JPS604249A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: NEC Corp
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Filing: 1983-06-22
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Granted: —
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Expires: 2003-06-22
Abstract
Abstract PURPOSE:To facilitate electrode discrimination having no wire bonding by the addition of specific discriminating patterns, in the title device of a large scaled circuit by master slice system. CONSTITUTION:Pads 4 for discrimination are formed by the addition of the discriminating pattern 5 of a shape different from that of a bonding pad, onto an Al electrodes as the conventional pads 3, when the Al pattern for the other layer is formed. Therefore, the pads subjected to normal bonding can be easily discriminated from those not subjected.
Inventors
- 👤 Hiroshi Koyada
- 👤 古谷田 宏
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 06:02
CPC Classifications
H; H10; H10W; H10W46/00; H10W46/101; H10W46/601; H10W46/603; H10W72/00; H10W72/90; H10W72/931; H10W72/932; H10W72/934; H10W72/936; H10W72/951; H10W72/952
Claims Analysis
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