US5886414A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Removal of extended bond pads using intermetallics
Assignee: DEVICE TECHNOLOGY Inc A CORP OF
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Filing: 1996-09-20
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Granted: 1999-03-23
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Expires: 2016-09-20
Abstract
Abstract Removable extension areas electrically connected to the original die bond pad allow for testing connections to be made. After removal of the extension areas, the circuitry below the region of the extension areas can be seen through a microscope. The use of perforations and/or underlayer sections can aid in the removal of the extension areas. Underlayer sections may comprise a metal that forms an intermetallic interaction with the metal layer of the extension areas.
Inventors
- 👤 Terry R. Galloway
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:48
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W72/00; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/932; H10W72/981
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
88 words
A structure comprising: a die; a wire bond pad on the die; an extension area electrically connected to the wire bond pad, the extension area comprising a first type of metal, the extension area extending, beyond the area of the wire bond pad; a barrier layer separating the wire bond pad and the extension area, wherein said barrier layer is electrically conductive; and an intermetallic region connected to the extension area, the intermetallic region including an alloy of the first type of metal and another type of metal.
Claim 2
Dependent Claim
88 words
A structure comprising: a die; a wire bond pad on the die; an extension area electrically connected to the wire bond pad, the extension area comprising a first type of metal, the extension area extending, beyond the area of the wire bond pad; a barrier layer separating the wire bond pad and the extension area, wherein said barrier layer is electrically conductive; and an intermetallic region connected to the extension area, the intermetallic region including an alloy of the first type of metal and another type of metal.
Claim 3
Dependent Claim
17 words
The structure of claim 1, wherein the first metal is gold and the second metal is aluminum.
Claim 4
Dependent Claim
16 words
The structure of claim 1, wherein the extension area forms a connection with a wire bond.
Claim 5
Dependent Claim
19 words
The structure of claim 1, wherein the extension area has a surface area of 10,000 square microns or less.
Claim 6
Dependent Claim
19 words
The structure of claim 4, wherein the extension area has a surface area of 2500 square microns or greater.
Claim 7
Dependent Claim
26 words
The structure of claim 1, further comprising a metal bump electrically connected to the wire bond pad, the metal bump not positioned over the extension area.
Claim 8
Dependent Claim
18 words
The structure of claim 1, wherein the metal layer includes a plurality of perforations at the intermetallic region.
Claim 9
Dependent Claim
73 words
A structure comprising: a die; a wire bond pad on the die; a metal layer electrically connected to the wire bond pad, the metal layer including an extension area extending beyond the area of the wire bond pad, the extension area connected to the remainder of the metal layer through a detachment region; and a barrier layer separating the wire bond pad and the metal layer, wherein said barrier layer is electrically conductive.
Claim 10
Dependent Claim
73 words
A structure comprising: a die; a wire bond pad on the die; a metal layer electrically connected to the wire bond pad, the metal layer including an extension area extending beyond the area of the wire bond pad, the extension area connected to the remainder of the metal layer through a detachment region; and a barrier layer separating the wire bond pad and the metal layer, wherein said barrier layer is electrically conductive.
Claim 11
Dependent Claim
18 words
The structure of claim 8, wherein the detachment region comprises a plurality of perforations in the metal layer.
Claim 12
Dependent Claim
32 words
The structure of claim 8, wherein the extension area comprises a first metal and the detachment region comprises an intermetallic region including an alloy of the first metal and a second metal.
Claim 13
Dependent Claim
17 words
The structure of claim 10, wherein the first metal is gold and the second metal is aluminum.
Claim 14
Dependent Claim
16 words
The structure of claim 8, wherein the extension area forms a connection with a wire bond.
Claim 15
Dependent Claim
19 words
The structure of claim 8, wherein the extension area has a surface area of 10,000 square microns or less.
Claim 16
Dependent Claim
19 words
The structure of claim 13, wherein the extension area has a surface area of 2500 square microns or greater.
Claim 17
Dependent Claim
23 words
The structure of claim 8, further comprising a metal bump on the metal layer, the metal bump not positioned over the extension area.
Claim 18
Dependent Claim
17 words
The structure of claim 8, further comprising an underlayer located below a portion of the metal layer.
Claim 19
Dependent Claim
25 words
The structure of claim 16, wherein the metal layer has a weaker contact strength with the underlayer than with a passivation layer on the die.
Claim 20
Dependent Claim
19 words
The structure of claim 8, wherein the barrier layer does not extend under a portion of the metal layer.
Claim 21
Dependent Claim
17 words
The structure of claim 8, wherein the extension area has a region wider than the detachment region.
Claim 22
Dependent Claim
104 words
A structure comprising: a die; a wire bond pad on the die; an extension area electrically connected to the wire bond pad, the extension area comprising a first type of metal, the extension area extending beyond the area of the wire bond pad; an intermetallic region connected to the extension area, the intermetallic region including, an alloy of the first type of metal and another type of metal; a barrier layer separating the wire bond pad and the intermetallic region, wherein said barrier layer is electrically conductive; and a metal bump on the intermetallic region, the metal bump not positioned over the extension area.
Claim 23
Dependent Claim
104 words
A structure comprising: a die; a wire bond pad on the die; an extension area electrically connected to the wire bond pad, the extension area comprising a first type of metal, the extension area extending beyond the area of the wire bond pad; an intermetallic region connected to the extension area, the intermetallic region including, an alloy of the first type of metal and another type of metal; a barrier layer separating the wire bond pad and the intermetallic region, wherein said barrier layer is electrically conductive; and a metal bump on the intermetallic region, the metal bump not positioned over the extension area.
Claim 24
Dependent Claim
17 words
The structure of claim 20, further comprising: an underlayer located below a portion of the extension area.
Claim 25
Dependent Claim
25 words
The structure of claim 21, wherein the extension area has a weaker contact strength with the underlayer than with a passivation layer on the die.
Claim 26
Dependent Claim
19 words
The structure of claim 20, wherein the barrier layer does not extend under a portion of the extension area.
Claim 27
Dependent Claim
17 words
The structure of claim 20, wherein the extension area has a region wider than the detachment region.
Claim 28
Dependent Claim
21 words
The structure of claim 20, wherein the first type of metal is gold and the another type of metal is aluminum.
Claim 29
Dependent Claim
16 words
The structure of claim 20, wherein the extension area forms a connection with a wire bond.
Claim 30
Dependent Claim
19 words
The structure of claim 20, wherein the extension area has a surface area of 10,000 square microns or less.
Claim 31
Dependent Claim
19 words
The structure of claim 20, wherein the extension area has a surface area of 2500 square microns or greater.
Claim 32
Dependent Claim
26 words
The structure of claim 20, further comprising a metal bump electrically connected to the wire bond pad, the metal bump not positioned over the extension area.
Claim 33
Dependent Claim
18 words
The structure of claim 20, wherein the metal layer includes a plurality of perforations at the intermetallic region.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-22 | 2002-09-21 | 2003-03-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-22 | 2006-09-21 | 2007-03-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-22 | 2010-09-21 | 2011-03-23 | $7700.00 | Window Closed / Lapsed |