US5053850A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding pad for semiconductor devices
Assignee: Motorola Solutions Inc
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Filing: 1990-11-15
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Granted: 1991-10-01
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Expires: 2010-11-15
Abstract
Abstract A bonding pad is described having a reduced surface area while maintaining adequate wire bonding surface. The bonding pad comprises: a test pad for contacting with a test probe; a plurality of radially extending conductive fingers; and an alignment key generally in the form of a circle disposed about a portion of the fingers.
Inventors
- 👤 Thomas R. Baker
- 👤 George F. Anderson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 02:52
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W20/00; H10W20/40; H10W20/482; H10W20/484; H10W72/00; H10W72/90
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
77 words
A low capacitance bonding pad for use with a semiconductor device comprising: a conductive test pad disposed on a surface of said semiconductor device; a plurality of finger-like conductors coupled to said test pad and extending outwardly from said test pad to compensate for alignment variations in wire bonding equipment; said bonding pad having a total surface area of no more than one square mil; and a slender alignment key substantially encircling said plurality of finger-like conductors.
Claim 2
Dependent Claim
77 words
A low capacitance bonding pad for use with a semiconductor device comprising: a conductive test pad disposed on a surface of said semiconductor device; a plurality of finger-like conductors coupled to said test pad and extending outwardly from said test pad to compensate for alignment variations in wire bonding equipment; said bonding pad having a total surface area of no more than one square mil; and a slender alignment key substantially encircling said plurality of finger-like conductors.
Claim 3
Dependent Claim
22 words
The bonding pad of claim 1 wherein said conductive test pad is coupled to an electrically active portion of said semiconductor device.
Claim 4
Dependent Claim
19 words
The bonding pad of claim 2 wherein said electrically active portion is an emitter, a base, or a collector.
Claim 5
Dependent Claim
29 words
The bonding pad of claim 1 wherein the total surface area of said plurality of finger-like conductors is about the same as the surface area of said test pad.
Claim 6
Dependent Claim
22 words
The bonding pad of claim 1 wherein said test pad has a surface area of less than one-half of a square mil.
Claim 7
Dependent Claim
25 words
The bonding pad of claim 1 wherein said plurality of said finger-like conductors have a total surface area less than one-half of a square mil.
Claim 8
Dependent Claim
33 words
The bonding pad of claim 1 wherein said test pad has a diameter of about 0.75 and said fingers have a length of about 0.375 mils and a width of about 0.15 mils.
References Cited (Backward Citations)
CH432661A
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CH436491A
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JPS5740986A
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JPS5797686A
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JPS57197879A
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JPS5929430A
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JPS604249A
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JPS61174659A
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JPS627161A
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JPS62150776A
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JPS62176140A
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US4864370A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-30 | 1995-04-01 | 1995-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-30 | 1999-04-01 | 1999-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-30 | 2003-04-01 | 2003-10-01 | $7700.00 | Window Closed / Lapsed |