US5028513A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing printed circuit board
Assignee: Hitachi Ltd
•
Filing: 1989-04-13
•
Granted: 1991-07-02
•
Expires: 2009-04-13
Abstract
Abstract The present invention provide a process for producing printed circuit boards which comprises the steps of (a) roughening a surface of a copper layer formed on an insulating board. (b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the copper layer except the circuit-corresponding portion thereof.
Inventors
- 👤 Kanji Murakami
- 👤 Mineo Kawamoto
- 👤 Akio Tadokoro
- 👤 Haruo Akahoshi
- 👤 Toshikazu Narahara
- 👤 Ritsuji Toba
- 👤 Toshiaki Ishimaru
- 👤 Nobuyuki Hayashi
- 👤 Motoyo Wajima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:27
CPC Classifications
H; H05; H05K; H05K1/00; H05K3/00; H05K3/22; H05K3/28; H05K3/282; H05K3/10; H05K3/108; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0591; H05K2203/07; H05K2203/0703; H05K2203/072; H05K2203/11; H05K2203/1105; H05K2203/12; H05K2203/122; H05K2203/124; H05K3/0073; H05K3/0076; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/38; H05K3/382; H05K3/383
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
103 words
A process for producing printed circuit boards which comprises the steps of (a) roughening a surface of a copper layer formed on an insulating board, (b) coating the roughed surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the copper layer except the circuit-corresponding portion thereof.
Claim 2
Dependent Claim
103 words
A process for producing printed circuit boards which comprises the steps of (a) roughening a surface of a copper layer formed on an insulating board, (b) coating the roughed surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the copper layer except the circuit-corresponding portion thereof.
Claim 3
Dependent Claim
36 words
The process of claim 1, wherein the sublimable copper corrosion inhibitor is selected from the group consisting of benzotriazole, methylbenzotriazole, benzoguanamine, guanidine, 1-cyanoguanidine, thiazole, thiourea, 2-quinolylamine, 1,1'-azonaphthalene, dicyclohexylamine nitrite, diisopropylammonium benzoate, cyclohexylamine benzoate, and dicyclohexylammonium cyclohexanecarboxylate.
Claim 4
Dependent Claim
25 words
The process of claim 1, wherein the heat treatment in the step (c) is conducted at a temperature where the plating-resist coats do not deform.
Claim 5
Dependent Claim
31 words
The process of claim 1, wherein the heat treatment in the step (c) is conducted at a temperature of 100° to 180° C. for a period of 1 to 2 hours.
Claim 6
Dependent Claim
36 words
The process of claim 1, wherein the removal of the copper layer except its circuit pattern portion, in the step (f) is carried out after the copper circuit pattern has been covered with a etching-resist layer.
Claim 7
Dependent Claim
128 words
A process for producing printed circuit boards which comprises the steps of (a) roughening of a copper layer formed on an insulating board, and covering the roughened surface with a thin film of metal having a more negative reduction potential of oxide than that of copper, (b) coating the thin metal film surface with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portions of the thin metal film, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the thin metal film and the copper layer except their circuit-corresponding portion.
Claim 8
Dependent Claim
128 words
A process for producing printed circuit boards which comprises the steps of (a) roughening of a copper layer formed on an insulating board, and covering the roughened surface with a thin film of metal having a more negative reduction potential of oxide than that of copper, (b) coating the thin metal film surface with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portions of the thin metal film, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the thin metal film and the copper layer except their circuit-corresponding portion.
Claim 9
Dependent Claim
35 words
The process of claim 6, wherein the sublimable copper-corrosion inhibitor is selected from the group consisting of benzotriazole, methylbenzotriazole, benzoguanamine, guanidine, 1-cyanoguanidine, thiazole, thiourea, 2-quinolylamine, 1,1'-azonaphthalene, dicyclohexylamine nitrite, diisopropylammonium benzoate, cyclohexylamine benzoate, and dicyclohexylammonium cyclohexanecarboxylate.
Claim 10
Dependent Claim
26 words
The process of claim 6, wherein the heat treatment in the step (c) is conducted at a temperature where the plating resist coats do not deform.
Claim 11
Dependent Claim
31 words
The process of claim 6, wherein the heat treatment in the step (c) is conducted at a temperature of 100° to 180° C. for a period of 1 to 2 hours.
Claim 12
Dependent Claim
41 words
The process of claim 6, wherein the removal of the copper layer and the thin metal film except their circuit pattern portions, in the step (f), is carried out after the copper circuit pattern has been covered with a etching-resist layer.
Claim 13
Dependent Claim
114 words
A process for producing printed circuit boards which comprises the steps of (a) roughening a surface of a copper layer formed on an insulating board, and oxidizing and then reducing the roughened surface of copper layer, (b) coating the treated surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to the circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portion of the copper layer, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the copper layer except the circuit-corresponding portion thereof.
Claim 14
Dependent Claim
114 words
A process for producing printed circuit boards which comprises the steps of (a) roughening a surface of a copper layer formed on an insulating board, and oxidizing and then reducing the roughened surface of copper layer, (b) coating the treated surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to the circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portion of the copper layer, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the copper layer except the circuit-corresponding portion thereof.
Claim 15
Dependent Claim
35 words
The process of claim 11, wherein the sublimable copper-corrosion inhibitor is selected from the group consisting of benzotriazole, methylbenzotriazole, benzoguanamine, guanidine, 1-cyanoguanidine, thiazole, thiourea, 2-quinolylamine, 1,1'-azonaphthalene, dicyclohexylamine nitrite, diisopropylammonium benzoate, cyclohexylamine benzoate, and dicyclohexylammonium cyclohexanecarboxylate.
Claim 16
Dependent Claim
25 words
The process of claim 11, wherein the heat treatment in the step (c) is conducted at a temperature where the plating-resist coats do not deform.
Claim 17
Dependent Claim
31 words
The process of claim 11, wherein the heat treatment in the step (c) is conducted at a temperature of 100° to 180° C. for a period of 1 to 2 hours.
Claim 18
Dependent Claim
36 words
The process of claim 11, wherein the removal of the copper layer except its circuit pattern portion, in the step (f) is carried out after the copper circuit pattern has been covered with a etching-resist layer.
Claim 19
Dependent Claim
140 words
A process for producing printed circuit boards which comprises the steps of (a) Roughening a surface of a copper layer formed on an insulating board, oxidizing and then reducing the roughened surface of copper layer, and covering the treated surface with a thin film of metal having a normal negative reduction potential of oxide than that of copper, (b) coating the thin metal film surface with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portions of the thin metal film, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the thin metal film and the copper layer except their circuit-corresponding portions.
Claim 20
Dependent Claim
140 words
A process for producing printed circuit boards which comprises the steps of (a) Roughening a surface of a copper layer formed on an insulating board, oxidizing and then reducing the roughened surface of copper layer, and covering the treated surface with a thin film of metal having a normal negative reduction potential of oxide than that of copper, (b) coating the thin metal film surface with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist, thereby forming plating-resist coats on circuit-negative pattern portions of the thin metal film, (c) heat-treating the plating-resist coats, (d) plating chemically the circuit-corresponding portion with copper, (e) removing the plating-resist coats, and (f) removing the thin metal film and the copper layer except their circuit-corresponding portions.
Claim 21
Dependent Claim
35 words
The process of claim 16, wherein the sublimable copper-corrosion inhibitor is selected from the group consisting of benzoytriazole, tolyltriazole, benzoguanamine, guanidine, 1-cyanoguanidine, thiazole, thiourea, 2-quinolylamine, 1,1'-azonaphthalene, dicyclohexylamine nitrite, diisopropylammonium benzoate, cyclohexylamine benzoate, and dicyclohexylammonium cyclohexanecarboxylate.
Claim 22
Dependent Claim
25 words
the process of claim 16, wherein the heat treatment in the step (c) is conducted at a temperature where the plating-resist coats do not deform.
Claim 23
Dependent Claim
31 words
The process of claim 16, wherein the heat treatment in the step (c) is conducted at a temperature of 100° to 180° C. for a period of 1 to 2 hours.
Claim 24
Dependent Claim
43 words
the process of claim 16, wherein the removal of the copper layer and the thin metal film except their circuit pattern portions, in the step (f), is carried out after copper circuit pattern has been covered with a layer of etching-resist for copper.
Claim 25
Dependent Claim
58 words
The process of claim 1, wherein the heat-treating of the plating-resist coats is effected at a temperature and for a period of time sufficient to cause partial removal of the sublimable copper-corrosion inhibitor from the plating-resist coats whereby elution of the copper-corrosion inhibitor into a chemical plating solution for effecting the chemical plating with copper in step (d).
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-01 | 1994-12-31 | 1995-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-01 | 1998-12-31 | 1999-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-01 | 2002-12-31 | 2003-07-02 | $7700.00 | Window Closed / Lapsed |