Patent US5959356A successfully refreshed from Google Patents.
US5959356A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder ball grid array carrier package with heat sink
Assignee: Samsung Electronics Co Ltd
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Filing: 1997-10-17
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Granted: 1999-09-28
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Expires: 2017-10-17
Abstract
Abstract A solder ball grid array carrier package has a circuit board with conductive wirings and a plurality of through holes. At least one semiconductor chip is mounted on an upper surface of the circuit board and bonding wires electrically connect the chip to the conductive wirings. A plurality of solder balls are electrically connected to the conductive wirings, with the solder balls being adhered to a lower surface of the circuit board. A heat sink is also adhered to the lower surface of the circuit board. The heat sink is in direct contact with the through holes of the circuit board, with the through holes allowing for heat dissipation.
Inventors
- 👤 Sang Eon Oh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 08:28
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W90/00; H10W90/701; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
147 words
A solder ball grid array carrier package, comprising: a circuit board having conductive wirings formed thereon, and a plurality of heat dissipation through holes; at least one semiconductor chip mounted on an upper surface of the circuit board and being in contact with the plurality of heat dissipation through holes; bonding wires for electrically connecting the chip to the conductive wirings; a plurality of signal solder balls electrically connected to the conductive wirings, the signal solder balls being adhered to a lower surface of the circuit board, with certain ones of the plurality of signal solder balls being positioned directly below a perimeter of the semiconductor chip; and a heat sink adhered to the lower surface of the circuit board, the heat sink simultaneously surrounding each of the plurality of signal solder balls and directly contacting the plurality of heat dissipation through holes of the circuit board.
Claim 2
Dependent Claim
147 words
A solder ball grid array carrier package, comprising: a circuit board having conductive wirings formed thereon, and a plurality of heat dissipation through holes; at least one semiconductor chip mounted on an upper surface of the circuit board and being in contact with the plurality of heat dissipation through holes; bonding wires for electrically connecting the chip to the conductive wirings; a plurality of signal solder balls electrically connected to the conductive wirings, the signal solder balls being adhered to a lower surface of the circuit board, with certain ones of the plurality of signal solder balls being positioned directly below a perimeter of the semiconductor chip; and a heat sink adhered to the lower surface of the circuit board, the heat sink simultaneously surrounding each of the plurality of signal solder balls and directly contacting the plurality of heat dissipation through holes of the circuit board.
Claim 3
Dependent Claim
30 words
The solder ball grid array carrier package of claim 1, wherein said semiconductor chip is directly attached to the upper surface of the circuit board using a thermally conductive adhesive.
Claim 4
Dependent Claim
37 words
The solder ball grid array carrier package of claim 1, wherein said heat sink has a plurality of openings formed therein corresponding to said plurality of solder balls, whereby the solder balls are placed within the holes.
Claim 5
Dependent Claim
23 words
The solder ball grid array carrier package of claim 1, wherein said heat sink is composed of a thermally and electrically conductive material.
Claim 6
Dependent Claim
31 words
The solder ball grid array carrier package of claim 1, wherein said heat sink is comprised of a thermal coupling layer and an adhesive layer formed on said thermal coupling layer.
Claim 7
Dependent Claim
21 words
The solder ball grid array carrier package of claim 5, wherein said thermal coupling layer is made from a copper alloy.
Claim 8
Dependent Claim
21 words
The solder ball grid array carrier package of claim 5, wherein said thermal coupling layer is made from an iron-nickel alloy.
Claim 9
Dependent Claim
23 words
The solder ball grid array carrier package of claim 5, wherein a lower surface of said thermal coupling layer is coated with ink.
Claim 10
Dependent Claim
32 words
The solder ball grid array carrier package of claim 3, wherein each of said plurality of holes in the heat sink have a diameter larger than that of the respective solder ball.
Claim 11
Dependent Claim
25 words
The solder ball grid array carrier package of claim 3, wherein said plurality of holes in the heat sink are filled with an insulating material.
Claim 12
Dependent Claim
19 words
The solder ball grid array carrier package of claim 2, wherein said thermally conductive adhesive is also electrically conductive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-27 | 2003-03-29 | 2003-09-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-27 | 2007-03-29 | 2007-09-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-27 | 2011-03-29 | 2011-09-28 | $7700.00 | Window Closed / Lapsed |