Image recording process with improved image tolerances using embedded AR coatings

Claim 2

A process for forming a new pattern on a substrate comprising: a) providing a substrate having a surface with features having a non-uniform reflectivity of electromagnetic energy defined by a previous antireflective pattern formed by an antireflective layer extending below the surface of said substrate, said substrate having a substantially planar surface, b) applying an image recording material directly to said substantially planar surface, said image recording material being sensitive to electromagnetic energy, said image recording material having a thickness providing a high degree of reflectivity outside of said pattern of said antireflective layer, c) employing said features with said non-uniform reflectivity of electromagnetic energy in a maskless step to delineate said new pattern in said image recording material by non-uniform reflectivity of electromagnetic energy from said previous pattern of said antireflective layer to provide variable recording of said new pattern in correspondence with said pattern of said antireflective layer in said image recording material because said thickness of said image recording material is such that destructive interference occurs in said image recording material applied directly to said substrate with exposure of said image recording material above said pattern.

Claim 3

The process of patterning in accordance with claim 1 whereby self-corrected matched maskless patterning is provided.

Claim 4

A process for forming a pattern on a device comprising: starting with a substrate with an opening therein with an AntiReflection Coating ARC layer formed over said substrate including said opening, wherein said ARC layer is partially planarized at the surface of said ARC layer, performing a superficial blanket etching of said ARC layer to provide initial planarization of said ARC layer over said opening, completing removal of said ARC layer outside of said opening, coating said device with a Single Layer photoResist (SLR) layer covering said substrate, said SLR layer having a thickness providing a high degree of reflectivity where coated directly on said substrate and having a low degree reflectivity from said SLR layer over said ARC layer in said opening, exposing said SLR layer in a maskless step to a blanket light exposure, said blanket light exposure being selectively heavily absorbed in said ARC layer beneath said SLR layer causing full exposure of said SLR layer above said ARC layer and said light being reflected from regions of said SLR layer outside of said opening coated directly on said substrate causing little exposure of said regions of said SLR layer outside of said opening because said thickness of said SLR layer is such that destructive interference occurs in portions of said SLR layer coated directly on said substrate, and removing said SLR layer above said ARC layer which has received full exposure to said blanket light exposure.

Claim 5

A process for forming a pattern on a device comprising: starting with a substrate with an opening therein with an AntiReflection Coating ARC layer formed over said substrate including said opening, wherein said ARC layer is partially planarized at the surface of said ARC layer, performing a superficial blanket etching of said ARC layer to provide initial planarization of said ARC layer over said opening, completing removal of said ARC layer outside of said opening, coating said device with a Single Layer photoResist (SLR) layer covering said substrate, said SLR layer having a thickness providing a high degree of reflectivity where coated directly on said substrate and having a low degree reflectivity from said SLR layer over said ARC layer in said opening, exposing said SLR layer in a maskless step to a blanket light exposure, said blanket light exposure being selectively heavily absorbed in said ARC layer beneath said SLR layer causing full exposure of said SLR layer above said ARC layer and said light being reflected from regions of said SLR layer outside of said opening coated directly on said substrate causing little exposure of said regions of said SLR layer outside of said opening because said thickness of said SLR layer is such that destructive interference occurs in portions of said SLR layer coated directly on said substrate, and removing said SLR layer above said ARC layer which has received full exposure to said blanket light exposure.

Claim 6

The process of claim 3 wherein said ARC layer wherein said SLR layer has been formed into a mask with a thickness T providing maximum reflectivity outside of said opening.

Claim 7

The process of claim 3 wherein said ARC layer wherein said SLR layer has been formed into a mask with a thickness T wherein for the practice of self-corrected optical lithographic printing, the condition must be satisfied, as follows: 2·nT≦δ, where T is the photoresist thickness n is the refractive index of the photoresist δ is the coherence distance in vacuum due to both temporal and spatial coherence.

Claim 8

The process of claim 3 wherein said ARC layer wherein: said SLR layer has been formed into a mask with a thickness T providing maximum reflectivity outside of said opening, and said light exposure is provided by a light source with a narrow optical bandwidth to provide selective exposure of said photoresist above said ARC layer.

Claim 9

The process of claim 3 wherein said ARC layer wherein said SLR layer has been formed into a mask with a thickness T wherein for the practice of self-corrected optical lithographic printing, the condition must be satisfied, as follows: 2·nT≦δ, where T is the photoresist thickness n is the refractive index of the photoresist δ is the coherence distance in vacuum due to both temporal and spatial coherence, and said light exposure is provided by a light source with a narrow optical bandwidth to provide selective exposure of said photoresist above said ARC layer.

Claim 10

The process of claim 2 wherein: said SLR layer has been formed into a mask with a thickness T providing maximum reflectivity outside of said opening, said light exposure is provided by a light source with a narrow optical bandwidth to provide selective exposure of said photoresist above said ARC layer, and the thickness of said SLR is selected to match the wavelength of said light source directed upon said ARC layer.

Claim 11

The process of claim 2 wherein: said SLR layer has been formed into a mask with a thickness T providing maximum reflectivity outside of said opening, said light exposure is provided by a light source with an optical wavelength of about 200 nm, and the thickness of said SLR is selected to match said 200 nm wavelength of said light source directed upon the said ARC layer.

Claim 12

The process of claim 3 wherein said ARC layer wherein said SLR layer has been formed into a mask with a thickness T wherein for the practice of self-corrected optical lithographic printing, the condition must be satisfied, as follows: 2·nT≦δ, where T is the photoresist thickness, n is the refractive index of the photoresist, δ is the coherence distance in vacuum due to both temporal and spatial coherence, and said light exposure is provided by a light source with a narrow optical bandwidth to provide selective exposure of said photoresist above said ARC layer, said light source being selected from a group consisting of as follows: a mercury arc light source can be used with a G, H, and an I line; and an excimer laser providing a substantially monochromatic, partially coherent light source, and the thickness of said SLR is selected to match the wavelength of said light source directed upon the said ARC layer.

Claim 13

A process for forming a two dimensional grating on a semiconductor substrate, said substrate being coated with a first layer of photoresist, the steps of said process comprising: imaging a first image comprising a one dimensional grating on said substrate, recording said one dimensional grating in said first layer of photoresist and opening a window in the pattern of said one dimensional grating in said photoresist, modifying a property of said substrate with said first layer of photoresist with said recorded one dimensional grating by forming an antireflective coating ARC layer in said substrate through the pattern formed by said window, applying a second layer of photoresist, covering said substrate having a thickness providing high reflectivity where coated directly on said substrate and low reflectivity from said photoresist layer over said ARC layer in said opening, imaging a second image comprising a complementary one dimensional grating on said substrate in a maskless step, recording said complementary one dimensional grating in said second layer of photoresist by light exposure being selectively heavily absorbed in said ARC layer beneath said second layer of photoresist causing full exposure of said second layer of photoresist above said ARC layer and light being reflected from said second layer of photoresist coated directly on said substrate outside of said opening because said thickness of said photoresist layer is such that destructive interference occurs in said photoresist coated directly on said substrate causes little exposure of said second layer of photoresist aside from said opening, and removing said second layer of photoresist above said ARC layer which has received full exposure to said complementary one dimensional grating, whereby a two dimensional grating is produced on said substrate taking advantage of the modification of a property of the substrate predicated by the first image.

Claim 14

A process for forming a two dimensional grating on a semiconductor substrate, said substrate being coated with a first layer of photoresist, the steps of said process comprising: imaging a first image comprising a one dimensional grating on said substrate, recording said one dimensional grating in said first layer of photoresist and opening a window in the pattern of said one dimensional grating in said photoresist, modifying a property of said substrate with said first layer of photoresist with said recorded one dimensional grating by forming an antireflective coating ARC layer in said substrate through the pattern formed by said window, applying a second layer of photoresist, covering said substrate having a thickness providing high reflectivity where coated directly on said substrate and low reflectivity from said photoresist layer over said ARC layer in said opening, imaging a second image comprising a complementary one dimensional grating on said substrate in a maskless step, recording said complementary one dimensional grating in said second layer of photoresist by light exposure being selectively heavily absorbed in said ARC layer beneath said second layer of photoresist causing full exposure of said second layer of photoresist above said ARC layer and light being reflected from said second layer of photoresist coated directly on said substrate outside of said opening because said thickness of said photoresist layer is such that destructive interference occurs in said photoresist coated directly on said substrate causes little exposure of said second layer of photoresist aside from said opening, and removing said second layer of photoresist above said ARC layer which has received full exposure to said complementary one dimensional grating, whereby a two dimensional grating is produced on said substrate taking advantage of the modification of a property of the substrate predicated by the first image.