EP0253444A2
Expired / Lapsed
EP
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Method of bonding a semiconductor chip to a substrate
Assignee: National Starch and Chemical Investment Holding Corp
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Filing: 1987-07-13
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Granted: —
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Expires: 2007-07-13
Abstract
Abstract The bonding of semiconductor chips to a substrate is described wherein the first step involves the bonding of a tacky, curable and partially cured chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate. The second step involves the further partial heat curing of the adhesive to convert it to a non-tacky state so that the adhesive will not undesirably stick during handling and storage operations. Thereafter, the chip with its adherent adhesive can be mounted to a substrate at elevated temperature to convert the adhesive to a more tacky state. The final step involves the curing of the adhesive after it has been used to bond the chip to the substrate.
Inventors
- 👤 Gregory M. Sheyon
- 👤 Joseph A. Aurichio
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 09:37
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P72/7416; H10W72/01331; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1064; Y10T156/1082
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
84 words
A method of bonding a semiconductor chip to a substrate which comprises: (a) bonding a tacky, curable and partially cured, non-viscous chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate; (b) further partially heat curing the adhesive to convert it to a non-tacky state; (c) mounting the chip on the substrate at elevated temperature to change the adhesive to a more tacky state; and (d) curing of the adhesive.
Claim 2
Dependent Claim
16 words
A method as claimed in Claim 1 wherein the chip is in a semiconductor wafer configuration.
Claim 3
Dependent Claim
28 words
A method as claimed in Claim 1 wherein the chip bonding adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
Claim 4
Dependent Claim
44 words
A method as claimed in Claim 1 wherein the adhesive is transferred to the chip while the chip is in a semiconductor wafer configuration, and the wafer is scribed and then cracked into individual chips after conversion of the adhesive to a non-tacky state.
Claim 5
Dependent Claim
46 words
A method as claimed in Claim 1 wherein the adhesive is transferred to the chip while the chip is in a semiconductor wafer configuration, and the wafer/adhesive composite is mounted on a tacky adhesive wafer dicing film after the adhesive is converted to a non-tacky state.
Claim 6
Dependent Claim
17 words
A method as claimed in Claim 5 wherein the wafer is diced after mounting on the film.
Claim 7
Dependent Claim
19 words
A method as claimed in Claim 5 wherein the wafer is scribed and cracked after mounting on the film.
Claim 8
Dependent Claim
60 words
A method as claimed in Claim 1 wherein the chip is in the configuration of a semiconductor wafer, the wafer is mounted on the adhesive on the support film, the wafer is scribed and then cracked into individual chips, the resulting chips with adherent adhesive are removed from the support film, and the adhesive is converted to a non-tacky state.
Claim 9
Dependent Claim
24 words
The method of Claim 4 wherein the adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
Claim 10
Dependent Claim
24 words
The method of Claim 5 wherein the adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
Claim 11
Dependent Claim
24 words
The method of Claim 6 wherein the adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
Claim 12
Dependent Claim
24 words
The method of Claim 7 wherein the adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
Claim 13
Dependent Claim
24 words
The method of Claim 8 wherein the adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
References Cited (Backward Citations)
No citation records indexed.
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