US4590667A
Expired / Lapsed
US
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Method and apparatus for assembling semiconductor devices such as LEDs or optodetectors
Assignee: Arris Technology Inc
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Filing: 1984-08-22
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Granted: 1986-05-27
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Expires: 2004-08-22
Abstract
Abstract A wafer divided into rows of abutted end-to-end dice (i.e., semiconductor chips) is placed on a thin, non-elastic membrane and drawn tightly over a knife-edge to successively separate each row of dice from the membrane. The dice are then attached to individual leadframes directly or are picked up by a vacuum fixture and carried to a position where they are secured to the leadframes and are wire bonded. After bonding, the components are assembled into finished subassemblies. In one embodiment, LED lamps are fabricated. A reflector is secured to each leadframe over the die positioned thereon, and the leadframe, die and reflector are molded into a lamp subassembly, which is used to form a larger lamp or display fixture.
Inventors
- 👤 Ralph E. Simon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 21:30
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/01; B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0041; H10F; H10F71/00; H10F71/137; H10P; H10P52/00; H10P72/00; H10P72/04; H10P72/0438; H10P72/0446; H10H20/80; H10H20/85; H10H20/857; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S148/00; Y10S148/028
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
123 words
A method for mass producing semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components to said membrane, dividing said wafer into a plurality of dice arranged in an abutted end-to-end relationship in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, transferring a row of said dice removed from said membrane by the knife-edge to a position in alignment with a corresponding row of leadframe members, and then simultaneously attaching each individual die in said removed row of dice to the leadframe member corresponding thereto in the row of leadframe members.
Claim 2
Independent Claim
123 words
A method for mass producing semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components to said membrane, dividing said wafer into a plurality of dice arranged in an abutted end-to-end relationship in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, transferring a row of said dice removed from said membrane by the knife-edge to a position in alignment with a corresponding row of leadframe members, and then simultaneously attaching each individual die in said removed row of dice to the leadframe member corresponding thereto in the row of leadframe members.
Claim 3
Dependent Claim
46 words
The method of claim 1 wherein said dice are transferred from said membrane by a vacuum pick up tool having a lip which engages an edge of each die and pushes said row of dice away from said knife-edge, thereby sliding the row off the membrane.
Claim 4
Dependent Claim
38 words
The method of claim 1 wherein the removal of said dice from said membrane is assisted by a picker bar mounted adjacent and just above said membrane immediately downstream of said knife-edge in the direction of membrane travel.
Claim 5
Dependent Claim
17 words
The method of claim 1 wherein dice are attached to said leadframe members by a conductive epoxy.
Claim 6
Dependent Claim
43 words
The method of claim 1 wherein said wafer is secured to said membrane by an ultraviolet sensitive adhesive, and comprising the further step of flashing an ultraviolet light as said membrane is passed over said knife-edge to sequentially loosen rows of said dice.
Claim 7
Dependent Claim
32 words
The method of claim 1 wherein said dice are optoelectronic components, and including the step of attaching a light reflector to each of said members leadframe adjacent to the die attached thereon.
Claim 8
Dependent Claim
26 words
The method of claim 6 including the further step of encapsulating said leadframe members dice and reflectors in plastic to form a plurality of lamp assemblies.
Claim 9
Dependent Claim
30 words
The method of claim 7 wherein said encapsulation is carried out by: simultaneously immersing said leadframe members, dice and reflectors in a mold filled with plastic, and curing said plastic.
Claim 10
Dependent Claim
19 words
The method of claim 8 including the step of cutting said leadframe along a portion exterior of said mold.
Claim 11
Dependent Claim
47 words
The method of claim 9 including the step of coupling a plurality of said leadframe members after said cutting step with a strip of adhesive tape, and testing said lamp assemblies, while coupled together via their associated leadframe members by said adhesive tape, to determine their operability.
Claim 12
Independent Claim
124 words
A method for separating dice from a wafer to form semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components on said membrane, dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and removing a row of said dice from said membrane with a vacuum pick up tool having a lip that engages an edge of each die and pushes said row of dice away from said knife-edge, thereby sliding the row off the membrane.
Claim 13
Independent Claim
124 words
A method for separating dice from a wafer to form semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components on said membrane, dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and removing a row of said dice from said membrane with a vacuum pick up tool having a lip that engages an edge of each die and pushes said row of dice away from said knife-edge, thereby sliding the row off the membrane.
Claim 14
Independent Claim
113 words
A method for separating dice from a wafer to form semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components on said membrane, dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and removing a row of said dice from said membrane with a picker bar mounted adjacent and just above said membrane immediately downstream of said knife-edge in the direction of membrane travel.
Claim 15
Independent Claim
113 words
A method for separating dice from a wafer to form semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components on said membrane, dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and removing a row of said dice from said membrane with a picker bar mounted adjacent and just above said membrane immediately downstream of said knife-edge in the direction of membrane travel.
Claim 16
Independent Claim
109 words
A method for separating dice from a wafer to form semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components on said membrane using an ultraviolet sensitive adhesive, dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and flashing an ultraviolet light at said knife-edge as said membrane is passed over the knife-edge to sequentially loosen a row of dice.
Claim 17
Independent Claim
109 words
A method for separating dice from a wafer to form semiconductor devices comprising the steps of: providing a thin, non-stretchable membrane, mounting a wafer containing multiple semiconductor components on said membrane using an ultraviolet sensitive adhesive, dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows, disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and flashing an ultraviolet light at said knife-edge as said membrane is passed over the knife-edge to sequentially loosen a row of dice.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-05-26 | 1989-11-25 | 1990-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-05-26 | 1993-11-25 | 1994-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-05-26 | 1997-11-25 | 1998-05-27 | $7700.00 | Window Closed / Lapsed |