Modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Claim 2

A semiconductor assembly, comprising: a semiconductor die having an active surface with an array of bond pads located thereon; a first layer of insulative material overcovering a portion of said active surface of said semiconductor die and adhesively bonded thereto; a lead frame having a portion thereof attached to a portion of said first layer of insulative material, said lead frame having a plurality of conductive leads, said plurality of conductive leads including inwardly extending lead fingers, outwardly extending terminal portions, and at least one conductive bus bar for electrical connection to at least one bond pad of the said array of said bond pads, said bus bar interposed between a bond pad of the plurality of said bond pads of said semiconductor die and a lead of the plurality of leads of said lead frame; at least one conductive wire connecting at least one of bond pad of said array of bond pads to at least one lead finger of said lead fingers, the at least one conductive wire spanning a portion of the bus bar; at least one conductive wire connecting at least one bond pad of said array of said bond pads to said bus bar; and a second layer of electrically insulative material secured to the portion of the upper surface of said bus bar spanned by said at least one wire, said second layer of insulative material is applied to said bus bar as one of a tape.

Claim 3

The semiconductor assembly of claim 1, wherein said second layer of insulative material covers said bus bar preventing shorting of said spanning wire to said bus bar.

Claim 4

The semiconductor assembly of claim 1, wherein said second layer of insulative material substantially overcovers said bus bar excepting bonding areas thereon.

Claim 5

The semiconductor assembly of claim 1, wherein said second layer of insulative material comprises one of polyimide, epoxy, acrylic, and silicone.

Claim 6

The semiconductor assembly of claim 1, wherein said second layer of insulative material comprises a polyimide having high Irradiation blocking properties.

Claim 7

The semiconductor assembly of claim 1, wherein said second layer of insulative material is applied to said bus bar as one of a tape film.

Claim 8

The semiconductor assembly of claim 1, wherein said bus bar includes notches therein adjacent said second layer of insulative material.

Claim 9

The semiconductor assembly of claim 7, wherein said insulative material comprises a polyimide.

Claim 10

The semiconductor assembly of claim 7, wherein said insulative material comprises Kapton™ polyimide, a trademarked product of duPont.

Claim 11

The semiconductor assembly of claim 7, wherein said second layer of insulative material includes a layer of adhesive on one surface thereof whereby said second layer is bonded to said bus bar.

Claim 12

The semiconductor assembly of claim 10, wherein said adhesive comprises one of a polyimide, epoxy, acrylic and a silicone.

Claim 13

The semiconductor assembly of claim 1, wherein said array of bond pads includes at least one bond pad positioned in a central portion of said die.

Claim 14

The semiconductor assembly of claim 1, wherein said second layer of insulative material has a thickness in the range of about 1-8 mils.

Claim 15

The semiconductor assembly of claim 1, wherein said second layer of insulative material has a thickness in the range of about 1-4 mils.

Claim 16

The semiconductor assembly of claim 1, wherein said assembly comprises a leads-over-chip (LOC) assembly.

Claim 17

A semiconductor assembly, comprising: a semiconductor die having an active surface with an array of bond pads located thereon; a first layer of insulative material overcovering a portion of said active surface of said semiconductor die and adhesively bonded thereto; a lead frame having a portion thereof attached to a portion of said first layer of insulative material, said lead frame having a plurality of conductive leads, said plurality of conductive leads including inwardly extending lead fingers, outwardly extending terminal portions, and at least one conductive bus bar for electrical connection to at least one bond pad of the said array of said bond pads, said bus bar interposed between a bond pad of the plurality of said bond pads of said semiconductor die and a lead of the plurality of leads of said lead frame, said bus bar having a plurality of notches therein; at least one conductive wire connecting at least one of bond pad of said array of bond pads to at least one lead finger of said lead fingers, the at least one conductive wire spanning a portion of the bus bar; at least one conductive wire connecting at least one bond pad of said array of said bond pads to said bus bar; and a second layer of electrically insulative material secured to the portion of the upper surface of said bus bar spanned by said at least one wire, said second layer of insulative material is applied to said bus bar as a liquid.

Claim 18

A semiconductor assembly, comprising: a semiconductor die having an active surface with an array of bond pads located thereon; a first layer of insulative material overcovering a portion of said active surface of said semiconductor die and adhesively bonded thereto; a lead frame having a portion thereof attached to a portion of said first layer of insulative material, said lead frame having a plurality of conductive leads, said plurality of conductive leads including inwardly extending lead fingers, outwardly extending terminal portions, and at least one conductive bus bar for electrical connection to at least one bond pad of the said array of said bond pads, said bus bar interposed between a bond pad of the plurality of said bond pads of said semiconductor die and a lead of the plurality of leads of said lead frame, said bus bar having a plurality of notches therein; at least one conductive wire connecting at least one of bond pad of said array of bond pads to at least one lead finger of said lead fingers, the at least one conductive wire spanning a portion of the bus bar; at least one conductive wire connecting at least one bond pad of said array of said bond pads to said bus bar; and a second layer of electrically insulative material secured to the portion of the upper surface of said bus bar spanned by said at least one wire, said second layer of insulative material is applied to said bus bar as a liquid.

Claim 19

The semiconductor assembly of claim 16, wherein said second layer of insulative material covers said bus bar preventing shorting of said spanning wire to said bus bar.

Claim 20

The semiconductor assembly of claim 16, wherein said second layer of insulative material substantially overcovers said bus bar excepting bonding areas thereon.

Claim 21

The semiconductor assembly of claim 16, wherein said second layer of insulative material comprises one of polyimide, epoxy, acrylic, and silicone.

Claim 22

The semiconductor assembly of claim 16, wherein said second layer of insulative material comprises a polyimide having high α-radiation blocking properties.

Claim 23

The semiconductor assembly of claim 16, wherein said insulative material comprises a polyimide.

Claim 24

The semiconductor assembly of claim 16, wherein said second layer of insulative material includes a layer of adhesive on one surface thereof whereby said second layer is bonded to said bus bar.

Claim 25

The semiconductor assembly of claim 16, wherein said adhesive comprises one of a polyimide, epoxy, acrylic and a silicone.

Claim 26

The semiconductor assembly of claim 16, wherein said array of bond pads includes at least one bond pad positioned in a central portion of said die.

Claim 27

The semiconductor assembly of claim 16, wherein said second layer of insulative material has a thickness in the range of about 1-8 mils.

Claim 28

The semiconductor assembly of claim 16, wherein said second layer of insulative material has a thickness in the range of about 1-4 mils.

Claim 29

The semiconductor assembly of claim 16, wherein said assembly comprises a leads-over-chip (LOC) assembly.

Claim 30

A lead frame for electrical connection to a semiconductor die, said lead frame comprising: a lead frame pattern having leads including lead fingers and a bus bar; and a layer of electrically insulative material bonded to a portion of the upper surface of said bus bar located between a pair of notches therein.

Claim 31

A lead frame for electrical connection to a semiconductor die, said lead frame comprising: a lead frame pattern having leads including lead fingers and a bus bar; and a layer of electrically insulative material bonded to a portion of the upper surface of said bus bar located between a pair of notches therein.

Claim 32

The lead frame of claim 28, further comprising a layer of electrically insulative material bonded to the underside of a portion of said lead frame configured to overlie said semiconductor die.

Claim 33

The lead frame of claim 28, wherein said layer of insulative material bonded to the underside of said lead frame is bonded to the underside of said bus bar.

Claim 34

The lead frame of claim 28, wherein said layer of insulative material bonded to the underside of said lead frame is bonded to the underside of lead fingers.

Claim 35

The lead frame of claim 28, further comprising bonding sites on said bus bar, said sites free of insulative material.

Claim 36

The lead frame of claim 28, wherein said lead frame is reproduced as a plurality of lead frames on a continuous tape.

Claim 39

The method of claim 34, wherein said step of bonding a layer of electrically insulative material comprises applying a layer of flowable polymeric insulative material onto said upper surface.

Claim 40

The method of claim 35, further comprising the step of: preventing the layer of flowable polymeric insulative material from flowing along said upper surface.

Claim 41

The method of claim 36, wherein the layer of flowable polymeric insulative material is prevented from flowing along said upper surface of said bus bar by said at least two notches therein.