US5587882A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
Assignee: Hewlett Packard Development Co LP
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Filing: 1995-08-30
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Granted: 1996-12-24
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Expires: 2015-08-30
Abstract
Abstract A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink and the chips forms a thermal interface having a low thermal resistance. This cools the chips and ensures reliable operation of the MCM. The trough is filled with a curable adhesive, securing the heat sink to the substrate of the MCM.
Inventors
- 👤 Chandrakant Patel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 19:24
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W90/00; H10W72/00; H10W72/071; H10W72/073; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15; H10W76/00; H10W76/10; H10W76/17; H10W76/60; H10W76/63; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
125 words
A module assembly, comprising: a planar substrate having a top surface, the top surface having a non-through peripheral trough; at least one heat generating device mounted on the top surface of the substrate; a heat sink having a support ring penetrating the trough; a thermal transfer medium having a predetermined thickness, positioned between the at least one heat generating device and the heat sink, operative to conduct heat from the at least one heat generating device to the heat sink; and a curable adhesive within the trough, securing the support ring to the substrate wherein the depth of penetration of the support ring into the trough positions the thermal transfer medium in contact with the heat sink and the at least one heat generating device.
Claim 2
Dependent Claim
125 words
A module assembly, comprising: a planar substrate having a top surface, the top surface having a non-through peripheral trough; at least one heat generating device mounted on the top surface of the substrate; a heat sink having a support ring penetrating the trough; a thermal transfer medium having a predetermined thickness, positioned between the at least one heat generating device and the heat sink, operative to conduct heat from the at least one heat generating device to the heat sink; and a curable adhesive within the trough, securing the support ring to the substrate wherein the depth of penetration of the support ring into the trough positions the thermal transfer medium in contact with the heat sink and the at least one heat generating device.
Claim 3
Dependent Claim
27 words
The module assembly of claim 1 wherein the at leas one heat generating device comprises at least one integrated circuit mounted on the substrate using solder bumps.
Claim 4
Dependent Claim
19 words
The module assembly of claim 1 wherein the at least one heat generating device comprises at least one resistor.
Claim 5
Dependent Claim
15 words
The module assembly of claim 1 wherein the thermal transfer medium comprises thermally conductive epoxy.
Claim 6
Dependent Claim
16 words
The module assembly of claim 4 wherein the heat sink is fabricated from Aluminum Silicon Carbide.
Claim 7
Dependent Claim
14 words
The module assembly of claim 2 wherein the thermal transfer medium comprises thermal compound.
Claim 8
Dependent Claim
13 words
The module assembly of claim 6 wherein the curable adhesive comprises an elastomer.
Claim 9
Dependent Claim
18 words
The module assembly of claim 2 further comprising a pin grid array electrical connector attached to the substrate.
Claim 10
Dependent Claim
87 words
A referencing scheme cooling integrated circuits mounted on a top surface of a planar substrate, comprising: a heat sink having a support ring; a thermal transfer medium having a predetermined thickness, positioned between the heat sink and the integrated circuits; a non-through peripheral trough formed on the top surface of the substrate receiving the support ring, the support ring entering the trough to position the heat sink in contact with the thermal transfer medium; and an adhesive securing the position of the support ring in the trough.
Claim 11
Dependent Claim
87 words
A referencing scheme cooling integrated circuits mounted on a top surface of a planar substrate, comprising: a heat sink having a support ring; a thermal transfer medium having a predetermined thickness, positioned between the heat sink and the integrated circuits; a non-through peripheral trough formed on the top surface of the substrate receiving the support ring, the support ring entering the trough to position the heat sink in contact with the thermal transfer medium; and an adhesive securing the position of the support ring in the trough.
Claim 12
Dependent Claim
15 words
The referencing scheme of claim 9 wherein the thermal transfer medium comprises thermally conductive epoxy.
Claim 13
Dependent Claim
14 words
The referencing scheme of claim 9 wherein the thermal transfer medium comprises thermal compound.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-24 | 2000-06-24 | 2000-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-24 | 2004-06-24 | 2004-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-24 | 2008-06-24 | 2008-12-24 | $7700.00 | Window Closed / Lapsed |