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US5936280A Expired / Lapsed US ⏱️ 0.0 years remaining

Multilayer quadruple gate field effect transistor structure for use in integrated circuit devices

Assignee: Advanced Micro Devices Inc
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Filing: 1997-04-21
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Granted: 1999-08-10
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Expires: 2017-04-21
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Abstract

Abstract A quadruple gate field effect transistor (FET) is provided on the semiconductor-on-insulator or semiconductor-on-insulator (SOI) structure or a bulk semiconductor structure. The silicon substrate is surrounded by a polysilicon material on at least three sides to form a gate. Additionally, the substrate can be surrounded by a fourth side to form a quadruple gate structure. The SOI structure can be comprised of two layers of SOI structures. Interlayer vias can be provided to connect each layer of the two-layer structure.

Inventors

  • 👤 Yowjuang William Liu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 23:11
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10D30/67; H10D30/6729; H10D30/673; H10D30/6735; H10D86/00; H10D86/01; H10D86/201

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 132 words
An integrated circuit, comprising: a first layer including a first semiconductor substrate containing a first channel region of at least one first field effect transistor, the first transistor including a gate conductor wherein the gate conductor surrounds all four sides of the first substrate, the first semiconductor substrate being disposed between a first insulating layer and a second insulating layer, the second insulating layer being coupled to a support substrate; and a second layer including a second semiconductor substrate containing a second channeled region of at least one second field effect transistor, the second semiconductor substrate being disposed between a third insulating layer and a fourth insulating layer, the fourth insulating layer being in contact with the first insulating layer, wherein the first semiconductor substrate is stacked below the second semiconductor substrate.
Claim 2
Dependent Claim 132 words
An integrated circuit, comprising: a first layer including a first semiconductor substrate containing a first channel region of at least one first field effect transistor, the first transistor including a gate conductor wherein the gate conductor surrounds all four sides of the first substrate, the first semiconductor substrate being disposed between a first insulating layer and a second insulating layer, the second insulating layer being coupled to a support substrate; and a second layer including a second semiconductor substrate containing a second channeled region of at least one second field effect transistor, the second semiconductor substrate being disposed between a third insulating layer and a fourth insulating layer, the fourth insulating layer being in contact with the first insulating layer, wherein the first semiconductor substrate is stacked below the second semiconductor substrate.
Claim 3
Dependent Claim 35 words
The integrated circuit of claim 1 wherein the first field effect transistor and the second field effect transistor are coupled by conductive via is provided through the first insulating layer and the fourth insulating layer.
Claim 4
Dependent Claim 25 words
The integrated circuit of claim 2 further comprising: a metal layer disposed above the third insulating layer, the metal layer being coupled to the via.
Claim 5
Dependent Claim 21 words
The integrated circuit of claim 1 wherein the fourth insulating layer and the first insulating layer are bonded by an adhesive.
Claim 6
Dependent Claim 15 words
The integrated circuit of claim 1 wherein the first and second semiconductor substrates are bar-shaped.
Claim 7
Dependent Claim 105 words
A multilayer silicon-on-insulator structure for containing a plurality of transistors, the multilayer silicon-on-insulator structure comprising: a first layer including a first semiconductor substrate containing a first channel region of at least one first field effect transistor, the first semiconductor substrate being at least partially surrounded by an insulative material and surrounded at least partially on four sides by a gate conductor; and a second layer including a second semiconductor substrate, the second semiconductor substrate being at least partially surrounded by an insulative material, wherein the first semiconductor substrate is stacked below the second semiconductor substrate, and the first layer is bonded to the second layer.
Claim 8
Dependent Claim 105 words
A multilayer silicon-on-insulator structure for containing a plurality of transistors, the multilayer silicon-on-insulator structure comprising: a first layer including a first semiconductor substrate containing a first channel region of at least one first field effect transistor, the first semiconductor substrate being at least partially surrounded by an insulative material and surrounded at least partially on four sides by a gate conductor; and a second layer including a second semiconductor substrate, the second semiconductor substrate being at least partially surrounded by an insulative material, wherein the first semiconductor substrate is stacked below the second semiconductor substrate, and the first layer is bonded to the second layer.
Claim 9
Dependent Claim 21 words
The multilayer silicon-on-insulator structure of claim 6 wherein a conductive via is disposed through the second layer into the first layer.
Claim 10
Dependent Claim 38 words
The multilayer silicon-on-insulator structure of claim 6 further comprising: a metal layer disposed above the second layer, the metal layer being coupled to a plurality of vias, the vias extending to the first substrate through the second layer.
Claim 11
Dependent Claim 20 words
The multilayer silicon-on-insulator structure of claim 6 wherein the first layer and the second layer are bonded by an adhesive.
Claim 12
Dependent Claim 16 words
The multilayer silicon-on-insulator structure of claim 6 wherein the first and second semiconductor substrates are bar-shaped.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-08-09 2003-02-08 2003-08-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-08-09 2007-02-08 2007-08-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-08-09 2011-02-08 2011-08-10 $7700.00 Window Closed / Lapsed

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