Arrangement having multilevel wiring structure used for electronic component module

Claim 1

An arrangement having a multilevel wiring structure used for an electronic component module comprising: a base substrate having first and second surfaces opposed each other, said substrate including first multilevel conductive patterns and first vertical conductive paths for electrical connections exposed to said first and second surfaces, said first vertical conductive paths being located at a peripheral section of said base substrate so as to surround said first multilevel conductive patterns; and a thin film wiring layer having a third surface for mounting a plurality of electronic components having arbitrary sizes at arbitrary positions respectively, and a fourth surface formed on said first surface of said base substrate, said thin film wiring layer including second multilevel conductive patterns having portions for electrical connections exposed to said third and fourth surfaces; wherein said portions for electrical connections are selected such that electrical signals and power supply voltages supplied from said base substrate are applied to said electronic components through said thin film wiring layer; and wherein said first multilevel conductive patterns include first and second potential level conductive layers insulated from each other, a plurality of second vertical conductive paths electrically connected to said first potential level conductive layers so as to provide first end portions exposed to said first surface of said base substrate, and a plurality of third vertical conductive paths electrically connected to said second potential level conductive layers so as to provide second end portions exposed to said first surface of said base substrate, said first and second end portions being alternately arranged in row and column directions so as to provide closest connections with said electrical components through said thin film wiring layer.