Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate

Claim 2

A heat sink assembly combined with a multi-chip module having a substrate and a plurality of integrated circuits mounted on the substrate using solder bumps, the heat sink assembly comprising: a heat sink; a thermal interface between the integrated circuits and the heat sink, operative to conduct heat from the integrated circuits to the heat sink; and at least one pair of beam springs urging the substrate toward the heat sink and thereby pressing a non-input/output side of the integrated circuits against the heat sink via the thermal interface with a force that remains substantially constant regardless of any thermal expansion or contraction of any of the substrate, the integrated circuits and the heat sink.

Claim 3

A heat sink assembly as in claim 1 wherein the thermal interface comprises thermal paste.

Claim 4

A heat sink assembly as in claim 2 wherein the thermal paste comprises a mixture of silicone oil and particles selected from the group comprising silver, aluminum and aluminum nitride.

Claim 5

A heat sink assembly as in claim 1 and further comprising a fan mounted on the heat sink, operative to cause air to flow over the heat sink to carry away heat.

Claim 6

A heat sink assembly as in claim 1, wherein the beam springs are copper.

Claim 7

A heat sink assembly used with a multi-chip module having a substrate and a plurality of integrated circuits mounted on the substrate, the heat sink assembly comprising: a heat sink; a thermal interface between the integrated circuits and the heat sink, operative to conduct heat from the integrated circuits to the heat sink; mechanical bias means urging the substrate toward the heat sink and thereby pressing a non-input/output side of the integrated circuits against the heat sink via the thermal interface with a force that remains substantially constant regardless of any thermal expansion or contraction of any of the substrate, the integrated circuits and the heat sink; and a base plate and a fastener fastening the base plate to the heat sink, wherein the base plate and the heat sink define therebetween a cavity enclosing the multi-chip module, the thermal interface and the mechanical bias means.

Claim 8

A heat sink assembly used with a multi-chip module having a substrate and a plurality of integrated circuits mounted on the substrate, the heat sink assembly comprising: a heat sink; a thermal interface between the integrated circuits and the heat sink, operative to conduct heat from the integrated circuits to the heat sink; mechanical bias means urging the substrate toward the heat sink and thereby pressing a non-input/output side of the integrated circuits against the heat sink via the thermal interface with a force that remains substantially constant regardless of any thermal expansion or contraction of any of the substrate, the integrated circuits and the heat sink; and a base plate and a fastener fastening the base plate to the heat sink, wherein the base plate and the heat sink define therebetween a cavity enclosing the multi-chip module, the thermal interface and the mechanical bias means.

Claim 9

A heat sink assembly as in claim 6 and further comprising a flat flexible cable extending between the base plate and the heat sink to establish electrical communications between the multi-chip module and an external circuit.

Claim 10

A heat sink assembly as in claim 6 wherein the at least one mechanical spring bias means comprises a beam spring operative to exert an expansive force between the substrate and the base plate.

Claim 11

A heat sink assembly as in claim 6, wherein the thermal interface comprises a layer of thermal grease having a thickness of about 0.2 mm.

Claim 12

A heat sink assembly as in claim 6, wherein the mechanical bias means consists essentially of a pair of beam springs.

Claim 13

A heat sink assembly as in claim 10, wherein the beam springs are copper.

Claim 14

A heat sink assembly, comprising a heat sink having a cavity formed therein; a multi-chip module contained within the cavity, the multi-chip module having a substrate and a plurality of integrated circuits, the integrated circuits having a top side and an underside, the integrated circuits being mounted on the substrate using solder bumps between the underside of the integrated circuits and the substrate; a thermal interface between the top side of the integrated circuits and the heat sink, operative to conduct heat from the integrated circuits to the heat sink; at least one pair of beam springs urging the substrate toward the heat sink, thereby pressing the top side of the integrated circuits against the heat sink via the thermal interface with a force that remains substantially constant regardless of any thermal expansion or contraction of any of the substrate, the integrated circuits and the heat sink.

Claim 15

A heat sink assembly, comprising a heat sink having a cavity formed therein; a multi-chip module contained within the cavity, the multi-chip module having a substrate and a plurality of integrated circuits, the integrated circuits having a top side and an underside, the integrated circuits being mounted on the substrate using solder bumps between the underside of the integrated circuits and the substrate; a thermal interface between the top side of the integrated circuits and the heat sink, operative to conduct heat from the integrated circuits to the heat sink; at least one pair of beam springs urging the substrate toward the heat sink, thereby pressing the top side of the integrated circuits against the heat sink via the thermal interface with a force that remains substantially constant regardless of any thermal expansion or contraction of any of the substrate, the integrated circuits and the heat sink.

Claim 16

A heat sink assembly as in claim 12, wherein the thermal interface comprises a layer of thermal grease having a thickness of about 0.2 mm.

Claim 17

A heat sink assembly as in claim 12, wherein the beam springs are copper.