EP0134606A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Carrier film with conductive adhesive for dicing of semiconductor wafers
Assignee: Ingredion Inc
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Filing: 1984-08-02
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Granted: —
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Expires: 2004-08-02
Abstract
Abstract A dicing film to support semiconductor wafers as they are diced into individual chips comprises a support film (e.g., of thermoplastic polymer), a release layer on one side of the film, and a pattern of conductive adhesive attached to the release layer for bonding to the wafer or wafers. The release layer allows for separation of the chip/conductive adhesive combination from the support film. Preferably, the adhesive is covered by a removable release liner prior to mating of the wafer and adhesive.
Inventors
- 👤 Joseph Anthony Aurichio
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 19:07
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P95/00; B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0052; H10P50/00; H10P52/00; H10P72/04; H10P72/0442; H10P72/7404; H10P72/7416; H10W; H10W46/00; H10W46/101; H10W46/301; H10W46/501; H10W72/00; H10W72/071; H10W72/073
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
64 words
A dicing film to support semiconductor wafers when they are diced into individual chips which comprises: (a) a support film; (b) a release layer on one side of the support film; and (c) a pattern of conductive adhesive affixed to the release layer on said support film, the adhesive pattern being of a size and shape to support at least one semiconductor wafer thereon.
Claim 2
Dependent Claim
64 words
A dicing film to support semiconductor wafers when they are diced into individual chips which comprises: (a) a support film; (b) a release layer on one side of the support film; and (c) a pattern of conductive adhesive affixed to the release layer on said support film, the adhesive pattern being of a size and shape to support at least one semiconductor wafer thereon.
Claim 3
Dependent Claim
18 words
A film as claimed in Claim 1 in which the support film is formed of a polyolefin polymer.
Claim 4
Dependent Claim
13 words
A film as claimed in Claim 1 wherein the support film is polypropylene.
Claim 5
Dependent Claim
23 words
A film as claimed in Claim 1 wherein the support film has a thickness of from about 1 mil to about 6 mils.
Claim 6
Dependent Claim
15 words
A film as claimed in Claim 1 wherein the release layer comprises a silicone composition.
Claim 7
Dependent Claim
15 words
A film as claimed in Claim 1 wherein the release layer comprises a fluorocarbon composition.
Claim 8
Dependent Claim
23 words
A film as claimed in Claim 1 wherein the conductive adhesive has a thickness of from about 0.2 mil to about 1.5 mils.
Claim 9
Dependent Claim
25 words
A film as claimed in Claim 1 wherein the conductive adhesive contains an effective amount for conductivity of a conductive metal in an adhesive matrix.
Claim 10
Dependent Claim
23 words
A film as claimed in Claim 2 wherein the support film has a thickness of from about 1 mil to about 6 mils.
Claim 11
Dependent Claim
16 words
A film as claimed in Claim 9 having a release layer which comprises a silicone composition.
Claim 12
Dependent Claim
41 words
A film as claimed in Claim 10 having a conductive adhesive of a thickness of from about 0.2 mil to about 1.5 mils and wherein the adhesive contains an effective amount for conductivity of a conductive metal in an adhesive matrix.
Claim 13
Dependent Claim
19 words
A film as claimed in Claim 1 which also has a release liner over the pattern of conductive adhesive.
Claim 14
Dependent Claim
19 words
A film as claimed in Claim 11 which also has a release liner over the pattern of conductive adhesive.
Claim 15
Dependent Claim
38 words
14:. A process for forming individual chips from a semiconductor wafer which comprises: (a) attaching the wafer to the adhesive pattern carried by the dicing film of Claim 1; and (b) dicing the wafer to form said chips.
Claim 16
Dependent Claim
20 words
A process as claimed in Claim 14 wherein the wafer is placed on the adhesive by a vacuum plate assembly.
Claim 17
Dependent Claim
24 words
A process as claimed in Claim 15 wherein the vacuum plate assembly is guided by means of a registration mark on the dicing film.
Claim 18
Dependent Claim
25 words
A process as claimed in Claim 14 wherein the process also comprises removal of the chip from the film with placement in a chip carrier.
References Cited (Backward Citations)
No citation records indexed.
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