EP0368743A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High performance integrated circuit chip package and method of making same
Assignee: Nortel Networks Ltd
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Filing: 1989-11-07
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Granted: —
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Expires: 2009-11-07
Abstract
Abstract A high performance integrated circuit chip package (10) includes a support (15) substrate (12) having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate (16) on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink (26) with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The multilayer wiring substrate (16) may be formed by a self-aligned thin film wiring method, with a self-aligned lift off method being employed to form internal wiring planes. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.
Inventors
- 👤 Iwona Turlik
- 👤 Arnold Reisman
- 👤 Deepak Nayak
- 👤 Lih-Tyng Hwang
- 👤 Giora Dishon
- 👤 Scott L. Jacobs
- 👤 Robert Francis Darveaux
- 👤 Neil M. Poley
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 06:55
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W40/00; H10W40/20; H10W40/25; H10W40/258; H10W40/40; H10W40/47; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W90/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/071; H10W72/073; H10W72/07311; H10W72/851; H10W72/874; H10W72/877; H10W72/879; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
86 words
In an integrated circuit chip package(10) comprising a support (15) substrate (12) having conductors extending from one face to the opposite face thereof, and a multilayer wiring substrate(16) on said opposite face for electrically connecting the front face of integrated circuit chips mounted thereon to one another and to said conductors, the improvement characterized by: a heat sink (26) having microchannels (27) formed therein; and a thermally conductive cushion material between one face of said heat sink and the back faces of said integrated circuit chips.
Claim 2
Dependent Claim
86 words
In an integrated circuit chip package(10) comprising a support (15) substrate (12) having conductors extending from one face to the opposite face thereof, and a multilayer wiring substrate(16) on said opposite face for electrically connecting the front face of integrated circuit chips mounted thereon to one another and to said conductors, the improvement characterized by: a heat sink (26) having microchannels (27) formed therein; and a thermally conductive cushion material between one face of said heat sink and the back faces of said integrated circuit chips.
Claim 3
Dependent Claim
17 words
The integrated circuit chip(20) package of Claim 1 wherein said thermally conductive cushion material is reflowed solder.
Claim 4
Dependent Claim
19 words
The integrated circuit chip package of Claim 2 wherein said reflowed solder is a soft, low melting point solder.
Claim 5
Dependent Claim
13 words
The integrated circuit chip package of Claim 2 wherein said solder is indium.
Claim 6
Dependent Claim
15 words
The integrated circuit chip package of Claim 5 wherein said indium is about 650µm thick.
Claim 7
Dependent Claim
16 words
The integrated circuit chip package of Claim 2 wherein said solder is an alloy of indium.
Claim 8
Dependent Claim
35 words
The integrated circuit chip package of Claim 1 wherein said thermally conductive cushion material comprises solder preforms and wherein said heat sink includes a plurality of cavities at said one end for holding said preforms.
Claim 9
Dependent Claim
44 words
The integrated circuit chip package of Claim 1 wherein said thermally conductive cushion material is sufficiently thin to efficiently conduct heat from said integrated circuit chips to said heat sink, but sufficiently thick to cushion against dimensional variations and thermal expansions in said package.
Claim 10
Dependent Claim
25 words
The integrated circuit chip package of Claim 1 further comprising means for providing fluid flow through said microchannels to transport heat from said heat sink.
Claim 11
Dependent Claim
24 words
The integrated circuit chip of Claim 9 wherein said means for providing fluid flow comprises means for providing turbulent fluid flow through said microchannels.
Claim 12
Independent Claim
129 words
A method of forming a package for integrated circuit chips comprising the steps of: mounting the front faces of said integrated circuit chips on one face of a substrate having interconnection wiring therein for providing power, ground and signal connections to said integrated circuit chips; placing a heat sink adjacent the back faces of said integrated circuit chips, with preforms of thermally conductive material between said back faces of said integrated circuit chips and said heat sink; heating the assembled support substrate, integrated circuit chips, heat sink and preforms to thereby melt said preforms; and allowing the assembled support substrate, integrated circuit chips, heat sink and preforms to cool, to thereby form a conformal layer of said thermally conductive material between said integrated circuit chips and said heat sink.
Claim 13
Independent Claim
129 words
A method of forming a package for integrated circuit chips comprising the steps of: mounting the front faces of said integrated circuit chips on one face of a substrate having interconnection wiring therein for providing power, ground and signal connections to said integrated circuit chips; placing a heat sink adjacent the back faces of said integrated circuit chips, with preforms of thermally conductive material between said back faces of said integrated circuit chips and said heat sink; heating the assembled support substrate, integrated circuit chips, heat sink and preforms to thereby melt said preforms; and allowing the assembled support substrate, integrated circuit chips, heat sink and preforms to cool, to thereby form a conformal layer of said thermally conductive material between said integrated circuit chips and said heat sink.
Claim 14
Dependent Claim
67 words
The method of Claim 11 wherein said mounting step is preceded by the steps of: forming said substrate by forming a support substrate having a plurality of conductors extending from one face to the opposite face thereof and forming a multilayer wiring substrate on said opposite face of said support substrate for electrically connecting said front face of said integrated circuit chips to the exposed face thereof.
Claim 15
Dependent Claim
114 words
The method of Claim 11 wherein said mounting step is preceded by the step of forming said substrate, and wherein the step of forming said substrate comprises the steps of: forming a support substrate by firing a monolithic block of ceramic having channels extending from one face to an opposite face thereof, and filling said channels with a conductor; and forming a multilayer wiring substrate on said opposite face by forming a plurality of insulating layers thereon, each insulating layer comprising one or more conductive vias which are electrolessly plated on the conductive vias of an underlying layer, and a conductive plane which is electrolessly plated on a conductive via of an underlying layer.
Claim 16
Dependent Claim
24 words
The method of Claim 13 wherein said conductive vias comprise a first conductor which is clad with a second conductor on the side thereof.
Claim 17
Dependent Claim
43 words
The method Claim 11 wherein said mounting step comprises the steps of providing solder bumps between said one face of said substrate and said integrated circuit chips; heating to melt and reflow said solder bumps; and allowing said reflowed solder bumps to cool.
Claim 18
Dependent Claim
33 words
The method of Claim 15 wherein said step of heating said solder bumps occurs at a higher temperature than the step of heating the assembled substrate, integrated circuit chips, heat sink and preforms.
Claim 19
Dependent Claim
43 words
The method of Claim 11 wherein said placing step comprises the step of placing said heat sink adjacent the back faces of said chips with said preforms therebetween, and maintaining the distance between said exposed faces and said heat sinks to about 650µm.
Claim 20
Dependent Claim
57 words
A method of Claim 11 wherein said placing step is preceded by the step of forming a heat sink having microchannels therein; wherein said placing step comprises placing said heat sink adjacent the back faces of said integrated circuit chips; and wherein said allowing step is followed by the step of providing fluid flow through said microchannels.
References Cited (Backward Citations)
No citation records indexed.
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