Patent JPS56106646A successfully refreshed from Google Patents.
US5476565A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dicing-die bonding film
Assignee: Nitto Denko Corp
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Filing: 1994-01-12
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Granted: 1995-12-19
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Expires: 2014-01-12
Abstract
Abstract A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm×10 mm can easily be picked up.
Inventors
- 👤 Yuzo Akada
- 👤 Koji Akazawa
- 👤 Keiji Nakamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:25
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P50/00; H10P72/7404; H10P72/7416; H10W; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24826; Y10T428/24851; Y10T428/2486; Y10T428/28; Y10T428/2809; Y10T428/2848; Y10T428/2852; Y10T428/287; Y10T428/2878; Y10T428/2887; Y10T428/2891
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
129 words
A process for dicing-die bonding comprising the steps of: bonding a semiconductor wafer to an adhesive layer of a dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, said pressure-sensitive adhesive layer having been partly ultraviolet-cured, cutting the wafer together with the adhesive layer of the dicing-die bonding film to form chips, irradiating ultraviolet light on the entire area of the ultraviolet-curable pressure-sensitive adhesive layer through the ultraviolet-transmitting substrate to reduce or eliminate the adhesiveness of the pressure-sensitive adhesive layer to the adhesive layer provided thereon, and releasing and picking up the separated chips with the adhesive layer on it from the pressure-sensitive adhesive layer and adhering the chips to an adherend via the adhesive layer.
Claim 2
Dependent Claim
129 words
A process for dicing-die bonding comprising the steps of: bonding a semiconductor wafer to an adhesive layer of a dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, said pressure-sensitive adhesive layer having been partly ultraviolet-cured, cutting the wafer together with the adhesive layer of the dicing-die bonding film to form chips, irradiating ultraviolet light on the entire area of the ultraviolet-curable pressure-sensitive adhesive layer through the ultraviolet-transmitting substrate to reduce or eliminate the adhesiveness of the pressure-sensitive adhesive layer to the adhesive layer provided thereon, and releasing and picking up the separated chips with the adhesive layer on it from the pressure-sensitive adhesive layer and adhering the chips to an adherend via the adhesive layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-18 | 1999-06-19 | 1999-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-18 | 2003-06-19 | 2003-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-18 | 2007-06-19 | 2007-12-19 | $7700.00 | Window Closed / Lapsed |