Vacuum suction mechanism for semiconductor substrate

Abstract

Abstract PURPOSE:To minimize the contact areas between suction parts and a semiconductor substrate and to contrive a reduction in the attachment of dust to the substrate rear by a method wherein the substrate is attracted by a plurality or the suction parts arranged concentrically. CONSTITUTION:A semiconductor substrate 1 positioned to have its center on a vacuum suction mechanism base 2 by other means is attached by a plurality of vacuum suction parts 3, each having a suction hole 4, in the vicinity of the outer periphery of this substrate 1. The contact areas between this substrate 1 and the vacuum suction parts 3 are each constant and the minimum regardless of the aperture of the substrate and the vicinity of the outer periphery of the substrate is attracted. Accordingly, even though the base 2 is rotated, the attraction of the substrate 1 to the vacuum suction parts 3 is hard to be affected by the centrifugal force and is well maintained. Thereby, dissolution of the problem of dust to be attached to the substrate rear can be contrived.

Inventors

• 👤 Shinsui Saruwatari
• 👤 新水 猿渡

Bibliographic Details