality of conductive traces patterned on at least one side, and an anti-adhesive solder mask is applied over and around conductive traces lying at an outer portion of the substrate board. The center portion of the substrate board will therefore remain uncovered by the anti-adhesive solder mask material. As a result, the uncovered center portion of the substrate board and conductive traces provide a surface area that is substantially more adhesive than the outer portion covered with the anti-adhesive solder mask.
Inventors
- 👤 Shaw Wei Lee
- 👤 Poh Ling Lee
- 👤 Anthony E. Panczak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:36
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H10; H10W; H10W90/00; H10W90/701; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1316; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
137 words
A circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces; a plurality of conductive traces positioned on the substrate; and an anti-adhesive solder mask positioned on the first surface, the solder mask substantially defining a ring around an outer portion of the substrate such that a center portion of the first surface is exposed and does not contain the solder mask, wherein the ring of solder mask is sized such that the ring will extend outside the packaged semiconductor device such that encapsulation material that is deposited on the solder mask outside of the packaged semiconductor device may be easily removed without substantially damaging the packaged semiconductor device and wherein the ring is sized such that the ring will not substantially extend inside the packaged device.
Claim 2
Dependent Claim
137 words
A circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces; a plurality of conductive traces positioned on the substrate; and an anti-adhesive solder mask positioned on the first surface, the solder mask substantially defining a ring around an outer portion of the substrate such that a center portion of the first surface is exposed and does not contain the solder mask, wherein the ring of solder mask is sized such that the ring will extend outside the packaged semiconductor device such that encapsulation material that is deposited on the solder mask outside of the packaged semiconductor device may be easily removed without substantially damaging the packaged semiconductor device and wherein the ring is sized such that the ring will not substantially extend inside the packaged device.
Claim 3
Dependent Claim
34 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, wherein the solder mask covers between about 5 percent and 30 percent of the first surface of the substrate.
Claim 4
Dependent Claim
47 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, wherein the outer portion of the substrate covered by the solder mask includes a substrate perimeter, the substrate further comprising a second solder mask formed over the second surface of the substrate.
Claim 5
Dependent Claim
42 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, wherein the anti-adhesive solder mask is a solder mask selected from the group consisting of a liquid photo imagable polyimide film and dry photo imagable polyimide film.
Claim 6
Dependent Claim
69 words
The circuit board for use in a packaged semiconductor device as recited in claim 1 wherein the substrate includes a die attach area within the center portion of the first substrate surface, the second substrate surface further including a plurality of conductive contacts, and wherein at least some of the traces have trace tips located adjacent the die attach area and are arranged to interconnect with associated conductive contacts.
Claim 7
Dependent Claim
40 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, further comprising conductive vias for interconnecting traces formed on the first surface of the substrate with traces formed on the second surface of the substrate.
Claim 8
Dependent Claim
27 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, wherein the plurality of contacts are configured to receive conductive solder balls.
Claim 9
Dependent Claim
34 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, wherein the substrate is selected from the group consisting of a bismalimide triagine resin substrate, and a modified polyimide.
Claim 10
Dependent Claim
36 words
The circuit board for use in a packaged semiconductor device as recited in claim 1, wherein the plurality of conductive traces are patterned from a material selected from the group consisting of copper, gold and silver.
Claim 11
Dependent Claim
34 words
The circuit board for use in a packaged semiconductor device as recited in claim 9, wherein the conductive traces further include an anti-oxidation protective coating selected from the group consisting of gold and silver.
Claim 12
Dependent Claim
79 words
A packaged semiconductor device comprising: a circuit board as recited in claim 1; a die mounted on the die attach area of the first surface of the substrate; interconnections that connect the die to selected ones of the plurality of conductive traces; and an encapsulating material for encasing the die, the bonding wires, and at least a portion of the selected conductive traces, the encapsulating material being arranged to substantially cover the center portion of the first substrate surface.
Claim 13
Dependent Claim
29 words
The packaged semiconductor device of claim 11, wherein the encapsulating material forms a cap over the first surface of the substrate and does not substantially overlap the solder mask.
Claim 14
Dependent Claim
15 words
The packaged semiconductor device of claim 11, wherein the encapsulating material is a mold compound.
Claim 15
Dependent Claim
34 words
The packaged semiconductor device of claim 1, wherein the interconnections are selected from the group consisting of wire bonds, tape automated bonding (TAB), flip-chip wafer bumps, Z axis conductive epoxies, and direct chip attach.
Claim 16
Dependent Claim
106 words
A circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces: a plurality of conductive traces positioned on the substrate: and an anti-adhesive solder mask positioned on the first surface the solder mask substantially defining a ring around an outer portion of the substrate such that a center portion of the first surface is exposed and does not contain the solder mask, wherein the solder mask ring around the outer portion of the substrate has a surface width that is between about 1 percent and about 20 percent of a first surface width of the substrate.
Claim 17
Dependent Claim
106 words
A circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces: a plurality of conductive traces positioned on the substrate: and an anti-adhesive solder mask positioned on the first surface the solder mask substantially defining a ring around an outer portion of the substrate such that a center portion of the first surface is exposed and does not contain the solder mask, wherein the solder mask ring around the outer portion of the substrate has a surface width that is between about 1 percent and about 20 percent of a first surface width of the substrate.
Claim 18
Dependent Claim
68 words
A circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces wherein the first surface includes a gate area; a plurality of conductive traces positioned on the substrate; an adhesive solder mask positioned on the first surface and second surfaces; and a patterned anti-adhesive solder mask positioned on the gate area of the first surface of the substrate.
Claim 19
Dependent Claim
68 words
A circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces wherein the first surface includes a gate area; a plurality of conductive traces positioned on the substrate; an adhesive solder mask positioned on the first surface and second surfaces; and a patterned anti-adhesive solder mask positioned on the gate area of the first surface of the substrate.
Claim 20
Dependent Claim
38 words
An circuit board for use in a packaged semiconductor device as recited in claim 16, wherein said anti-adhesive gate area material is selected from the group consisting of a liquid photo imagable polyimide and a dry film polyimide.
Claim 21
Dependent Claim
26 words
An circuit board for use in a packaged semiconductor device as recited in claim 16, wherein said anti-adhesive gate area can be patterned over conductive traces.
Claim 22
Dependent Claim
95 words
An circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces; a plurality of conductive traces positioned on the substrate; an anti-adhesive solder mask positioned on the first surface, the anti-adhesive solder mask substantially defining an outer ring around an outer portion of the substrate such that a center portion of the first surface is exposed and does not contain the solder mask; and an adhesive solder mask positioned on the first surface, the adhesive solder mask covering an inner portion of the conductive traces.
Claim 23
Dependent Claim
95 words
An circuit board for use in a packaged semiconductor device, the circuit board comprising: a substrate having first and second surfaces; a plurality of conductive traces positioned on the substrate; an anti-adhesive solder mask positioned on the first surface, the anti-adhesive solder mask substantially defining an outer ring around an outer portion of the substrate such that a center portion of the first surface is exposed and does not contain the solder mask; and an adhesive solder mask positioned on the first surface, the adhesive solder mask covering an inner portion of the conductive traces.
Claim 24
Dependent Claim
41 words
The circuit board of claim 27, wherein the anti-adhesive solder mask ring around the outer portion of the substrate has a surface width that is between about 1 percent and about 20 percent of a first surface width of the substrate.
Claim 25
Dependent Claim
27 words
The circuit board of claim 27, wherein the anti-adhesive solder mask covers between about approximately 5 percent and 30 percent of the first surface of the substrate.
Claim 26
Dependent Claim
79 words
A packaged semiconductor device comprising: a circuit board as recited in claim 27; a die mounted on the die attach area of the first surface of the substrate; interconnections that connect the die to selected ones of the plurality of conductive traces; and an encapsulating material for encasing the die, the bonding wires, and at least a portion of the selected conductive traces, the encapsulating material being arranged to substantially cover the center portion of the first substrate surface.
Claim 27
Dependent Claim
36 words
The packaged semiconductor device of claim 30, wherein the encapsulating material forms a cap over the first surface of the substrate, does not substantially overlap the anti-adhesive solder mask, and substantially overlaps the adhesive solder mask.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-17 | 2002-02-16 | 2002-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-17 | 2006-02-16 | 2006-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-17 | 2010-02-16 | 2010-08-18 | $7700.00 | Window Closed / Lapsed |