US5036024A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation
Assignee: DuPont Toray Specialty Materials KK
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Filing: 1990-09-10
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Granted: 1991-07-30
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Expires: 2010-09-10
Abstract
Abstract Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.
Inventors
- 👤 Katsutoshi Mine
- 👤 Akemi Kogo
- 👤 Kimio Yamakawa
- 👤 Kazumi Nakayoshi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 06:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; H10W74/481; H10W90/00; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
204 words
A method of manufacturing a resin sealed semiconductor device characterized by the fact that at least one semiconductor chip of a semiconductor device is electrically connected to lead wires for external connections by means of electrically conductive connections, covering a surface of said chip and at least a portion of said electrically conductive connections in proximity to said semiconductor chip with a hardenable self-bonding silicone composition, hardening said hardenable self-bonding silicone composition forming a hardened silicone layer being adhered to said semiconductor chip surface and at least the portions of said electrically conductive connections in proximity to said semiconductor chip with said hardening selected from the group consisting of: standing at room temperature, heating infrared irradiation, and electron beam irradiation, irradiating said hardened silicone layer with ultraviolet radiation to form an ultraviolet irradiation processed hardened silicone layer, covering said ultraviolet irradiation processed hardened silicone layer with a sealing resin which adheres to and covers the hardened silicone layer of said semiconductor chip surface and at least the portions of the electrical conducting connections in proximity to said semiconductor chip, and the surface of said ultraviolet irradiation processed hardened silicone layer adheres to and is unified with the sealing resin by which it is covered.
Claim 2
Independent Claim
204 words
A method of manufacturing a resin sealed semiconductor device characterized by the fact that at least one semiconductor chip of a semiconductor device is electrically connected to lead wires for external connections by means of electrically conductive connections, covering a surface of said chip and at least a portion of said electrically conductive connections in proximity to said semiconductor chip with a hardenable self-bonding silicone composition, hardening said hardenable self-bonding silicone composition forming a hardened silicone layer being adhered to said semiconductor chip surface and at least the portions of said electrically conductive connections in proximity to said semiconductor chip with said hardening selected from the group consisting of: standing at room temperature, heating infrared irradiation, and electron beam irradiation, irradiating said hardened silicone layer with ultraviolet radiation to form an ultraviolet irradiation processed hardened silicone layer, covering said ultraviolet irradiation processed hardened silicone layer with a sealing resin which adheres to and covers the hardened silicone layer of said semiconductor chip surface and at least the portions of the electrical conducting connections in proximity to said semiconductor chip, and the surface of said ultraviolet irradiation processed hardened silicone layer adheres to and is unified with the sealing resin by which it is covered.
Claim 3
Dependent Claim
22 words
The method of manufacture in accordance with claim 1, wherein the hardenable silicone composition is a thermally hardenable and addition-reaction-hardenable silicone composition.
Claim 4
Independent Claim
190 words
A method of manufacturing a resin-sealed semiconductor device characterized by the fact that at least one semiconductor chip of the semiconductor device is electrically connected to external lead wires by means of electrically conductive connections, covering a surface of said chip and at least a portion of said electrically conductive connections in proximity to said semiconductor chip with a thermally hardenable self-bonding silicone composition, exposing said thermally hardenable self-bonding silicone composition to ultraviolet radiation forming a hardened silicone layer which adheres to said semiconductor chip surface and at least the portions of said electrically conductive connections in proximity to said semiconductor chips, and with the same process the hardened silicone layer is ultraviolet irradiation processed forming an ultraviolet irradiation processed hardened silicone layer, covering said ultraviolet irradiation processed hardened silicone layer with a sealing resin which adheres to and covers the hardened silicone layer of said semiconductor chip surface and at least the portions of the electrical conducting connections in proximity to said semiconductor chip, and the surface of said ultraviolet irradiation processed hardened silicone layer adheres to and is unified with the sealing resin by which it is covered.
Claim 5
Independent Claim
190 words
A method of manufacturing a resin-sealed semiconductor device characterized by the fact that at least one semiconductor chip of the semiconductor device is electrically connected to external lead wires by means of electrically conductive connections, covering a surface of said chip and at least a portion of said electrically conductive connections in proximity to said semiconductor chip with a thermally hardenable self-bonding silicone composition, exposing said thermally hardenable self-bonding silicone composition to ultraviolet radiation forming a hardened silicone layer which adheres to said semiconductor chip surface and at least the portions of said electrically conductive connections in proximity to said semiconductor chips, and with the same process the hardened silicone layer is ultraviolet irradiation processed forming an ultraviolet irradiation processed hardened silicone layer, covering said ultraviolet irradiation processed hardened silicone layer with a sealing resin which adheres to and covers the hardened silicone layer of said semiconductor chip surface and at least the portions of the electrical conducting connections in proximity to said semiconductor chip, and the surface of said ultraviolet irradiation processed hardened silicone layer adheres to and is unified with the sealing resin by which it is covered.
Claim 6
Dependent Claim
20 words
The method of manufacture in accordance with claim 3, wherein the thermally hardenable self-bonding silicone composition is an addition-reaction-hardenable composition.
References Cited (Backward Citations)
US4523371A
Cited
US4758875A
Cited
JPS5848429A
Cited
JPS5884449A
Cited
JPS5933841A
Cited
EP0124624A1
Cited
JPS59188947A
Cited
JPS60741A
Cited
EP0210442A2
Cited
JPS6269538A
Cited
US4707725A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-29 | 1995-01-28 | 1995-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-29 | 1999-01-28 | 1999-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-29 | 2003-01-28 | 2003-07-30 | $7700.00 | Window Closed / Lapsed |