US5146674A
Expired / Lapsed
US
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Manufacturing process of a high density substrate design
Assignee: International Business Machines Corp
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Filing: 1991-07-01
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Granted: 1992-09-15
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Expires: 2011-07-01
Abstract
Abstract Substrate layers with individual bumps and cavities are provided which can be manufactured and tested in parallel and then joined into a multilayer substrate. The method of manufacturing these layers, as contemplated by the present invention, includes initially forming a plurality of vias in a layer of electrically conductive material. Next, a dielectric material, is placed adjacent the layer of conductive material. Holes which are coaxial with the vias are then formed in the dielectric material. Electrically conductive material is then deposited within the vias, thereby forming a conductive stud. Additional electrically conductive material is then deposited, on the side of the dielectric opposite the conductive material to form a signal layer, as well projections of electrically conductive material extending from the studs. A continuous layer of dielectric material is then placed adjacent the side of the substrate opposite the projections. A portion of this layer, adjacent the stud, is then removed, thereby exposing the stud and forming a cavity. The substrate layers can then be joined to form a multilayer substrate module.
Inventors
- 👤 Richard F. Frankeny
- 👤 Karl Hermann
- 👤 Ronald L. Imken
- 👤 Joseph LaTorre
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 16:46
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K3/44; H05K3/445; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09318; H05K2201/095; H05K2201/09554; H05K2201/09563; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/06; H05K2203/066; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/10; H05K3/20; H05K3/205; H05K3/40; H05K3/42; H05K3/423; H05K3/4641; H05K3/4644; H05K3/4647; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
130 words
A method of producing a high density one signal layer, one reference plane substrate for use in an electronic component, said method comprising the steps of: coating a first side of an etched metal foil layer with a first dielectric layer and forming a plurality of via holes in said metal foil layer; placing electrically conductive material within said via holes to form a plurality of studs; placing a signal layer on a surface of said first dielectric layer opposite said metal foil; forming projections by extending said studs outwardly past said signal layer in a direction away from said foil layer; and applying a second dielectric layer to a side of said foil opposite said first dielectric layer, and forming a plurality of cavities therein aligned with said studs.
Claim 2
Independent Claim
130 words
A method of producing a high density one signal layer, one reference plane substrate for use in an electronic component, said method comprising the steps of: coating a first side of an etched metal foil layer with a first dielectric layer and forming a plurality of via holes in said metal foil layer; placing electrically conductive material within said via holes to form a plurality of studs; placing a signal layer on a surface of said first dielectric layer opposite said metal foil; forming projections by extending said studs outwardly past said signal layer in a direction away from said foil layer; and applying a second dielectric layer to a side of said foil opposite said first dielectric layer, and forming a plurality of cavities therein aligned with said studs.
Claim 3
Dependent Claim
34 words
A method according to claim 1 further comprising the steps of: prior to coating the metal foil, etching clearance holes within the metal foil layer and filling said clearance holes with a dielectric material.
Claim 4
Dependent Claim
26 words
A method according to claim 2 further comprising the step of applying joining metallurgy material onto an exposed end of said projections and within said cavities.
Claim 5
Dependent Claim
35 words
A method according to claim 3 wherein said step of filling the clearance holes comprises the step of laminating a second metal foil layer to a side of the metal foil opposite said first side.
Claim 6
Dependent Claim
73 words
A method according to claim 4 wherein said step of forming a plurality of via holes, comprises the steps of, forming a first set of said via holes, having a diameter less than said clearance holes and coaxial therewith, to create an annular portion of the dielectric material filled in said clearance holes; and forming a second set of said via holes such that a portion of the reference plane layer is exposed.
Claim 7
Dependent Claim
68 words
A method according to claim 5 wherein the step of placing electrically conductive material comprises the steps of: plating metal within the first set of said via holes, thereby forming vias electrically isolated from said reference plane layer by said annular portion of dielectric material, and concurrently plating metal within the second set of said via holes, thereby forming vias in electrical communication with said reference plane layer.
Claim 8
Dependent Claim
102 words
A method according to claim 6 wherein said step of placing said signal layer comprises the steps of: depositing a metal layer, adjacent said vias, on a surface of said first dielectric material opposite said metal foil; applying a first layer of photoresist material adjacent said metal layer and a second photoresist layer on a side of said second metal foil layer opposite said first metal foil layer; forming a set of openings in said first photoresist layer; plating electrically conductive material into said openings, thereby forming electric signal lines included within said signal layer; and removing said first layer of photoresist.
Claim 9
Dependent Claim
70 words
A method according to claim 7 wherein said step of forming projections comprises the steps of: applying a third layer of photoresist material adjacent said metal layer; forming a set of openings in said third photoresist layer, aligned with said studs; plating electrically conductive material in said openings, thereby extending said studs in a direction opposite said first metal foil; and removing said second and third layers of photoresist material.
Claim 10
Dependent Claim
52 words
A method according to claim 8 wherein said step of forming a plurality of cavities comprises the step of forming said cavities coaxial with said studs and opposite said projections, thereby exposing an end of said isolated vias and a portion of said first metal foil, directly opposite sad reference plane vias.
Claim 11
Dependent Claim
26 words
A method according to claim 9 wherein said step of applying joining metallurgy comprises the step of reflowing said joining metallurgy to create convex configurations thereof.
Claim 12
Dependent Claim
28 words
A method according to claim 10 further comprising the step of removing remaining exposed portions of said metal layer deposited during the step of depositing a metal layer.
Claim 13
Dependent Claim
28 words
A method according to claim 3 wherein said step of applying joining metallurgy comprises electroplating said metallurgy onto the exposed end of said projections and within said cavities.
Claim 14
Independent Claim
136 words
A method of producing a multilayer substrate having a plurality of individual one signal, one reference plane substrates, said method comprising the steps of: providing a plurality of said individual substrates, each having a first surface with a plurality of electrical interconnection cavities and a second surface with a corresponding plurality of electrical interconnection projections; applying a layer of joining material to said first surface of said individual substrates; depositing joining metallurgy within said cavities and on an exposed end of said projection; and stacking said individual substrates, such that said plurality of projections of a first individual substrate are in vertical alignment with said plurality of cavities in an adjacent individual substrate, said step of stacking including compressing said stacked individual substrates, laminating said individual layers, reflowing said joining metallurgy and curing said joining material.
Claim 15
Independent Claim
136 words
A method of producing a multilayer substrate having a plurality of individual one signal, one reference plane substrates, said method comprising the steps of: providing a plurality of said individual substrates, each having a first surface with a plurality of electrical interconnection cavities and a second surface with a corresponding plurality of electrical interconnection projections; applying a layer of joining material to said first surface of said individual substrates; depositing joining metallurgy within said cavities and on an exposed end of said projection; and stacking said individual substrates, such that said plurality of projections of a first individual substrate are in vertical alignment with said plurality of cavities in an adjacent individual substrate, said step of stacking including compressing said stacked individual substrates, laminating said individual layers, reflowing said joining metallurgy and curing said joining material.
Claim 16
Dependent Claim
17 words
A method according to claim 13 wherein said joining material is a thermoset or a thermoplastic material.
Claim 17
Dependent Claim
32 words
A method according to claim 13 wherein said step of applying a layer of joining material comprises the step of applying said joining material to said second surface of said individual substrates.
Claim 18
Dependent Claim
43 words
A method according to claim 13 wherein said step of applying a layer of joining material comprises the steps of: applying joining material to said first surface of said individual substrates; and applying joining material to said second surface of said individual substrates.
Claim 19
Dependent Claim
29 words
A method according to claim 13 wherein said step of depositing joining metallurgy comprises electroplating said joining metallurgy on the exposed end of said projections and within said cavities.
References Cited (Backward Citations)
US3436819A
Cited
US3546775A
Cited
US3606677A
Cited
DE1951778A1
Cited
US3890177A
Cited
US3795047A
Cited
US4074342A
Cited
US4191789A
Cited
US4285780A
Cited
US4496793A
Cited
US4954458A
Cited
US4622058A
Cited
US4736521A
Cited
US4617730A
Cited
US4685033A
Cited
US4663840A
Cited
US4683653A
Cited
US4721831A
Cited
US4908940A
Cited
US4882454A
Cited
US4963697A
Cited
US4967314A
Cited
JPH0220380A
Cited
US4991285A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-15 | 1996-03-16 | 1996-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-15 | 2000-03-16 | 2000-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-15 | 2004-03-16 | 2004-09-15 | $7700.00 | Window Closed / Lapsed |