US5863810A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for encapsulating an integrated circuit having a window
Assignee: Sencio BV
•
Filing: 1995-05-03
•
Granted: 1999-01-26
•
Expires: 2015-05-03
Abstract
Abstract A method for encapsulating an integrated semiconductor circuit. The semiconductor circuit is mounted onto the support surface of a so-called lead frame. Connecting wires are attached between the contact pads of the semiconductor circuit and selected parts of the lead frame. A predetermined volume of radiation-transparent plastic is supplied at a side of the semiconductor circuit opposite the side which is attached to the supporting surface, which plastic has a glass temperature lower than the temperature which is used for carrying out step c). A plastic package is produced by means of a mould, which package surrounds at least the semiconductor circuit, the supporting surface, the connecting wires and part of the lead frame.
Inventors
- 👤 Peter Jacobus Kaldenberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:21
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852; H10H20/853; H10F; H10F77/00; H10F77/50; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
155 words
A method for encapsulating an integrated semiconductor circuit, comprising the following sequential steps: a) mounting the semiconductor circuit on a supporting surface of a lead frame; b) attaching connecting wires between contact pads of the semiconductor circuit and the lead frame; c) depositing a volume of radiation-transparent fluid resin on the semiconductor circuit, the resin having a lower glass transition temperature than a temperature to be used in step e), the resin having a consistency during said depositing step such that a substantially spherical layer of resin remains on the semiconductor circuit; d) partially hardening the spherical layer of resin; e) molding a plastic package to surround at least the semiconductor circuit, the supporting surface, the connecting wires and part of the lead frame, thereby encapsulating said semiconductor circuit, such that at least part of the radiation-transparent layer is not covered by said plastic package and forms a radiation transparent window to the semiconductor circuit.
Claim 2
Independent Claim
155 words
A method for encapsulating an integrated semiconductor circuit, comprising the following sequential steps: a) mounting the semiconductor circuit on a supporting surface of a lead frame; b) attaching connecting wires between contact pads of the semiconductor circuit and the lead frame; c) depositing a volume of radiation-transparent fluid resin on the semiconductor circuit, the resin having a lower glass transition temperature than a temperature to be used in step e), the resin having a consistency during said depositing step such that a substantially spherical layer of resin remains on the semiconductor circuit; d) partially hardening the spherical layer of resin; e) molding a plastic package to surround at least the semiconductor circuit, the supporting surface, the connecting wires and part of the lead frame, thereby encapsulating said semiconductor circuit, such that at least part of the radiation-transparent layer is not covered by said plastic package and forms a radiation transparent window to the semiconductor circuit.
References Cited (Backward Citations)
DE143839C
Cited
US3778685A
Cited
JPS58106851A
Cited
US4649418A
Cited
JPS60193345A
Cited
JPS60193364A
Cited
JPS6136957A
Cited
JPS62265771A
Cited
JPS6360561A
Cited
JPS6378557A
Cited
US5045918A
Cited
JPS63213373A
Cited
US4942140A
Cited
US5036024A
Cited
JPH01215068A
Cited
US4881885A
Cited
JPH02229453A
Cited
EP0400176A1
Cited
JPH0311757A
Cited
US5057457A
Cited
US5200367A
Cited
US5331205A
Cited
US5534725A
Cited
US5379186A
Cited
US5585600A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-25 | 2002-07-27 | 2003-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-25 | 2006-07-27 | 2007-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-25 | 2010-07-27 | 2011-01-26 | $7700.00 | Window Closed / Lapsed |