Patent US5873948A successfully refreshed from Google Patents.
US5873948A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for removing etch residue material
Assignee: SK Hynix Inc
•
Filing: 1997-06-24
•
Granted: 1999-02-23
•
Expires: 2017-06-24
Abstract
Abstract A method for removing etch residue material in which the removing process is simple, and the metal is prevented from being corroded or damaged. The method for removing etch residue materials and photoresist after carrying out a dry etching includes the steps of preparing a dry chemical by using one or more gas compounds, and removing the etch residue materials by raising the dry chemical above a critical point, wherein the dry chemical comprises carbon dioxide gas and one or more gases selected from a group consisting of DMSO (dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone).
Inventors
- 👤 Jae-Jeong Kim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:47
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/20; H10P70/27; B; B08; B08B; B08B7/00; B08B7/0028; C; C11; C11D; C11D7/00; C11D7/02; C11D7/22; C11D7/26; C11D7/261; H10P70/273; C11D2111/00; C11D2111/10; C11D2111/14; C11D2111/22
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
180 words
A method for removing residue materials comprising carbon or fluorine-containing polymers from a substrate, the method comprising the steps of: etching a layer on the substrate, wherein the carbon or fluorine-containing polymers are formed on the substrate as by-products of the etching step; introducing a dry chemical to the substrate at a first temperature and first pressure, wherein the dry chemical dissolves the carbon or fluorine-containing polymers at a first rate at the first temperature and first pressure, wherein the dry chemical comprises carbon dioxide gas and one or more gases selected from the group consisting of DMSO (dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone); and raising the dry chemical to a second temperature and second pressure, wherein the second temperature and second pressure are above a critical point for the dry chemical, wherein the dry chemical dissolves the carbon or fluorine-containing polymers at a second rate at the second temperature and second pressure, wherein the second rate is greater than the first rate, and wherein the residue materials comprising carbon or fluorine-containing polymers are removed from the substrate.
Claim 2
Independent Claim
180 words
A method for removing residue materials comprising carbon or fluorine-containing polymers from a substrate, the method comprising the steps of: etching a layer on the substrate, wherein the carbon or fluorine-containing polymers are formed on the substrate as by-products of the etching step; introducing a dry chemical to the substrate at a first temperature and first pressure, wherein the dry chemical dissolves the carbon or fluorine-containing polymers at a first rate at the first temperature and first pressure, wherein the dry chemical comprises carbon dioxide gas and one or more gases selected from the group consisting of DMSO (dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone); and raising the dry chemical to a second temperature and second pressure, wherein the second temperature and second pressure are above a critical point for the dry chemical, wherein the dry chemical dissolves the carbon or fluorine-containing polymers at a second rate at the second temperature and second pressure, wherein the second rate is greater than the first rate, and wherein the residue materials comprising carbon or fluorine-containing polymers are removed from the substrate.
Claim 3
Dependent Claim
23 words
The method of claim 1, wherein the substrate comprises a semiconductor substrate, wherein the residue materials are by-products of a dry etching process.
Claim 4
Dependent Claim
19 words
The method of claim 1, wherein the second temperature and second pressure are above 31° C. and 72.9 atmospheres.
Claim 5
Dependent Claim
24 words
The method of claim 2, wherein the residue materials comprise compounds selected from the group consisting of CF, CF 2 and CF 3 .
Claim 6
Independent Claim
120 words
A method for removing residue materials comprising carbon or fluorine-containing polymers from a substrate, the method comprising the steps of: etching a layer on the substrate, wherein the carbon or fluorine-containing polymers are formed on the substrate as by-products of the etching step; introducing a dry chemical to the substrate, wherein the dry chemical comprises carbon dioxide gas and one or more gases selected from the group consisting of DMSO dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone); and controlling a temperature and pressure of the dry chemical so that one or more of the gases of the dry chemical is above a critical point of the dry chemical, wherein the carbon or fluorine-containing polymers are removed from the substrate.
Claim 7
Independent Claim
120 words
A method for removing residue materials comprising carbon or fluorine-containing polymers from a substrate, the method comprising the steps of: etching a layer on the substrate, wherein the carbon or fluorine-containing polymers are formed on the substrate as by-products of the etching step; introducing a dry chemical to the substrate, wherein the dry chemical comprises carbon dioxide gas and one or more gases selected from the group consisting of DMSO dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone); and controlling a temperature and pressure of the dry chemical so that one or more of the gases of the dry chemical is above a critical point of the dry chemical, wherein the carbon or fluorine-containing polymers are removed from the substrate.
Claim 8
Dependent Claim
45 words
The method of claim 5, wherein one of the gases of the dry chemical has an absorption coefficient for the carbon or fluorine-containing polymers above the critical point that is greater than an absorption coefficient for the carbon or fluorine-containing polymers below the critical point.
Claim 9
Dependent Claim
12 words
The method of claim 5, wherein the residue materials further comprises photoresist.
Claim 10
Dependent Claim
12 words
The method of claim 5, wherein the substrate comprises a semiconductor substrate.
Claim 11
Dependent Claim
35 words
The method of claim 8, wherein the etching step comprises dry etching a layer on the semiconductor substrate, wherein residue materials are produced on the semiconductor substrate as a result of the dry etching step.
Claim 12
Dependent Claim
12 words
The method of claim 8, wherein the residue materials further comprises photoresist.
Claim 13
Independent Claim
115 words
A method of removing residue materials containing carbon or fluorine polymers from a substrate in a chamber, the method comprising the steps of: etching a layer on the substrate, wherein the residue materials containing carbon or fluorine-containing polymers are formed on the substrate as by-products of the etching step; injecting a gas comprising carbon dioxide and one or more gases selected from the group consisting of DMSO (dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone) into the chamber; and controlling a temperature and pressure of the carbon dioxide gas in the chamber to above about 31° C. and about 72.9 atmospheres, wherein the residue materials containing carbon or fluorine-containing polymers are removed from the substrate.
Claim 14
Independent Claim
115 words
A method of removing residue materials containing carbon or fluorine polymers from a substrate in a chamber, the method comprising the steps of: etching a layer on the substrate, wherein the residue materials containing carbon or fluorine-containing polymers are formed on the substrate as by-products of the etching step; injecting a gas comprising carbon dioxide and one or more gases selected from the group consisting of DMSO (dimethyl sulfoxide), DMFA (dimethyl formamide), and THF (phentydrone) into the chamber; and controlling a temperature and pressure of the carbon dioxide gas in the chamber to above about 31° C. and about 72.9 atmospheres, wherein the residue materials containing carbon or fluorine-containing polymers are removed from the substrate.
Claim 15
Dependent Claim
23 words
The method of claim 11, wherein the substrate comprises a semiconductor substrate, wherein the residue materials are by-products of a dry etching process.
Claim 16
Dependent Claim
25 words
The method of claim 11, wherein the residue materials comprise compounds selected from the group consisting of CF, CF 2 , and CF 3 .
Claim 17
Dependent Claim
12 words
The method of claim 11, wherein the residue materials further comprises photoresist.
Claim 18
Dependent Claim
12 words
The method of claim 11, wherein the substrate comprises a semiconductor substrate.
Claim 19
Dependent Claim
31 words
The method of claim 12, wherein the etching step comprises dry etching a layer on the semiconductor substrate, wherein the residue materials result as a by-product of the dry etch process.
References Cited (Backward Citations)
US4581101A
Cited
US4897154A
Cited
US5007983A
Cited
US4944837A
Cited
US5013366A
Cited
US5068040A
Cited
US5213919A
Cited
US5228950A
Cited
US5306350A
Cited
US5201960A
Cited
US5494521A
Cited
US5356478A
Cited
US5316591A
Cited
US5339844A
Cited
US5456759A
Cited
US5282925A
Cited
US5393712A
Cited
US5476975A
Cited
US5522938A
Cited
US5501761A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-22 | 2002-08-24 | 2003-02-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-22 | 2006-08-24 | 2007-02-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-22 | 2010-08-24 | 2011-02-23 | $7700.00 | Window Closed / Lapsed |