EP0690499A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Paddleless molded plastic semiconductor chip package
Assignee: Digital Equipment Corp
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Filing: 1995-06-29
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Granted: —
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Expires: 2015-06-29
Abstract
Abstract A semiconductor package and method in which a semiconductor chip is mounted within an opening of a lead frame by bonding wires extending between an active front side of the chip and bonding pads of the lead frame; the lead frame/chip assembly is encased within a plastic molded body, with an inactive back surface of the semiconductor chip exposed and facing outside the package.
Inventors
- 👤 William Riis Hamburgen
- 👤 Yezdi Naval Dordi
- 👤 John Stuart Fitch
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 16:56
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/475; H10W74/10; H10W74/111; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852; H10H20/853; H10H20/858; H10W74/131; H10W74/142; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
104 words
A molded plastic semiconductor chip package including a semiconductor chip, comprising: a leadframe having an opening therein, a semiconductor chip having an active front side and a nonactive back surface, with lateral dimensions smaller than those of the lead frame opening, positioned within said opening with the nonactive back surface of the chip fully unsupported by said lead frame, bonding-wires extending between the active front side of the chip and bonding pads carried by the lead frame, and a molded plastic body encasing said lead frame and said semiconductor chip with the nonactive back surface of said chip exposed and facing outside the package.
Claim 2
Dependent Claim
25 words
The semiconductor package of Claim 1 wherein the back surface of the semiconductor chip is flush with the back surface of the molded plastic body.
Claim 3
Dependent Claim
25 words
The semiconductor package of Claim 1 including a heat sink attached to said package in intimate contact with the exposed backside of said semiconductor chip.
Claim 4
Dependent Claim
16 words
The semiconductor package of Claim 1 wherein the molded plastic body includes a stress relief feature.
Claim 5
Dependent Claim
18 words
The semiconductor package of Claim 4 wherein said stress relief feature is a ring of lead frame material.
Claim 6
Dependent Claim
22 words
The semiconductor package of Claim 4 wherein the stress relief feature is a notch in the back surface of the plastic body.
Claim 7
Dependent Claim
23 words
The semiconductor package of Claim 4 wherein the stress relief feature is a relief notch in the top side of the plastic body.
Claim 8
Dependent Claim
22 words
The semiconductor package of Claim 4 wherein the stress relief feature is an insert in the top side of the plastic body.
Claim 9
Dependent Claim
16 words
The semiconductor package of Claim 8 wherein said insert is selected from silicon, metal, and ceramic.
Claim 10
Dependent Claim
18 words
The semiconductor package of Claim 8 wherein said insert is a capacitor electrically connected to the semiconductor chip.
Claim 11
Dependent Claim
23 words
The semiconductor package of Claim 4 wherein said stress relief feature comprises a cover bonded to at least one side of the package.
Claim 12
Dependent Claim
43 words
The semiconductor package of Claim 4 wherein said stress relief feature comprises relief notches in both the top side and back surface of the plastic body, so as to expose both the active front side and non-active back surface of the semiconductor chip.
Claim 13
Independent Claim
115 words
A method of forming a molded plastic semiconductor chip package comprising: positioning a semiconductor chip, having an active front side and a nonactive back surface, within an opening of a lead frame, said opening having lateral dimensions greater than those of the chip, attaching bonding wires between the active front side of the chip and bonding pads carried by the lead frame, holding said chip and said lead frame within a package mold by supporting the back surface of said chip, and forming a plastic body within said mold to encase said chip and said lead frame while leaving a substantial portion of the back surface of said chip exposed and facing outside the package.
Claim 14
Dependent Claim
26 words
The method of Claim 13 wherein the semiconductor chip is positioned within an opening of a lead frame by mounting said chip on a vacuum pedestal.
Claim 15
Dependent Claim
25 words
The method of Claim 13 wherein the backside of said chip is held within a package mold by supporting said chip on a vacuum pedestal.
References Cited (Backward Citations)
No citation records indexed.
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