Patent US5972154A successfully refreshed from Google Patents.
US5972154A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods of dicing flat workpieces
Assignee: Sony Corp
•
Filing: 1996-06-27
•
Granted: 1999-10-26
•
Expires: 2016-06-27
Abstract
Abstract The present invention pertains to methods for dicing wafers which are capable of easily removing chips of an adhesive of a dicing tape adhering on the wafer during dicing by cleaning using cleaning water. One method of dicing a wafer includes sticking an adhesive member having a layer of adhesive on a surface of the wafer. An adhesive force of the adhesive member is reduced along a plurality of dicing lines on the wafer without reducing the adhesive force of the adhesive member between the plurality of dicing lines. After the adhesive force is reduced along the dicing lines, the wafer is diced along the plurality of dicing lines into a plurality of parts by a blade.
Inventors
- 👤 Tomonori Konya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 12:37
CPC Classifications
B; B81; B81C; B81C1/00; B81C1/00865; B81C1/00888; B23; B23P; B23P25/00; B23P25/003; B28; B28D; B28D5/00; B28D5/0058; H; H10; H10P; H10P52/00; H10P54/00; H10P72/00; H10P72/04; H10P72/0428; H10P72/70; H10P72/74; H10P72/7402; H10P72/7416; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1082; Y10T83/00; Y10T83/02; Y10T83/0333; Y10T83/0385; Y10T83/04; Y10T83/0405
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
104 words
A method of dicing a flat workpiece, comprising the steps of: sticking an adhesive member having a layer of adhesive on a first surface of said flat workpiece; reducing an adhesive force of said adhesive member along a plurality of dicing lines on said workpiece without reducing the adhesive force of said adhesive member between said plurality of dicing lines; and after said reducing an adhesive force step, perfectly dicing said workpiece along said plurality of dicing lines into a plurality of parts by a blade from a second side of said workpiece opposite said first surface on which said adhesive member is stuck.
Claim 2
Independent Claim
104 words
A method of dicing a flat workpiece, comprising the steps of: sticking an adhesive member having a layer of adhesive on a first surface of said flat workpiece; reducing an adhesive force of said adhesive member along a plurality of dicing lines on said workpiece without reducing the adhesive force of said adhesive member between said plurality of dicing lines; and after said reducing an adhesive force step, perfectly dicing said workpiece along said plurality of dicing lines into a plurality of parts by a blade from a second side of said workpiece opposite said first surface on which said adhesive member is stuck.
Claim 3
Dependent Claim
30 words
A method of dicing a flat workpiece according to claim 1, wherein said workpiece is a substrate having a second surface opposite said first surface on which elements are formed.
Claim 4
Dependent Claim
31 words
A method of dicing a flat workpiece according to claim 2, wherein said elements are selected from a group consisting of liquid crystal displays, solid state imaging devices and integrated circuits.
Claim 5
Dependent Claim
31 words
A method of dicing a flat workpiece according to claim 1, wherein said workpiece is a semiconducting substrate having a second surface opposite said first surface on which elements are formed.
Claim 6
Dependent Claim
27 words
A method of dicing a flat workpiece according to claim 4, wherein said elements are selected from a group consisting of liquid crystal displays and integrated circuits.
Claim 7
Dependent Claim
35 words
A method of dicing a flat workpiece according to claim 1, wherein said adhesive is an ultraviolet hardening adhesive in which at least said adhesive force thereof is reduced by emission of an ultraviolet ray.
Claim 8
Dependent Claim
34 words
A method of dicing a flat workpiece according to claim 1, wherein said adhesive is a thermosetting adhesive in which at least said adhesive force thereof is reduced by emission of a thermal ray.
References Cited (Backward Citations)
US2293178A
Cited
US3780777A
Cited
JPS54109376A
Cited
US4590667A
Cited
US4720317A
Cited
US4756968A
Cited
US5187007A
Cited
JPS62204542A
Cited
JPS6436350A
Cited
US5246524A
Cited
US5110388A
Cited
US4885967A
Cited
US5332406A
Cited
US5098501A
Cited
EP0431637A1
Cited
JPH04280446A
Cited
US5476565A
Cited
US5476566A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-10-25 | 2003-04-26 | 2003-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-10-25 | 2007-04-26 | 2007-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-10-25 | 2011-04-26 | 2011-10-26 | $7700.00 | Window Closed / Lapsed |