Thermal conditioning apparatus

Claim 2

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said at least one support members, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a drive for moving said top surface relative to said lift elements; and, a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements.

Claim 3

The apparatus of claim 1 wherein said support members comprise a ceramic material.

Claim 4

The apparatus of claim 1 wherein said drive is a plate drive assembly, comprising: a cam coupled to said plate, said cam having a first rotational position corresponding to said plate being in a first position wherein said lift elements are in a retracted position with respect to said top surface of said plate and a second rotational position corresponding to said plate being in a second position wherein said lift elements extend through said top surface of said plate; a cam shaft having a cam end and a motor end, and said cam end being attached to said cam; a motor attached to said motor end of said cam to turn said cam between the first and second rotational positions; and, a motor controller controllably connected between said motor and said computer controller.

Claim 5

The apparatus of claim 1, wherein said support members comprise cylindrically shaped tubes.

Claim 6

The apparatus of claim 1, wherein said support members are symmetrically disposed in said top surface.

Claim 7

The apparatus of claim 1, wherein said support members are axisymmetrically disposed in said top surface.

Claim 8

The apparatus of claim 1, wherein said support members are axisymmetrically disposed in said top surface about a central axis passing perpendicularly through said top surface.

Claim 9

The apparatus of claim 1, wherein said support members each contain a bore extending from said proximal end along said longitudinal axis of said at least one support member.

Claim 10

The apparatus of claim 1, wherein said support members extend from said top surface an equal distance.

Claim 11

The apparatus of claim 1, wherein said support members are constructed from a material selected from the group consisting of a ceramic material a crystalline plastic, and Teflon®.

Claim 12

The apparatus of claim 1, wherein said top surface is circular.

Claim 13

The apparatus of claim 1, wherein said temperature controller comprises a temperature controlled heater.

Claim 14

The apparatus of claim 1, wherein said lifting elements comprise lift pins.

Claim 15

The apparatus of claim 1, wherein said computer controller is coupled to said sensor for controlling said negative pressure source in response to said signal received from said sensor.

Claim 16

The apparatus of claim 1, wherein said negative pressure source includes a vacuum sensor connected to provide a signal to said computer controller.

Claim 17

The apparatus of claim 15, wherein said computer controller activates the temperature controller to perform thermal conditioning in response to said signal from said vacuum sensor.

Claim 18

The apparatus of claim 1 wherein said negative pressure source include a vacuum source.

Claim 19

The apparatus of claim 1 wherein: at least one of said lift elements includes a longitudinal axis and a bore extending from said contacting end along said longitudinal axis of said at least one lift element; and, said sensor is disposed within said bore.

Claim 20

The apparatus of claim 1 wherein said sensor comprises a infrared sensor.

Claim 21

The apparatus of claim 1 wherein said negative pressure source is operatively coupled to said computer controller, said computer controller controlling said negative pressure source in response to a signal from said sensor.

Claim 22

The apparatus of claim 1, wherein said lift elements are stationary, said plate being moveable relative to said lift elements.

Claim 23

The apparatus of claim 1, wherein said computer controller controls said temperature controller, said negative pressure source, said sensor, and said relative movement of said lift elements and said plate.

Claim 24

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; a cover adjacent said top side of said plate, having an exhaust port; an endless rim having a first edge attached to said cover defining an interior and an exterior region, a second edge, and at least one flow passage from said interior to said exterior regions, said exhaust port being in fluid communication with said interior region and said second edge seated on said top surface of said plate when said plate is in a first position; and, a stagnation plate attached to said rim in said interior region between said at least one flow passage and said second edge, said stagnation plate dimensioned so that passages are formed between said rim and said stagnation plate, so as to provide at least one flow path around said stagnation plate to said exhaust port.

Claim 25

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; a cover adjacent said top side of said plate, having an exhaust port; an endless rim having a first edge attached to said cover defining an interior and an exterior region, a second edge, and at least one flow passage from said interior to said exterior regions, said exhaust port being in fluid communication with said interior region and said second edge seated on said top surface of said plate when said plate is in a first position; and, a stagnation plate attached to said rim in said interior region between said at least one flow passage and said second edge, said stagnation plate dimensioned so that passages are formed between said rim and said stagnation plate, so as to provide at least one flow path around said stagnation plate to said exhaust port.

Claim 26

The apparatus of claim 23 wherein said apparatus further comprises: at least three lift elements having contacting ends for contacting material placed on said plate, said lift elements being slidably disposed through said plate; a drive for moving said top surface relative to said lift elements; and a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements and provide a signal to said computer controller.

Claim 27

The apparatus of claim 24 wherein: said at least one of said lift elements includes a longitudinal axis and a longitudinal bore extending from said contacting end along said longitudinal axis of said lift elements; and said sensor is disposed within said longitudinal bore.

Claim 28

The apparatus of claim 23 further comprising: at least three support members having a proximal end and at least one of said support members having a longitudinal axis a bore extending from said proximal end along said longitudinal axis of said at least one support member and said support members are mounted in said top surface with each said proximal end thereof extending beyond said top surface; and, a negative pressure source connected to said bore in said at least one support member.

Claim 29

The apparatus of claim 26, further comprising: a cam coupled to said plate having a first rotational position corresponding to said plate being in a first position wherein said lift elements are in a retracted position with respect to said top surface of said plate and a second rotational position corresponding to said plate being in a second position wherein said lift elements extend through said top surface of said plate; a cam shaft having a cam end and a motor end, and said cam end being attached to said cam; a motor attached to said motor end of said cam to turn said cam between the first and second rotational positions; and, a motor controller controllably connected between said motor and said computer controller.

Claim 30

The apparatus of claim 23, further comprising an exhaust fan disposed in said exhaust port.

Claim 31

The apparatus of claim 23, wherein said at least one flow path comprises a plurality of perforations in said stagnation plate.

Claim 32

The apparatus of claim 23, wherein said at least one flow path is provided between said stagnation plate and said rim.

Claim 33

The apparatus of claim 23, wherein said at least one flow path comprises a plurality of uniformly distributed circular apertures in said stagnation plate.

Claim 34

The apparatus of claim 23, wherein said second edge is comprised of a low thermal conductivity material.

Claim 35

The apparatus of claim 23, wherein said rim comprises: an insert portion containing said at least one flow passage; and, a solid portion including said second edge, dimensioned to permit said insert portion to rest on top of said solid portion.

Claim 36

The apparatus of claim 23, wherein said at least one flow passage comprises a plurality of flow holes distributed around said rim, said holes formed in said first edge.

Claim 37

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a plate drive assembly, comprising: a cam coupled to said plate, said cam having a first rotational position corresponding to said plate being in a first position and a second rotational position corresponding to said plate being in a second position; a cam shaft having a cam end and a motor end, and said cam end being attached to said cam; a motor attached to said motor end of said cam to turn said cam between the first and second rotational positions; and, a motor controller operatively connected to said motor and said computer controller.

Claim 38

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a plate drive assembly, comprising: a cam coupled to said plate, said cam having a first rotational position corresponding to said plate being in a first position and a second rotational position corresponding to said plate being in a second position; a cam shaft having a cam end and a motor end, and said cam end being attached to said cam; a motor attached to said motor end of said cam to turn said cam between the first and second rotational positions; and, a motor controller operatively connected to said motor and said computer controller.

Claim 39

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; and, a negative pressure source connected by a port in said plate with said at least one bore, wherein said negative pressure source includes a vacuum sensor connected to provide a signal to said computer controller.

Claim 40

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; and, a negative pressure source connected by a port in said plate with said at least one bore, wherein said negative pressure source includes a vacuum sensor connected to provide a signal to said computer controller.

Claim 41

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned and a cover resting on top of said enclosure, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements; said cover adjacent said top side of said plate, having an exhaust port; an endless rim having a first edge attached to said cover defining an interior and an exterior region, a second edge, and at least one flow passage from said interior to said exterior regions, said exhaust port being in fluid communication with said interior region and said second edge seated on said top surface of said plate when said plate is in a first position; and, a stagnation plate attached to said rim in said interior region between said at least one flow passage and said second edge, said stagnation plate dimensioned so that passages are formed between said rim and said stagnation plate, so as to provide at least one flow path around said stagnation plate to said exhaust port.

Claim 42

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned and a cover resting on top of said enclosure, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements; said cover adjacent said top side of said plate, having an exhaust port; an endless rim having a first edge attached to said cover defining an interior and an exterior region, a second edge, and at least one flow passage from said interior to said exterior regions, said exhaust port being in fluid communication with said interior region and said second edge seated on said top surface of said plate when said plate is in a first position; and, a stagnation plate attached to said rim in said interior region between said at least one flow passage and said second edge, said stagnation plate dimensioned so that passages are formed between said rim and said stagnation plate, so as to provide at least one flow path around said stagnation plate to said exhaust port.

Claim 43

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements; a plate drive assembly, comprising: a cam coupled to said plate, said cam having a first rotational position corresponding to said plate being in a first position and a second rotational position corresponding to said plate being in a second position; a cam shaft having a cam end and a motor end, and said cam end being attached to said cam; a motor attached to said motor end of said cam to turn said cam between the first and second rotational positions; and, a motor controller operatively connected to said motor and said computer controller, wherein said computer controller couples said temperature controller, said negative pressure source, said sensor, and said plate drive assembly.

Claim 44

A thermal conditioning apparatus comprising: an enclosure having an opening for inserting a wafer to be thermally conditioned, said enclosure having supporting elements for a plate having a top surface, said plate having a thermal conditioning element; a temperature controller coupled to said thermal conditioning element to control the temperature of the top surface of said plate; a computer controller coupled to said temperature controller for controlling said temperature controller; at least three support members each having a proximal end and a longitudinal axis and at least one of said support members containing a bore extending from said proximal end along said longitudinal axis of said support member, said support members being mounted in said top surface with each said proximal end thereof extending beyond said top surface; a negative pressure source connected by a port in said plate with said at least one bore; at least three lift elements having contacting ends disposed through and movable relative to said top surface of said plate; a sensor positioned to detect the presence of material on at least one of said contacting ends of said lift elements; a plate drive assembly, comprising: a cam coupled to said plate, said cam having a first rotational position corresponding to said plate being in a first position and a second rotational position corresponding to said plate being in a second position; a cam shaft having a cam end and a motor end, and said cam end being attached to said cam; a motor attached to said motor end of said cam to turn said cam between the first and second rotational positions; and, a motor controller operatively connected to said motor and said computer controller, wherein said computer controller couples said temperature controller, said negative pressure source, said sensor, and said plate drive assembly.