Patent US5986339A successfully refreshed from Google Patents.
US5986339A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Laminated multilayer substrates
Assignee: General Dynamics Information Systems Inc
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Filing: 1998-07-14
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Granted: 1999-11-16
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Expires: 2018-07-14
Abstract
Abstract A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
Inventors
- 👤 Deepak K. Pai
- 👤 Ronald R. Denny
- 👤 Jeanne M. Chevalier
- 👤 George F. Schwartz, III
- 👤 Clark F. Webster
- 👤 Robert M. Lufkin
- 👤 Terrance A. Krinke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H10; H10D; H10D64/00; H10D64/01; H10D64/011; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/0959; H05K2201/096; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/15; H05K2203/1572; H05K3/0094; H05K3/4623; H05K3/4644; H05K3/4647; H10W; H10W80/00; H10W80/301
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
265 words
A multilayer package comprising a plurality of interconnected large-layer-count (LLC) substrates, comprising: a first LLC substrate having top and bottom surfaces; a first conductive pad on the top surface of the first LLC substrate; a second conductive pad on the bottom surface of the first LLC substrate opposite the first pad; a first via in the first LLC substrate, extending through the first LLC substrate between the first and second pads of the first LLC substrate, the first via including conductive material to contact the first and second pads of the first LLC substrate; a first post on the first pad over the first via of the first LLC substrate; a second LLC substrate having top and bottom surfaces; a third conductive pad on the top surface of the second LLC substrate; a fourth conductive pad on the bottom surface of the second LLC substrate opposite the third pad; a second via in the second LLC substrate, extending through the second LLC substrate between the third and fourth pads of the second LLC substrate, the second via including conductive material to contact the third and fourth pads of the second LLC substrate; a second post on the third pad over the second via of the second LLC substrate, the second post confronting and abutting the first post and being electrically bonded to the first post; and a non-flowable adhesive film bonded to the top surfaces of the first and second LLC substrates, the adhesive film having an aperture receiving the first and second posts, the film mechanically bonding to the first and second LLC substrates.
Claim 2
Dependent Claim
265 words
A multilayer package comprising a plurality of interconnected large-layer-count (LLC) substrates, comprising: a first LLC substrate having top and bottom surfaces; a first conductive pad on the top surface of the first LLC substrate; a second conductive pad on the bottom surface of the first LLC substrate opposite the first pad; a first via in the first LLC substrate, extending through the first LLC substrate between the first and second pads of the first LLC substrate, the first via including conductive material to contact the first and second pads of the first LLC substrate; a first post on the first pad over the first via of the first LLC substrate; a second LLC substrate having top and bottom surfaces; a third conductive pad on the top surface of the second LLC substrate; a fourth conductive pad on the bottom surface of the second LLC substrate opposite the third pad; a second via in the second LLC substrate, extending through the second LLC substrate between the third and fourth pads of the second LLC substrate, the second via including conductive material to contact the third and fourth pads of the second LLC substrate; a second post on the third pad over the second via of the second LLC substrate, the second post confronting and abutting the first post and being electrically bonded to the first post; and a non-flowable adhesive film bonded to the top surfaces of the first and second LLC substrates, the adhesive film having an aperture receiving the first and second posts, the film mechanically bonding to the first and second LLC substrates.
Claim 3
Dependent Claim
14 words
The multilayer package of claim 1, wherein the non-flowable adhesive film comprises B-stage material.
Claim 4
Dependent Claim
19 words
The multilayer package of claim 2, wherein a perimeter of the aperture in the non-flowable adhesive film is pre-cured.
Claim 5
Dependent Claim
25 words
The multilayer package of claim 1, wherein each of the first and second posts includes a layer of low-temperature solder bonded together by reflowed solder.
Claim 6
Dependent Claim
25 words
The multilayer package of claim 1, wherein each of the first and second posts includes a layer of a metal alloy bonded together by diffusion.
Claim 7
Dependent Claim
16 words
The multilayer package of claim 1, including an epoxy material in the first and second vias.
References Cited (Backward Citations)
US4612083A
Cited
US4814855A
Cited
US4829375A
Cited
US4818728A
Cited
US4813129A
Cited
US5459634A
Cited
US5196371A
Cited
US5384952A
Cited
US5146674A
Cited
US5426850A
Cited
US5176771A
Cited
US5213511A
Cited
US5276955A
Cited
US5357674A
Cited
US5378869A
Cited
US5483100A
Cited
US5355283A
Cited
US5640051A
Cited
US5625232A
Cited
US5739588A
Cited
US5530288A
Cited
US5717247A
Cited
US5714794A
Cited
US5783865A
Cited
US5847466A
Cited
US5764485A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-15 | 2003-05-17 | 2003-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-15 | 2007-05-17 | 2007-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-15 | 2011-05-17 | 2011-11-16 | $7700.00 | Window Closed / Lapsed |