US5332406A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for producing semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1993-04-16
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Granted: 1994-07-26
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Expires: 2013-04-16
Abstract
Abstract A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.
Inventors
- 👤 Toshio Takeuchi
- 👤 Ichiro Hayashi
- 👤 Shuichi Osaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 17:06
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0011; B28D5/0017; B28D5/0023; B28D5/0052; H10P52/00; H10P72/7402; H10P72/7416; H10P72/742; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12; Y10T225/20; Y10T225/222
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
147 words
An apparatus for producing semiconductor devices by dividing a semiconductor wafer having a surface into a plurality of dice comprising: a wafer mounting means for adhering a semiconductor wafer to an ultraviolet sensitive tape which is adhered to a ring frame; dicing means for scribing cut lines in said semiconductor wafer for dividing said semiconductor wafer into a plurality of dice; a breaking jig for breaking said semiconductor wafer along the cut lines scribed therein by plunging against the ultraviolet sensitive tape opposite the cut lines scribed in said wafer; ultraviolet irradiation means for irradiating said ultraviolet sensitive tape with ultraviolet rays to reduce the adhesion of said ultraviolet sensitive tape; and conveying means for conveying said semiconductor wafer from said wafer mounting means to said ultraviolet irradiation means through said dicing means and said breaking jig while said semiconductor wafer is adhered to said ring frame.
Claim 2
Independent Claim
147 words
An apparatus for producing semiconductor devices by dividing a semiconductor wafer having a surface into a plurality of dice comprising: a wafer mounting means for adhering a semiconductor wafer to an ultraviolet sensitive tape which is adhered to a ring frame; dicing means for scribing cut lines in said semiconductor wafer for dividing said semiconductor wafer into a plurality of dice; a breaking jig for breaking said semiconductor wafer along the cut lines scribed therein by plunging against the ultraviolet sensitive tape opposite the cut lines scribed in said wafer; ultraviolet irradiation means for irradiating said ultraviolet sensitive tape with ultraviolet rays to reduce the adhesion of said ultraviolet sensitive tape; and conveying means for conveying said semiconductor wafer from said wafer mounting means to said ultraviolet irradiation means through said dicing means and said breaking jig while said semiconductor wafer is adhered to said ring frame.
Claim 3
Dependent Claim
53 words
The apparatus for producing semiconductor devices according to claim 1, comprising means disposed upstream of said wafer mounting means for delivering materials to said wafer mounting means and means disposed downstream from said ultraviolet irradiating means for of receiving materials from said ultraviolet irradiation means and delivering the material to a subsequent device.
Claim 4
Dependent Claim
70 words
The apparatus for producing semiconductor devices according to claim 1 wherein said dicing means includes a vacuum table for fixing and supporting said semiconductor wafer adhered to said ultraviolet sensitive tape secured to said ring frame, and a blade for scribing cut lines in a semiconductor wafer fixed to said vacuum table and said ultraviolet irradiation means includes an ultraviolet lamp for irradiating said ultraviolet sensitive tape with ultraviolet rays.
Claim 5
Dependent Claim
55 words
The apparatus for producing semiconductor devices according to claim 2 including a plurality of processing units, each unit including said dicing means, said breaking jig, said ultraviolet irradiation means and said conveying means, arranged in combination with a single wafer mounting means, whereby the dicing and subsequent steps of the process are performed in parallel.
Claim 6
Dependent Claim
50 words
The apparatus for producing semiconductor devices according to claim 1 wherein a plurality of processing units, each including said wafer mounting means, said dicing means, said ultraviolet irradiation means, and said transporting means, are arranged so that a predetermined process is conducted in parallel in said plurality of processing units.
References Cited (Backward Citations)
JPS5550637A
Cited
US4296542A
Cited
JPS5851521A
Cited
JPS58142543A
Cited
JPS6047492A
Cited
US4590667A
Cited
US4897141A
Cited
JPS61210650A
Cited
JPS6290943A
Cited
US4999242A
Cited
JPH01164046A
Cited
US4914815A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-25 | 1998-01-24 | 1998-07-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-25 | 2002-01-24 | 2002-07-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-25 | 2006-01-24 | 2006-07-26 | $7700.00 | Window Closed / Lapsed |