US5838545A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High performance, low cost multi-chip modle package
Assignee: International Business Machines Corp
•
Filing: 1996-10-17
•
Granted: 1998-11-17
•
Expires: 2016-10-17
Abstract
Abstract A high performance, low cost multi-chip module package using a heatsink as a substrate with thin film wiring techniques or multilayered wiring techniques for interconnection of the chips on the surface of the module and a solder column grid array or solder ball grid array for interconnection to the next level of packaging (printed circuit board). The columns or balls create a space between the board and module with the chips being in the space and provide the required interconnect density.
Inventors
- 👤 Dennis F. Clocher
- 👤 Glenn G. Daves
- 👤 Peter M. Elenius
- 👤 Joseph J. Lisowski
- 👤 Joseph M. Sullivan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:48
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W90/00; H10W72/00; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
145 words
A high performance multi-chip module package comprising: a heatsink having a heat dissipation surface and a chip carrier surface; a plurality of integrated circuit chips bonded to said chip carrier surface of said heatsink; electronic circuitry positioned on said chip carrier surface interconnecting said plurality of integrated circuit chips and interconnecting said plurality of integrated circuit chips to an array of interconnects which interconnect said electronic circuitry and said integrated circuit chips to a next level of packaging; and an array of interconnects bonded to said electronic circuitry on said carrier surface of said heat sink to connect said electronic circuitry and said integrated circuit chips to a next level of packaging, said array of interconnects including interconnect members positioned about the periphery of each of said plurality of integrated circuit chips and between adjacent integrated circuit chips of said plurality of integrated circuit ships.
Claim 2
Dependent Claim
145 words
A high performance multi-chip module package comprising: a heatsink having a heat dissipation surface and a chip carrier surface; a plurality of integrated circuit chips bonded to said chip carrier surface of said heatsink; electronic circuitry positioned on said chip carrier surface interconnecting said plurality of integrated circuit chips and interconnecting said plurality of integrated circuit chips to an array of interconnects which interconnect said electronic circuitry and said integrated circuit chips to a next level of packaging; and an array of interconnects bonded to said electronic circuitry on said carrier surface of said heat sink to connect said electronic circuitry and said integrated circuit chips to a next level of packaging, said array of interconnects including interconnect members positioned about the periphery of each of said plurality of integrated circuit chips and between adjacent integrated circuit chips of said plurality of integrated circuit ships.
Claim 3
Dependent Claim
14 words
The high performance multi-chip module of claim 1 wherein said electronic circuitry is multilayer.
Claim 4
Dependent Claim
45 words
The high performance multi-chip module of claim 1 wherein said interconnect members of said array of interconnects extend from said chip carrier surface of said heat sink a greater distance than said integrated circuit chips, thereby allowing for spacing from a next level of packaging.
References Cited (Backward Citations)
US3675089A
Cited
US4796077A
Cited
US4989117A
Cited
US5399903A
Cited
US5198885A
Cited
US5455448A
Cited
US5371404A
Cited
US5353498A
Cited
US5602720A
Cited
US5675183A
Cited
US5587882A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-16 | 2002-05-18 | 2002-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-16 | 2006-05-18 | 2006-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-16 | 2010-05-18 | 2010-11-17 | $7700.00 | Window Closed / Lapsed |