Magnetic bubble memory device and manufacture thereof

Abstract

Abstract PURPOSE:To offer a magnetic bubble device which has no disconnections of bonding wires and excellent in workability and available for a low cost chip coating, by using ultraviolet ray hardened resin of extremely short hardening time as the chip coating resin. CONSTITUTION:After a chip 2 and bonding wires 3 are contained in a hollow part of the substrate 1, unhardened ultraviolet ray hardened type Si resin 12 is cast, thereafter an acryl resin plate 13 0.1mm. thick which transmits the light of wavelength 250-400nm is placed on the resin 12, next a high pressure mercury lamp is settled, the ultraviolet ray 14 is irradiated through the plate 13 onto the resin 12, and accordingly it is hardened. Thereafter, after incorporating internal and external coils for rotary field drive and connecting the substrate and the lead frame thereto, a transfer mold is performed by using epoxy resin, then a magnetic adjusting plate and a magnetic plate are mounted, and further a shield case is mounted resulting in the formation of a magnetic bubble memory device.

Inventors

• 👤 Yoshiyuki Tsujita
• 👤 辻田　嘉之
• 👤 Toshio Oku
• 👤 奥　俊夫

Bibliographic Details