US5981312A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for injection molded flip chip encapsulation
Assignee: GlobalFoundries Inc
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Filing: 1997-06-27
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Granted: 1999-11-09
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Expires: 2017-06-27
Abstract
Abstract The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
Inventors
- 👤 Donald Seton Farquhar
- 👤 Michael Joseph Klodowski
- 👤 Konstantinos Papathomas
- 👤 James Robert Wilcox
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:36
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W72/00; H10W72/30; H10W74/01; H10W74/012; H10W74/15; H10W76/00; H10W76/01; H10W76/05; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/071; H10W72/072; H10W72/073; H10W72/90; H10W72/941; H10W72/9415; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
134 words
A method for encapsulating and reinforcing the electrical interconnections of an integrated circuit chip assembly, comprising the steps of: providing a substrate having an opening extending from a remote surface of said substrate to a mounting surface of said substrate and an integrated circuit chip having an attachment surface and a remote surface; said attachment surface of said integrated circuit chip being attached above said opening to said mounting surface of said substrate in a standoff relationship thereby defining a space therebetween, said space having a height of about 0.002 to 0.006 inches; providing a volume of an encapsulant necessary to at least fill said space; dispensing said volume of said encapsulant through said opening into said space; and curing said encapsulant to form a bond between said substrate and said integrated circuit chip.
Claim 2
Independent Claim
134 words
A method for encapsulating and reinforcing the electrical interconnections of an integrated circuit chip assembly, comprising the steps of: providing a substrate having an opening extending from a remote surface of said substrate to a mounting surface of said substrate and an integrated circuit chip having an attachment surface and a remote surface; said attachment surface of said integrated circuit chip being attached above said opening to said mounting surface of said substrate in a standoff relationship thereby defining a space therebetween, said space having a height of about 0.002 to 0.006 inches; providing a volume of an encapsulant necessary to at least fill said space; dispensing said volume of said encapsulant through said opening into said space; and curing said encapsulant to form a bond between said substrate and said integrated circuit chip.
Claim 3
Dependent Claim
29 words
The method of claim 1 wherein said attachment surface of said integrated circuit chip is attached to said mounting surface of said substrate using a plurality of solder balls.
Claim 4
Dependent Claim
27 words
The method of claim 2 wherein said encapsulant comprises a thermosetting polymer having a viscosity in the range of about 10 to 1,000 Pascal-seconds at dispense temperature.
Claim 5
Dependent Claim
12 words
The method of claim 3 wherein said substrate comprises a chip carrier.
Claim 6
Dependent Claim
12 words
The method of claim 3 wherein said substrate comprises a circuit board.
Claim 7
Dependent Claim
20 words
An integrated circuit chip assembly produced according to the method of any of claims 1, 2, 3, 4 or 5.
Claim 8
Independent Claim
192 words
A method for encapsulating and reinforcing the electrical interconnections of an integrated circuit chip assembly, comprising the steps of: providing a substrate having an opening extending from a remote surface of said substrate to a mounting surface of said substrate and an integrated circuit chip having an attachment surface and a remote surface; said attachment surface of said integrated circuit chip being attached above said opening to said mounting surface of said substrate in a standoff relationship thereby defining a space therebetween, said space having a height of about 0.002 to 0.006 inches; placing a mold over said integrated circuit chip, said mold having at least one vent extending from an inner surface of said mold to an outer surface of said mold, said inner surface of said mold facing said remote surface of said integrated circuit chip in a standoff relationship, thereby defining a void; providing a volume of an encapsulant necessary to substantially fill said space and said void; dispensing said volume of said encapsulant through said opening into said space and said void; and curing said encapsulant to form a bond between said substrate and said integrated circuit chip.
Claim 9
Independent Claim
192 words
A method for encapsulating and reinforcing the electrical interconnections of an integrated circuit chip assembly, comprising the steps of: providing a substrate having an opening extending from a remote surface of said substrate to a mounting surface of said substrate and an integrated circuit chip having an attachment surface and a remote surface; said attachment surface of said integrated circuit chip being attached above said opening to said mounting surface of said substrate in a standoff relationship thereby defining a space therebetween, said space having a height of about 0.002 to 0.006 inches; placing a mold over said integrated circuit chip, said mold having at least one vent extending from an inner surface of said mold to an outer surface of said mold, said inner surface of said mold facing said remote surface of said integrated circuit chip in a standoff relationship, thereby defining a void; providing a volume of an encapsulant necessary to substantially fill said space and said void; dispensing said volume of said encapsulant through said opening into said space and said void; and curing said encapsulant to form a bond between said substrate and said integrated circuit chip.
Claim 10
Dependent Claim
29 words
The method of claim 7 wherein said attachment surface of said integrated circuit chip is attached to said mounting surface of said substrate using a plurality of solder balls.
Claim 11
Dependent Claim
27 words
The method of claim 8 wherein said encapsulant comprises a thermosetting polymer having a viscosity in the range of about 10 to 1,000 Pascal-seconds at dispense temperature.
Claim 12
Dependent Claim
12 words
The method of claim 9 wherein said substrate comprises a chip carrier.
Claim 13
Dependent Claim
12 words
The method of claim 9 wherein said substrate comprises a circuit board.
Claim 14
Dependent Claim
20 words
An integrated circuit chip assembly produced according to the method of any of claims 7, 8, 9, 10 or 11.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-08 | 2003-05-10 | 2003-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-08 | 2007-05-10 | 2007-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-08 | 2011-05-10 | 2011-11-09 | $7700.00 | Window Closed / Lapsed |