Multi-layer PCB blockade-via pad-connection

Abstract

Abstract A special so called BLOCKADE-Via™ apparatus and technique for more efficient circuiting and assembly of electronic components on a multilayer parallel-conductivity "printed-circuit board" employing high-density conductor-pins and solder-ball construction. A BGA(ball-grid array) component may be placed upon pads employing a array of special blocked-vias, thereby enabling any given ML/PCB design to option other circuit-path routings from each individual via pad. A special via cap is set forth, which may be employed in combination with a special occluding lower-layer of the ML/PCB substrate. Thus, additional discrete circuiting may also be installed upon the opposite side of the ML/PCB, an advantageous function facilitating assembly of two or more parallel-layered circuits, whereby former offset open-vias can be eliminated by employment of a special array of vias drilled to selective depths vertically-aligned directly below the BGA pads for example. Volume assembly processing of this special ML/PCB is easily handled by existing production-facility equipment and procedures;--the resulting blocked-vias being less critical to make, exhibit superior conductivity, while offering approximately 30% greater via density (or conversely, ML/PCB area-reduction). The disclosure also features a special high-efficiency hexagonally shaped via-pad having honeycomb interstitial spacing; as well as a special crisscrossed via-pad for improved electrical flow.

Inventors

• 👤 Ali Lebaschi

Bibliographic Details