Process for high resolution photoimageable dielectric

Claim 1

A circuitized structure comprising: a. a substrate having a first layer of circuitization upon the substrate; b. a cured, hydrophobic, photoimaged, dielectric film having a replicate surface, the dielectric film disposed on the substrate, the dielectric film comprising: i. from about 10 to 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to 130,000; ii. from about 20 to 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to 10,000; iii. from 0 to 50% of a halogenated diglycidyl ether of bisphenol A having a molecular weight of from about 600 to 2,500; and iv. less than 15% of a cationic photoinitiator; and less than about 8% solvent; c. photopatterned via holes or photopatterned through holes, disposed in the dielectric film, said vias or through holes having a diameter of less than about 10 mils; d. a second layer of circuitization, plated on, and adherent to the replicate surface of the dielectric film, the circuitization on the dielectric film being electrically connected to the circuitization disposed on the substrate by the photopatterned vias; wherein the second layer of circuitization has an adhesion value to the dielectric film of at least about 2 lbs/inch.