EP0359373A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Adhesive tape and use thereof
Assignee: Lintec Corp
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Filing: 1989-07-21
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Granted: —
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Expires: 2009-07-21
Abstract
Abstract Proposed herein is an adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.
Inventors
- 👤 Mikio Komiyama
- 👤 Yasunao Miyazawa
- 👤 Kazuyoshi Ebe
- 👤 Takanori Saito
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 21:46
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; C; C09; C09J; C09J133/00; C09J133/04; C09J133/06; C09J133/08; C09J4/00; C09J4/06; C09J7/00; C09J7/10; C09J7/20; C09J7/22; C09J7/30; H10P50/00; H10P72/7402; H10P72/7416; H10P72/742; H10W; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T428/00; Y10T428/28; Y10T428/2809; Y10T428/2852; Y10T428/287; Y10T428/2878; Y10T428/2891
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
68 words
An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of said base sheet, said adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound.
Claim 2
Dependent Claim
68 words
An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of said base sheet, said adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound.
Claim 3
Independent Claim
178 words
A method for using an adhesive tape which comprises an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of said base sheet, said adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound, said method comprising the steps of adhering a semiconductor wafer to said adhesive tape, dicing said wafer to chips together with the adhesive layer of said adhesive tape, irradiating the adhesive layer of said tape with energy beam, picking up the chips together with pieces of the diced adhesive layer adhered thereto from said base sheet, placing the chips on a lead frame so that the respective pieces of the adhesive layer may come in contact with said lead frame, and causing the pieces of the diced adhesive layer to again develop tackiness by heating thereby securely mounting the chips on said lead frame.
Claim 4
Independent Claim
178 words
A method for using an adhesive tape which comprises an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of said base sheet, said adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound, said method comprising the steps of adhering a semiconductor wafer to said adhesive tape, dicing said wafer to chips together with the adhesive layer of said adhesive tape, irradiating the adhesive layer of said tape with energy beam, picking up the chips together with pieces of the diced adhesive layer adhered thereto from said base sheet, placing the chips on a lead frame so that the respective pieces of the adhesive layer may come in contact with said lead frame, and causing the pieces of the diced adhesive layer to again develop tackiness by heating thereby securely mounting the chips on said lead frame.
Claim 5
Dependent Claim
20 words
The method according to claim 2 wherein said base sheet is light transmittable, and said energy beam is ultraviolet ray.
Claim 6
Dependent Claim
18 words
The method according to claim 2 wherein the dicing step is carried out prior to the irradiating step.
Claim 7
Dependent Claim
18 words
The method according to claim 2 wherein the irradiating step is carried our prior to the dicing step,
Claim 8
Dependent Claim
53 words
The method according to claim 2 further comprising after the dicing step and before the picking up step, a step of expanding the base sheet of said tape carrying the chips together with the pieces of the diced adhesive layer in perpendicu larly intersecting two directions within the plane of said base sheet.
Claim 9
Dependent Claim
42 words
An adhesive tape comprising an adhesive layer composed of a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound.
Claim 10
Dependent Claim
42 words
An adhesive tape comprising an adhesive layer composed of a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound.
Claim 11
Independent Claim
158 words
A method for using an adhesive tape comprising an adhesive layer composed of a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound, said method comprising the steps of adhering a semi-conductor wafer to said adhesive tape formed on a release sheet, irradiating the adhesive layer with energy beam, dicing said wafer to chips together with the adhesive layer, picking up the chips together with pieces of the diced adhesive layer adhered thereto from said release sheet, placing the chips together with pieces of the diced adhesive layer adhered thereto on a lead frame so that the respective pieces of the adhesive layer may come in contact with said lead frame, and causing the pieces of the diced adhesive layer to again develop tackiness by heating thereby securely mounting the chips on said lead frame.
Claim 12
Independent Claim
158 words
A method for using an adhesive tape comprising an adhesive layer composed of a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound, said method comprising the steps of adhering a semi-conductor wafer to said adhesive tape formed on a release sheet, irradiating the adhesive layer with energy beam, dicing said wafer to chips together with the adhesive layer, picking up the chips together with pieces of the diced adhesive layer adhered thereto from said release sheet, placing the chips together with pieces of the diced adhesive layer adhered thereto on a lead frame so that the respective pieces of the adhesive layer may come in contact with said lead frame, and causing the pieces of the diced adhesive layer to again develop tackiness by heating thereby securely mounting the chips on said lead frame.
Claim 13
Dependent Claim
134 words
An adhesive composition for forming an adhesive layer which is curable by irradiation with energy beam and the so cured adhesive layer is capable of developing tackiness again by heating, said composition comprising a (meth)acrylate polymer having at least 50 mol % of units derived from at least one (meth)acrylate, from 5 to 2000 parts by weight, based on 100 parts by weight of the (meth)acrylate polymer, of an epoxy resin having a molecular weight of from 100 to 10000, from 10 to 1000 parts by weight, based on 100 parts by weight of the (meth)acrylate polymer, of a photopolymerizable low molecular weight compound having a molecular weight of from 100 to 30,000, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound.
Claim 14
Dependent Claim
134 words
An adhesive composition for forming an adhesive layer which is curable by irradiation with energy beam and the so cured adhesive layer is capable of developing tackiness again by heating, said composition comprising a (meth)acrylate polymer having at least 50 mol % of units derived from at least one (meth)acrylate, from 5 to 2000 parts by weight, based on 100 parts by weight of the (meth)acrylate polymer, of an epoxy resin having a molecular weight of from 100 to 10000, from 10 to 1000 parts by weight, based on 100 parts by weight of the (meth)acrylate polymer, of a photopolymerizable low molecular weight compound having a molecular weight of from 100 to 30,000, a heat activatable potential curing agent for said epoxy resin and a photopolymerization initiator for said photopolymerizable low molecular weight compound.
References Cited (Backward Citations)
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