US5583747A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermoplastic interconnect for electronic device and method for making
Assignee: Apple Inc
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Filing: 1995-05-05
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Granted: 1996-12-10
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Expires: 2015-05-05
Abstract
Abstract Conductive thermoplastic interconnects (120) for electronic devices are disclosed. The interconnects may take the form of bumps or spheres, and may be used in applications where metal bumps are conventionally used. Bumps (310) may be attached by retaining them in a vacuum fixture (312) and momentarily contacting them with the substrate (316) requiring the bumps (310). The substrate (316) has been heated sufficiently to cause wetting of the conductive thermoplastic bump (310).
Inventors
- 👤 John H. Baird
- 👤 Francis J. Carney
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:38
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W70/00; H10W70/099; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2201/10984; H05K2203/00; H05K2203/03; H05K2203/0338; H05K2203/08; H05K2203/085; H10W72/00; H10W72/851; H10W72/853; H10W72/856; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
91 words
A method for making an electronic device comprising the steps of: providing a device substrate; and attaching a conductive thermoplastic interconnect bump to a surface of the device substrate by heating the device substrate and mating the device substrate and the conductive thermoplastic interconnect bump, wherein the step of attaching the conductive thermoplastic interconnect bump to the surface of the device substrate includes using heat from the device substrate to wet the conductive thermoplastic interconnect bump and to provide mechanical adhesion between the device substrate and the conductive thermoplastic interconnect bump.
Claim 2
Independent Claim
91 words
A method for making an electronic device comprising the steps of: providing a device substrate; and attaching a conductive thermoplastic interconnect bump to a surface of the device substrate by heating the device substrate and mating the device substrate and the conductive thermoplastic interconnect bump, wherein the step of attaching the conductive thermoplastic interconnect bump to the surface of the device substrate includes using heat from the device substrate to wet the conductive thermoplastic interconnect bump and to provide mechanical adhesion between the device substrate and the conductive thermoplastic interconnect bump.
Claim 3
Dependent Claim
67 words
The method of claim 1 further comprising the steps of heating a module substrate and mating the module substrate and the conductive thermoplastic interconnect bump, wherein the step of mating the module substrate and the conductive thermoplastic interconnect bump includes using heat from the module substrate to wet the conductive thermoplastic interconnect bump to provide mechanical adhesion between the conductive thermoplastic interconnect bump and the module substrate.
Claim 4
Dependent Claim
24 words
The method of claim 1, wherein the step of attaching comprises attaching the conductive thermoplastic interconnect bump while it is at least partially solid.
Claim 5
Dependent Claim
36 words
The method of claim 1, wherein the step of attaching comprises retaining the conductive thermoplastic interconnect bump in a vacuum fixture prior to the step of mating the device substrate and the conductive thermoplastic interconnect bump.
Claim 6
Dependent Claim
21 words
The method of claim 1, further comprising the step of surrounding the conductive thermoplastic interconnect bump with a heat conducting material.
Claim 7
Independent Claim
39 words
A method for making an electronic device comprising the steps of: providing a device substrate; and attaching a conductive thermoplastic interconnect bump to a surface of the device substrate by heating the conductive thermoplastic interconnect bump with infrared radiation.
Claim 8
Independent Claim
39 words
A method for making an electronic device comprising the steps of: providing a device substrate; and attaching a conductive thermoplastic interconnect bump to a surface of the device substrate by heating the conductive thermoplastic interconnect bump with infrared radiation.
Claim 9
Dependent Claim
25 words
The method of claim 6 further comprising the step of heating a module substrate and mating the module substrate and the conductive thermoplastic interconnect bump.
Claim 10
Dependent Claim
24 words
The method of claim 6, wherein the step of attaching comprises attaching the conductive thermoplastic interconnect bump while it is at least partially solid.
Claim 11
Dependent Claim
21 words
The method of claim 6, further comprising the step of surrounding the conductive thermoplastic interconnect bump with a heat conducting material.
Claim 12
Independent Claim
51 words
A method for making an electronic device comprising the steps of: providing a device substrate; and attaching a conductive thermoplastic interconnect bump to a surface of the device substrate by retaining the conductive thermoplastic interconnect bump in a vacuum fixture and mating the device substrate and the conductive thermoplastic interconnect bump.
Claim 13
Independent Claim
51 words
A method for making an electronic device comprising the steps of: providing a device substrate; and attaching a conductive thermoplastic interconnect bump to a surface of the device substrate by retaining the conductive thermoplastic interconnect bump in a vacuum fixture and mating the device substrate and the conductive thermoplastic interconnect bump.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-10 | 2000-06-10 | 2000-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-10 | 2004-06-10 | 2004-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-10 | 2008-06-10 | 2008-12-10 | $7700.00 | Window Closed / Lapsed |