Resin molded charge coupled device package and method for preparation thereof

Claim 1

A resin molded charge coupled device package comprising: a charge coupled device, said charge coupled device having a plurality of bond pads and a light reception region thereon; a lead frame being integrally provided with a paddle and a plurality of leads, said paddle being adapted for mounting said charge coupled device thereon and said leads each comprising an inner lead and an outer lead; a film wall having a polyimide layer and upper and lower adhesive layers formed on upper and lower surfaces of said polyimide layer, respectively, said lower adhesive layer being attached to an upper surface of said charge coupled device for providing a bonding force between said polyimide layer and said charge coupled device, said film wall being attached between said bond pads and said light reception region of said charge coupled device such that it surrounds the light reception region of said charge coupled device, said film wall having a predetermined height; a glass lid for sealing said light reception region and transmitting an outside light to said light reception region, said glass lid being attached to said upper adhesive layer of said film wall; a plurality of metal wires for electrically connecting said bond pads of the charge coupled device to individual inner leads of said lead frame; and a mold resin package body for hermetically sealing said charge coupled device and said inner leads being wire-bonded to said charge coupled device up to a side surface of the glass lid.