US3854973A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making additive printed circuit boards
Assignee: MacDermid Inc
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Filing: 1972-08-16
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Granted: 1974-12-17
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Expires: 1992-08-16
Abstract
Abstract Substrates are disclosed for use in forming printed circuit boards by the additive process, in which the surface of the substrate is contacted with a particular class of solvents, activated for electroless deposition of the metal thereon, and at one or more points in the process the board is heated or baked.
Inventors
- 👤 J Grunwald
- 👤 W Innes
- 👤 M Mersereau
- 👤 H Rhodenizer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 12:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/2086; H05K3/10; H05K3/108; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783; H05K2203/11; H05K2203/1105; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/18; H05K3/181; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31942; Y10T428/31949; Y10T428/31957
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
79 words
AN ARTICLE OF MANUFACTURING COMPRISING A SUBSTRATE MEMBER ACTIVATED FOR DIRECT PLATING WITH METAL BY IMMERSION IN AN ELECTROLESS METAL PLATING BATH TO PROVIDE AN ADHERENT METAL DEPOSIT THEREON, WHEREIN SAID SUBSTRATE MEMBER IS COMPOSED OF A MOLDED POLYMERIZED THERMOSET RESIN, SAID MEMBER BEING PREPARED BY: A. CONTACTING THE SURFACE OF THE SUBSTRATE MEMBER WITH A DIPOLAR APROTIC ORGANIC LIQUID SOLVENT OF THE GROUP CONSISTING OF COMPOSTIONS I, II AND III, WHEREIN COMPOSITIONS I ARE THOSE HAVING THE FORMULA:
Claim 2
Dependent Claim
79 words
AN ARTICLE OF MANUFACTURING COMPRISING A SUBSTRATE MEMBER ACTIVATED FOR DIRECT PLATING WITH METAL BY IMMERSION IN AN ELECTROLESS METAL PLATING BATH TO PROVIDE AN ADHERENT METAL DEPOSIT THEREON, WHEREIN SAID SUBSTRATE MEMBER IS COMPOSED OF A MOLDED POLYMERIZED THERMOSET RESIN, SAID MEMBER BEING PREPARED BY: A. CONTACTING THE SURFACE OF THE SUBSTRATE MEMBER WITH A DIPOLAR APROTIC ORGANIC LIQUID SOLVENT OF THE GROUP CONSISTING OF COMPOSTIONS I, II AND III, WHEREIN COMPOSITIONS I ARE THOSE HAVING THE FORMULA:
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-16 | 1978-06-17 | 1978-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-16 | 1982-06-17 | 1982-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-16 | 1986-06-17 | 1986-12-17 | $7700.00 | Window Closed / Lapsed |