US5886401A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure and fabrication method for interconnecting light emitting diodes with metallization extending through vias in a polymer film overlying the light emitting diodes
Assignee: General Electric Co
•
Filing: 1997-09-02
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Granted: 1999-03-23
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Expires: 2017-09-02
Abstract
Abstract A light emitting diode (LED) interconnection package includes an LED situated on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces; a polymer film overlying the contact surface and having via openings; a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.
Inventors
- 👤 Yung Sheng Liu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:41
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/857; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10H20/851; H10H20/8515; H10W70/099; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/90; H10W72/941; H10W72/9413; H10W90/00
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
72 words
A light emitting diode (LED) interconnection package comprising: an LED grown on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces; a polymer film overlying the contact surface and having via openings; a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.
Claim 2
Dependent Claim
72 words
A light emitting diode (LED) interconnection package comprising: an LED grown on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces; a polymer film overlying the contact surface and having via openings; a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.
Claim 3
Dependent Claim
13 words
The package of claim 1 wherein the support piece comprises an epoxy compound.
Claim 4
Dependent Claim
17 words
The package of claim 2 wherein the metallization extends through the via openings to the contact pads.
Claim 5
Dependent Claim
31 words
The package of claim 2 wherein the metallization extends through the via openings to bonding pads on the polymer film and wherein solder couples the bonding pads to the contact pads.
Claim 6
Dependent Claim
20 words
The package of claim 2 further comprising a reflector situated on a surface of the polymer film facing the LED.
Claim 7
Dependent Claim
23 words
The package of claim 2 further comprising a phosphor layer coated on a surface of the epoxy compound facing away from the LED.
Claim 8
Dependent Claim
74 words
A light emitting diode (LED) array interconnection package comprising: a plurality of LEDs grown on substantially transparent substrates, the LEDs having a contact surfaces with contact pads and having side surfaces; a polymer film overlying the contact surfaces and having via openings; a substantially transparent support piece surrounding the side surfaces of the LEDs and the substrates; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.
Claim 9
Dependent Claim
74 words
A light emitting diode (LED) array interconnection package comprising: a plurality of LEDs grown on substantially transparent substrates, the LEDs having a contact surfaces with contact pads and having side surfaces; a polymer film overlying the contact surfaces and having via openings; a substantially transparent support piece surrounding the side surfaces of the LEDs and the substrates; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.
Claim 10
Dependent Claim
17 words
The package of claim 7 wherein the metallization extends through the via openings to the contact pads.
Claim 11
Dependent Claim
31 words
The package of claim 7 wherein the metallization extends through the via openings to bonding pads on the polymer film and wherein solder couples the bonding pads to the contact pads.
Claim 12
Dependent Claim
20 words
The package of claim 7 further comprising a reflector situated on a surface of the polymer film facing the LED.
Claim 13
Dependent Claim
23 words
The package of claim 10 further comprising a phosphor layer coated on a surface of the epoxy compound facing away from the LED.
Claim 14
Dependent Claim
74 words
A fabrication method for a interconnecting at least one light emitting diode (LED) having contact pads situated on a contact surface, the method comprising: attaching the contact surface of the LED and a polymer film; forming via openings in the polymer film; applying a substantially transparent support piece around side surfaces of the LED and the substrate; and applying metallization over the polymer film and through the via openings to interconnect the contact pads.
Claim 15
Dependent Claim
74 words
A fabrication method for a interconnecting at least one light emitting diode (LED) having contact pads situated on a contact surface, the method comprising: attaching the contact surface of the LED and a polymer film; forming via openings in the polymer film; applying a substantially transparent support piece around side surfaces of the LED and the substrate; and applying metallization over the polymer film and through the via openings to interconnect the contact pads.
Claim 16
Dependent Claim
28 words
The method of claim 12 wherein applying a substantially transparent support piece around side surfaces of the LED and the substrate comprises molding a substantially transparent epoxy compound.
Claim 17
Dependent Claim
19 words
The method of claim 13 wherein applying metallization comprises depositing metallization through the via openings to the contact pads.
Claim 18
Dependent Claim
39 words
The method of claim 13 wherein applying metallization comprises applying metallization through the via openings to bonding pads and wherein attaching the contact surface of the LED and the polymer comprises soldering the bonding pads to the contact pads.
Claim 19
Dependent Claim
33 words
The method of claim 13 further comprising applying a reflector on a surface of the polymer film facing the LED prior to attaching the contact surface of the LED and the polymer film.
Claim 20
Dependent Claim
19 words
The method of claim 16 wherein applying metallization comprises depositing metallization through the via openings to the contact pads.
Claim 21
Dependent Claim
31 words
The method of claim 16 wherein applying metallization comprises applying metallization through the via openings to bonding pads on the polymer film and soldering the bonding pads to the contact pads.
Claim 22
Dependent Claim
23 words
The method of claim 12, wherein applying the support piece occurs after attaching the contact surface of the LED and the polymer film.
Claim 23
Dependent Claim
23 words
The method of claim 12, wherein applying the support piece occurs before attaching the contact surface of the LED and the polymer film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-22 | 2002-09-21 | 2003-03-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-22 | 2006-09-21 | 2007-03-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-22 | 2010-09-21 | 2011-03-23 | $7700.00 | Window Closed / Lapsed |