Hybrid multichip module and methods of fabricating same

Claim 2

A multichip module assembly comprising: an MCM-D having a body portion with a generally planar first side, a spaced plurality of semiconductor chips mounted on said first side, a spaced series of first electrically conductive pads mounted on said first side outwardly of said spaced plurality of semiconductor chips, and a spaced series of first electrically conductive lead members carried on said MCM-D body portion and electrically coupling said first electrically conductive pads to said plurality of semiconductor chips; an MCM-L having a body portion with a generally planar second side, a spaced series of second electrically conductive pads mounted on said second side, and a spaced series of second electrically conductive lead members carried on said MCM-L body portion and electrically coupling said second electrically conductive pads; said MCM-D and MCM-L being in an orientation in which said first and second sides are in a spaced apart, parallel, facing relationship with said first electrically conductive pads; and a spaced series of electrically conductive column members transversely disposed between said first and second sides, said column members supporting said MCM-D and MCM-L in said orientation thereof, with the opposite sides of each column member being conductively secured to a facing pair of said first and second electrically conductive pads; wherein one of said opposite ends of each column member is conductively secured to one of said first electrically conductive pad with relatively high melting point solder.

Claim 3

The assembly according to claim 1, further comprising a heat dissipating device attached to said MCM-D.

Claim 4

The assembly according to claim 1, wherein said column members comprise elongated columns made of solder.

Claim 5

The assembly according to claim 1, wherein the other of said opposite ends of each column member is conductively secured to one of said second electrically conductive pad with relatively low melting point solder.

Claim 6

A multichip module for use with an electronic system, said multichip module comprising: a generally planar substrate having a top side and a bottom side; a generally planar ground plane made of a conductive material and having a top side and a bottom side, said top side of said ground plane being attached onto substantially all of said substrate bottom side; a generally planar dielectric layer having a top side and a bottom side, said top side of said dielectric layer being attached onto substantially all of said ground plane bottom side; a fan-out layer deposited onto said dielectric layer bottom side, comprising a plurality of expanding pitch conductive traces, said conductive traces each having an interior end and an exterior end and said expanding pitch increasing from said interior ends of said conductive traces to said exterior ends of said conductive traces; a plurality of first solder attachment pads, each of said solder attachment pads being conductively attached to one of said exterior ends of said conductive traces; a semiconductor chip having a top side and a bottom side and having circuit attachment points on said top side, each of said circuit attachment points being conductively attached to one of said interior ends of said conductive traces; a generally planar laminated interconnecting means comprising at least one dielectric layer, at least one conductive layer attached to said at least one dielectric layer, said layer having a plurality of conductors, and a second plurality of solder attachment pads attached to said at least one dielectric layer; and a plurality of conductive columns having a first end and a second end, said first end of each of said columns being conductively attached to one of said first plurality of solder attachment pads, and said second end of each of said columns being conductively attached to one of said second plurality of solder attachment pads.

Claim 7

A multichip module for use with an electronic system, said multichip module comprising: a generally planar substrate having a top side and a bottom side; a generally planar ground plane made of a conductive material and having a top side and a bottom side, said top side of said ground plane being attached onto substantially all of said substrate bottom side; a generally planar dielectric layer having a top side and a bottom side, said top side of said dielectric layer being attached onto substantially all of said ground plane bottom side; a fan-out layer deposited onto said dielectric layer bottom side, comprising a plurality of expanding pitch conductive traces, said conductive traces each having an interior end and an exterior end and said expanding pitch increasing from said interior ends of said conductive traces to said exterior ends of said conductive traces; a plurality of first solder attachment pads, each of said solder attachment pads being conductively attached to one of said exterior ends of said conductive traces; a semiconductor chip having a top side and a bottom side and having circuit attachment points on said top side, each of said circuit attachment points being conductively attached to one of said interior ends of said conductive traces; a generally planar laminated interconnecting means comprising at least one dielectric layer, at least one conductive layer attached to said at least one dielectric layer, said layer having a plurality of conductors, and a second plurality of solder attachment pads attached to said at least one dielectric layer; and a plurality of conductive columns having a first end and a second end, said first end of each of said columns being conductively attached to one of said first plurality of solder attachment pads, and said second end of each of said columns being conductively attached to one of said second plurality of solder attachment pads.

Claim 8

A multichip module according to claim 5, further comprising a heat-dissipating device attached to said top surface of said substrate.

Claim 9

A multichip module according to claim 5, wherein said plurality of conductive columns are made of solder.

Claim 10

A multichip module according to claim 5, wherein each of said first solder attachment pads correspond to one of said second solder attachment pads such that each of said conductive columns are generally perpendicular to said substrate.

Claim 11

A multichip module according to claim 5, wherein said first end of each of said columns is conductively attached to one of said first plurality of solder attachment pads with relatively high melting point solder and said second end of each of said columns is conductively attached to one of said second plurality of solder attachment pads with relatively low melting point solder.