US4418467A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor wafer with alignment marks and method for manufacturing semiconductor device
Assignee: Toshiba Corp
•
Filing: 1982-06-18
•
Granted: 1983-12-06
•
Expires: 2002-06-18
Abstract
Abstract A method is provided for manufacturing a semiconductor device, comprising the steps of forming alignment marks on a side surface of a semiconductor wafer, aligning the semiconductor wafer with a unit apparatus for manufacturing the semiconductor device utilizing the alignment mark, and processing the semiconductor wafer with the unit apparatus. The alignment mark attached on the side surface of the wafer can be identified even if chip patterns or various films are formed on the wafer.
Inventors
- 👤 Hiroshi Iwai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 05:23
CPC Classifications
G; G03; G03F; G03F9/00; G03F9/70; G03F9/7073; G03F9/7084; G03F9/7003; G03F9/7007; G03F9/7011; G03F9/7076; H; H10; H10P; H10P95/00; H10W; H10W46/00; H10W46/101; H10W46/103; H10W46/201; Y; Y10; Y10S; Y10S438/00; Y10S438/975; Y10T; Y10T428/00; Y10T428/21; Y10T428/219
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
57 words
A method for manufacturing a semiconductor device, comprising the steps of: forming a numeral, letter, symbol or combination thereof as alignment marks on a side surface of a semiconductor wafer, aligning said semiconductor wafer with a unit apparatus for manufacturing said semiconductor device by utilizing said alignment marks, and processing said semiconductor wafer with said unit apparatus.
Claim 2
Independent Claim
57 words
A method for manufacturing a semiconductor device, comprising the steps of: forming a numeral, letter, symbol or combination thereof as alignment marks on a side surface of a semiconductor wafer, aligning said semiconductor wafer with a unit apparatus for manufacturing said semiconductor device by utilizing said alignment marks, and processing said semiconductor wafer with said unit apparatus.
Claim 3
Dependent Claim
26 words
A method according to claim 1, wherein said unit apparatus comprises an exposure apparatus, and said step for processing said semiconductor wafer comprises a photolithography step.
Claim 4
Dependent Claim
30 words
A method according to claim 1, wherein said unit apparatus comprises an energy beam irradiating apparatus, and said step for processing said semiconductor wafer comprises an energy beam irradiation step.
Claim 5
Dependent Claim
26 words
A method according to claim 1, wherein said unit apparatus comprises an ion-implanting apparatus, and said step for processing said semiconductor wafer comprises an ion-implantation step.
Claim 6
Dependent Claim
26 words
A method according to claim 1, wherein said unit apparatus comprises a dicing apparatus, and said step for processing said semiconductor wafer comprises a dicing step.
Claim 7
Independent Claim
60 words
A method for manufacturing a semiconductor device, comprising the steps of: forming a numeral, letter, symbol or combination thereof as alignment marks on a side surface of a semiconductor wafer, aligning said semiconductor wafer with a probe of an apparatus for determining properties thereof by utilizing said alignment marks, and determining the properties of said semiconductor wafer with said apparatus.
Claim 8
Independent Claim
60 words
A method for manufacturing a semiconductor device, comprising the steps of: forming a numeral, letter, symbol or combination thereof as alignment marks on a side surface of a semiconductor wafer, aligning said semiconductor wafer with a probe of an apparatus for determining properties thereof by utilizing said alignment marks, and determining the properties of said semiconductor wafer with said apparatus.
Claim 9
Independent Claim
50 words
A method for manufacturing a semiconductor device, comprising the steps of: forming a numeral, letter, symbol or combination thereof as an information mark on a side surface of a semiconductor wafer, automatically reading said information mark, and processing said semiconductor wafer in accordance with read information of said information mark.
Claim 10
Independent Claim
50 words
A method for manufacturing a semiconductor device, comprising the steps of: forming a numeral, letter, symbol or combination thereof as an information mark on a side surface of a semiconductor wafer, automatically reading said information mark, and processing said semiconductor wafer in accordance with read information of said information mark.
Claim 11
Dependent Claim
26 words
A semiconductor wafer with a numeral, letter, symbol or combination thereof as a mark formed on a side surface thereof for manufacturing a semiconductor device therefrom.
Claim 12
Dependent Claim
26 words
A semiconductor wafer with a numeral, letter, symbol or combination thereof as a mark formed on a side surface thereof for manufacturing a semiconductor device therefrom.
Claim 13
Dependent Claim
29 words
A semiconductor wafer according to claim 8, wherein said mark comprises alignment marks utilized for alignment of said semiconductor wafer with a unit apparatus for manufacturing a semiconductor device.
Claim 14
Dependent Claim
33 words
A semiconductor wafer according to claim 8, wherein said mark comprises alignment marks utilized for alignment of said semiconductor wafer with a probe for an apparatus for determining properties of said semiconductor wafer.
Claim 15
Dependent Claim
22 words
A semiconductor wafer according to claim 8, wherein said mark is an information mark according to which said semiconductor wafer is processed.
Claim 16
Independent Claim
122 words
A method for manufacturing a semiconductor device, comprising the steps of: forming at least two numerals, letters, symbols or combination thereof as a pair of alignment marks on a side surface of a semiconductor wafer; placing the semiconductor wafer on a wafer chuck which is part of a unit apparatus for manufacturing a semiconductor device, that unit apparatus including an optical column and a pair of microscopes placed at predetermined positions relative to the optical column; observing the chip through the microscopes and moving the wafer chuck until the alignment marks on the semiconductor wafer are aligned with the microscopes; moving the aligned wafer directly below the optical column; and forming a chip pattern on the semiconductor wafer with the optical column.
Claim 17
Independent Claim
122 words
A method for manufacturing a semiconductor device, comprising the steps of: forming at least two numerals, letters, symbols or combination thereof as a pair of alignment marks on a side surface of a semiconductor wafer; placing the semiconductor wafer on a wafer chuck which is part of a unit apparatus for manufacturing a semiconductor device, that unit apparatus including an optical column and a pair of microscopes placed at predetermined positions relative to the optical column; observing the chip through the microscopes and moving the wafer chuck until the alignment marks on the semiconductor wafer are aligned with the microscopes; moving the aligned wafer directly below the optical column; and forming a chip pattern on the semiconductor wafer with the optical column.
References Cited (Backward Citations)
US4345836A
Cited
US4376581A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-12-05 | 1987-06-06 | 1987-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-12-05 | 1991-06-06 | 1991-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-12-05 | 1995-06-06 | 1995-12-06 | $7700.00 | Window Closed / Lapsed |