US5516367A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chemical vapor deposition chamber with a purge guide
Assignee: Applied Materials Inc
•
Filing: 1994-11-21
•
Granted: 1996-05-14
•
Expires: 2014-11-21
Abstract
Abstract Vacuum CVD chambers are disclosed which provide a more uniformly deposited thin film on a substrate. The chamber susceptor mount for the substrate is heated resistively with a single coil firmly contacting the metal of the susceptor on all sides, providing uniform temperatures across the susceptor mount for a substrate. A purge gas line is connected to openings in the susceptor outside of the periphery of the substrate to prevent edge and backside contamination of the substrate. A vacuum feed line mounts the substrate to the susceptor plate during processing. A refractory purge guide, or a plurality of placement pins, maintain a fixed gap passage for the purge gases to pass alongside the edge of the wafer and into the processing area of the chamber. An exhaust pumping plate improves the uniformity of exhaustion of spent gases from the chamber.
Inventors
- 👤 Lawrence C. Lei
- 👤 Ilya Perlov
- 👤 Karl A. Littau
- 👤 Alan F. Morrison
- 👤 Mei Chang
- 👤 Ashok K. Sinha
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 01:33
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/455; C23C16/45519; C23C16/4412; C23C16/45521; C23C16/458; C23C16/4582; C23C16/4583; C23C16/4585; C23C16/46; H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0432; H10P72/50; H10P72/70; H10P72/76; H10P72/7604; H10P72/7606; H10P72/7608; H10P72/7611; H10P72/7614; H10P72/7624; H10P72/7626; Y; Y10; Y10S; Y10S438/00; Y10S438/935
Claims Analysis
Total Claims: 52
Claim 1
Independent Claim
114 words
A chemical vapor deposition chamber comprising a source of precursor gas, a susceptor having a surface for receiving a substrate thereon and a vacuum exhaust system, comprising: (a) a resistance heater mounted within said susceptor; (b) a vacuum feed line through said susceptor connected to a vacuum separate from the chamber exhaust vacuum for holding a substrate to said susceptor; (c) a purge gas line extending through said susceptor and connected to a plurality of openings positioned beyond the edge of a substrate receiving surface on the susceptor; and (d) a purge guide to provide a fixed gap passage for purge gas between said purge guide and said substrate receiving surface on the susceptor.
Claim 2
Dependent Claim
114 words
A chemical vapor deposition chamber comprising a source of precursor gas, a susceptor having a surface for receiving a substrate thereon and a vacuum exhaust system, comprising: (a) a resistance heater mounted within said susceptor; (b) a vacuum feed line through said susceptor connected to a vacuum separate from the chamber exhaust vacuum for holding a substrate to said susceptor; (c) a purge gas line extending through said susceptor and connected to a plurality of openings positioned beyond the edge of a substrate receiving surface on the susceptor; and (d) a purge guide to provide a fixed gap passage for purge gas between said purge guide and said substrate receiving surface on the susceptor.
Claim 3
Dependent Claim
14 words
A chamber according to claim 1 wherein said resistance heater has a single coil.
Claim 4
Dependent Claim
26 words
A chamber according to claim 2 wherein said resistance heating coil can provide a temperature across the susceptor of from about 250 C. to 650 C.
Claim 5
Dependent Claim
30 words
A chamber according to claim 3 wherein the heating coil can provide a temperature across the susceptor plate from its center to its edge that is constant within +/-2° C.
Claim 6
Dependent Claim
36 words
A chamber according to claim 2 wherein said vacuum feed line is additionally connected to a source of inert gas and a source of reactive gas to control the vacuum and temperature uniformity across the susceptor.
Claim 7
Dependent Claim
50 words
A chamber according to claim 1 wherein the surface of the susceptor has a plurality of openings connected to channels which are connected to a vacuum feed line through said susceptor, and said channels and openings are disposed within the area of the susceptor occupied by the substrate during processing.
Claim 8
Dependent Claim
30 words
A chamber according to claim 6 wherein the susceptor has a plurality of fine grooves beyond the area of the purge gas openings for supporting said purge guide without sticking.
Claim 9
Dependent Claim
45 words
A chamber according to claim 1 wherein a set of placement pins on the susceptor guide a substrate to an optimal position on the susceptor, to fix a gap between the edge of the substrate and the plurality of purge gas openings in the susceptor.
Claim 10
Dependent Claim
49 words
A chamber according to claim 1 further comprising an exhaust plate in said exhaust system having a plurality of small vertical passages that connect to a channel about the whole circumference of the back of said plate so that exhaust gases are more uniformly withdrawn from about said substrate.
Claim 11
Dependent Claim
28 words
A chamber according to claim 1 wherein the susceptor has a face plate affixed thereto having openings that connect to the purge and vacuum lines in said susceptor.
Claim 12
Dependent Claim
37 words
The chemical vapor deposition chamber of claim 1, wherein; the susceptor includes a groove therein; said resistance heating coil is received in said groove; and a channel is received over said coil and affixed to the susceptor.
Claim 13
Dependent Claim
17 words
The chemical vapor deposition chamber of claim 11, wherein said channel is press fit into said groove.
Claim 14
Dependent Claim
16 words
The chemical vapor deposition chamber of claim 11, wherein said channel is welded to the susceptor.
Claim 15
Dependent Claim
155 words
A chemical vapor deposition chamber comprising a source of precursor gas, a susceptor having a surface for receiving a substrate thereon and a vacuum exhaust system, comprising: (a) a heater mounted within said susceptor; (b) a vacuum feed line through said susceptor connected to a vacuum separate from the chamber exhaust vacuum for mounting a substrate to said susceptor; (c) a purge gas line extending through said susceptor and connected to a plurality of openings extending through the susceptor at a position beyond the edge of the substrate receiving surface; (d) means to provide a fixed gap passage for purge gas with said substrate; (e) a refractory purge guide supported on said susceptor and providing a fixed gap between said susceptor and the substrate to provide a purge gas passage; and (f) said susceptor including a plurality of fine grooves beyond the area of the purge gas openings for supporting said purge guide without sticking.
Claim 16
Dependent Claim
155 words
A chemical vapor deposition chamber comprising a source of precursor gas, a susceptor having a surface for receiving a substrate thereon and a vacuum exhaust system, comprising: (a) a heater mounted within said susceptor; (b) a vacuum feed line through said susceptor connected to a vacuum separate from the chamber exhaust vacuum for mounting a substrate to said susceptor; (c) a purge gas line extending through said susceptor and connected to a plurality of openings extending through the susceptor at a position beyond the edge of the substrate receiving surface; (d) means to provide a fixed gap passage for purge gas with said substrate; (e) a refractory purge guide supported on said susceptor and providing a fixed gap between said susceptor and the substrate to provide a purge gas passage; and (f) said susceptor including a plurality of fine grooves beyond the area of the purge gas openings for supporting said purge guide without sticking.
Claim 17
Dependent Claim
56 words
The chamber of claim 2, wherein said vacuum feed line communicates with at least one groove in the substrate receiving surface of the susceptor; a source of reactive gas is ported to said vacuum feed line; and reactive gas is supplied from the reactive gas source to the vacuum feed line and thus to said groove.
Claim 18
Dependent Claim
56 words
The chamber of claim 2, wherein said vacuum feed line communicates with at least one groove in the substrate receiving surface of the susceptor; a source of inert gas is ported to said vacuum feed line; and inert gas is supplied from the inert gas source to the vacuum feed line and thus to said groove.
Claim 19
Dependent Claim
62 words
A chemical vapor deposition chamber including a gas supply, a susceptor and an exhaust system, comprising: (a) a purge gas line extending through the susceptor and connected to a plurality of openings positioned beyond the edge of a substrate when mounted on the susceptor, and (b) a purge guide to provide a fixed gap passage for purge gas flowing past the substrate.
Claim 20
Dependent Claim
62 words
A chemical vapor deposition chamber including a gas supply, a susceptor and an exhaust system, comprising: (a) a purge gas line extending through the susceptor and connected to a plurality of openings positioned beyond the edge of a substrate when mounted on the susceptor, and (b) a purge guide to provide a fixed gap passage for purge gas flowing past the substrate.
Claim 21
Dependent Claim
28 words
The chemical vapor deposition chamber of claim 17, further including; a purge gas channel extending circumferentially about the edge of the substrate and providing said fixed gap passage.
Claim 22
Dependent Claim
42 words
The chemical vapor deposition chamber of claim 17, wherein said purge guide includes a lip portion extending inwardly of the substrate receiving surface of the susceptor to provide said fixed gap passage between said lip portion and a surface of the substrate.
Claim 23
Dependent Claim
18 words
The chemical vapor deposition chamber of claim 18, further including a resistance heating coil mounted within the susceptor.
Claim 24
Dependent Claim
36 words
The chemical vapor deposition chamber of claim 18, further including a vacuum feed line extending through the susceptor and providing a vacuum to at least one groove disposed in the substrate receiving surface of the susceptor.
Claim 25
Dependent Claim
21 words
The chemical vapor deposition chamber of claim 21, further including a source of inert gas ported to said vacuum feed line.
Claim 26
Dependent Claim
21 words
The chemical vapor deposition chamber of claim 21, further including a source of reactive gas ported to said vacuum feed line.
Claim 27
Dependent Claim
27 words
The chemical vapor deposition chamber of claim 21, further including a source of reactive gas and a source of inert gas ported to said vacuum feed line.
Claim 28
Dependent Claim
42 words
The chemical vapor deposition chamber of claim 17, wherein the purge guide includes a lip portion extending inwardly of the substrate receiving surface of the susceptor to provide said fixed gap passage between said lip portion and a surface of the substrate.
Claim 29
Dependent Claim
22 words
The chemical vapor deposition chamber of claim 25, wherein said lip overhangs the upper surface of a substrate received on the susceptor.
Claim 30
Dependent Claim
40 words
The chemical vapor deposition chamber of claim 17 further including; a passage extending inwardly of the susceptor and forming an ambient pressure well terminating immediately below the substrate receiving surface of the susceptor; and a thermocouple received in said well.
Claim 31
Dependent Claim
93 words
A chemical vapor deposition chamber comprising a source of process gas, a heated susceptor and a vacuum exhaust system, comprising: (a) a purge gas source providing a purge gas to the periphery of a substrate received on the susceptor; (b) a purge guide for providing a fixed gap passage along the surface of the substrate for purge gas flowing past the substrate; and wherein (c) said purge gas source provides the purge gas through the susceptor at a position between the edge of a substrate received on the susceptor and said purge guide.
Claim 32
Dependent Claim
93 words
A chemical vapor deposition chamber comprising a source of process gas, a heated susceptor and a vacuum exhaust system, comprising: (a) a purge gas source providing a purge gas to the periphery of a substrate received on the susceptor; (b) a purge guide for providing a fixed gap passage along the surface of the substrate for purge gas flowing past the substrate; and wherein (c) said purge gas source provides the purge gas through the susceptor at a position between the edge of a substrate received on the susceptor and said purge guide.
Claim 33
Dependent Claim
22 words
The chemical vapor deposition chamber of claim 28, wherein said fixed gap is located above the deposition receiving surface of the substrate.
Claim 34
Dependent Claim
39 words
The chemical vapor deposition chamber of claim 28, wherein said purge guide includes a lip portion; and said lip portion cooperates with the deposition receiving surface of a substrate received on the susceptor to provide said fixed gap passage.
Claim 35
Dependent Claim
30 words
The chemical vapor deposition chamber of claim 28, wherein: the susceptor includes a purge guide receiving portion thereon; and said purge guide receiving portion includes at least one groove therein.
Claim 36
Dependent Claim
86 words
A chemical vapor deposition chamber comprising a source of process gas, a susceptor having a substrate receiving surface thereon and an exhaust system, comprising: (a) a purge gas source providing a purge gas to the periphery of a substrate received on the susceptor; (b) a purge gas passage located adjacent to the edge of a substrate received on the susceptor; and wherein (c) said purge gas source provides the purge gas between the edge of a substrate received on the susceptor and the purge gap passage.
Claim 37
Dependent Claim
86 words
A chemical vapor deposition chamber comprising a source of process gas, a susceptor having a substrate receiving surface thereon and an exhaust system, comprising: (a) a purge gas source providing a purge gas to the periphery of a substrate received on the susceptor; (b) a purge gas passage located adjacent to the edge of a substrate received on the susceptor; and wherein (c) said purge gas source provides the purge gas between the edge of a substrate received on the susceptor and the purge gap passage.
Claim 38
Dependent Claim
39 words
The chemical vapor deposition chamber of claim 32, wherein said purge gas source includes a gas supply, a plurality of purge gas ports, and a purge gas line extending between said purge gas ports and said purge gas source.
Claim 39
Dependent Claim
20 words
The chemical vapor deposition chamber of claim 33, wherein said purge gas line extends through the body of said susceptor.
Claim 40
Dependent Claim
29 words
The chemical vapor deposition chamber of claim 33, wherein said purge gas ports include at least 120 individual ports spaced evenly about the perimeter of the substrate receiving surface.
Claim 41
Dependent Claim
35 words
The chemical vapor deposition chamber of claim 32, further including a purge guide located on the susceptor; and said purge gas channel is located between said purge guide and a substrate received on the susceptor.
Claim 42
Dependent Claim
18 words
The chemical vapor deposition chamber of claim 36, wherein said purge guide includes an inwardly projecting lip portion.
Claim 43
Dependent Claim
21 words
The chemical vapor deposition chamber of claim 37, wherein said lip overhangs the edge of a substrate received on the susceptor.
Claim 44
Dependent Claim
31 words
The chemical vapor deposition chamber of claim 36, further including: a purge guide receiving surface on the susceptor; and at least one groove extending inwardly of said purge guide receiving surface.
Claim 45
Dependent Claim
19 words
The chemical vapor deposition chamber of claim 32, wherein said susceptor is provided from a solid block of metal.
Claim 46
Dependent Claim
32 words
The chemical vapor deposition chamber of claim 40, wherein said susceptor includes a groove therein; a heating element is received in said groove; and a cover is disposed over said heating element.
Claim 47
Dependent Claim
17 words
The chemical vapor deposition chamber of claim 41, wherein said cover is press fit into said groove.
Claim 48
Dependent Claim
24 words
The chemical vapor deposition chamber of claim 32, wherein said exhaust system includes a plurality of spaced apertures ported to a chamber exhaust manifold.
Claim 49
Dependent Claim
19 words
The chemical vapor deposition chamber of claim 43, wherein said manifold extends circumferentially within the chamber less than 360°.
Claim 50
Dependent Claim
17 words
The chemical vapor deposition chamber of claim 28, wherein said purge guide is received on the susceptor.
Claim 51
Dependent Claim
34 words
The chemical vapor deposition chamber of claim 43, wherein said exhaust manifold extends around the inner perimeter of the chamber and said apertures are evenly spaced about the inner perimeter of said exhaust manifold.
Claim 52
Dependent Claim
41 words
The chemical vapor deposition chamber of claim 25, wherein: the susceptor includes a purge guide receiving surface thereon; said purge guide receiving surface includes at least one grove therein; and said purge guide is received on said purse guide receiving portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-14 | 1999-11-13 | 2000-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-14 | 2003-11-13 | 2004-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-14 | 2007-11-13 | 2008-05-14 | $7700.00 | Window Closed / Lapsed |