US5237203A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer overlay interconnect for high-density packaging of circuit elements
Assignee: Northrop Grumman Systems Corp
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Filing: 1992-06-05
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Granted: 1993-08-17
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Expires: 2012-06-05
Abstract
Abstract A multilayer overlay interconnect for packaging various circuit elements such as integrated-circuit (IC) chips in high-density configurations. The overlay interconnect allows multiple IC chips to be removably mounted and electrically interconnected within a chip package with minimized interconnection lengths between the IC chips, for improved high speed operation of the chips. In addition, the back side of the chips remain accessible for making direct contact with a heat sink and/or a substrate interconnect which provides for good heat dissipation and/or additional electrical contact areas. The multilayer overlay interconnect is either flexible or both flexible and compressible. The overlay interconnect includes a plurality of thin polymer layers, a plurality of inner contact areas on an outermost layer for making electrical contact with contact areas on the IC chips, a plurality of outer contact areas on the outermost layer for making electrical contact with contact areas on leads extending into the chip package, and electrically-conductive traces on one or more of the layers, with interconnecting vias, for interconnecting the inner and outer contact areas. The overlay interconnect further includes cut-out regions to accommodate for substantial variations in circuit element thicknesses or circuit elements which require a medium of air to operate properly.
Inventors
- 👤 Laurence I. Massaron
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:50
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W90/00
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
143 words
A multilayer overlay interconnect for removably packaging at least one integrated-circuit (IC) chip in a chip package, comprising: a plurality of thin flexible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible layer for making electrical contact with contact areas on the at least one IC chip; a plurality of outer contact areas positioned on the outermost flexible layer for making electrical contact with contact areas on leads extending into the chip package; electrically conductive traces positioned on one or more of the flexible layers with interconnecting vias for interconnecting the inner and outer contact areas; and an elastomer layer operable to compress the flexible overlay interconnect, wherein the elastomer layer compresses the flexible overlay interconnect together with the at least one IC and the chip package leads to make electricl contact between the contact areas.
Claim 2
Dependent Claim
143 words
A multilayer overlay interconnect for removably packaging at least one integrated-circuit (IC) chip in a chip package, comprising: a plurality of thin flexible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible layer for making electrical contact with contact areas on the at least one IC chip; a plurality of outer contact areas positioned on the outermost flexible layer for making electrical contact with contact areas on leads extending into the chip package; electrically conductive traces positioned on one or more of the flexible layers with interconnecting vias for interconnecting the inner and outer contact areas; and an elastomer layer operable to compress the flexible overlay interconnect, wherein the elastomer layer compresses the flexible overlay interconnect together with the at least one IC and the chip package leads to make electricl contact between the contact areas.
Claim 3
Dependent Claim
42 words
The multilayer overlay interconnect as set forth in claim 1 wherein the multilayer overlay interconnect defines at least one cut-out region within the overlay interconnect, said cut-out region operable to provide a medium of air to the at least one IC chip.
Claim 4
Dependent Claim
50 words
The multilayer overlay interconnect as set forth in claim 1 wherein the electrical contact areas between the at least one IC chip and the inner contact areas are bonded together, and the contact areas between the leads extending into the chip package and the outer contact areas are bonded together.
Claim 5
Dependent Claim
32 words
The multilayer overlay interconnect as set forth in claim 1 wherein the at least one IC chip is a plurality of IC chips positioned relative to each other in a coplanar configuration.
Claim 6
Dependent Claim
57 words
The multilayer overlay interconnect as set forth in claim 4 wherein the multilayer overlay interconnect defines at least one cut-out region within the overlay interconnect, said cut-out region operable to accommodate for substantial variations in the thicknesses of the plurality of IC chips and/or to provide a medium of air to the at least one IC chip.
Claim 7
Dependent Claim
55 words
The multilayer overlay interconnect as set forth in claim 1 wherein the multilayer overlay interconnect further includes a heat sink and/or a substrate interconnect, said heat sink operable to provide heat dissipation for the at least one IC chip, said substrate interconnect operable to provide additional contact areas for the at least one IC chip.
Claim 8
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 1 wherein the insulating material is a polymer material.
Claim 9
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 7 wherein the polymer material is a polyimide material.
Claim 10
Dependent Claim
17 words
The multilayer overlay interconnect as set forth in claim 7 wherein the polymer material is silicone rubber.
Claim 11
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 1 wherein the insulating material is an inorganic material.
Claim 12
Dependent Claim
135 words
A multilayer overlay interconnect for removably interconnecting at least one circuit element with external contact areas, comprising: a plurality of thin flexible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible layer for making electrical contact with contact areas on the at least one circuit element; a plurality of outer contact areas positioned on the outermost flexible layer for making electrical contact with the external contact areas; electrically conductive traces positioned on one or more of the layers with interconnecting vias for interconnecting the inner and outer contact areas; and an elastomer layer operable to compress the overlay interconnect, wherein the elastomer layer compresses the overlay interconnect together with the at least one circuit element and the external contact areas to make electrical contact between the contact areas.
Claim 13
Dependent Claim
135 words
A multilayer overlay interconnect for removably interconnecting at least one circuit element with external contact areas, comprising: a plurality of thin flexible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible layer for making electrical contact with contact areas on the at least one circuit element; a plurality of outer contact areas positioned on the outermost flexible layer for making electrical contact with the external contact areas; electrically conductive traces positioned on one or more of the layers with interconnecting vias for interconnecting the inner and outer contact areas; and an elastomer layer operable to compress the overlay interconnect, wherein the elastomer layer compresses the overlay interconnect together with the at least one circuit element and the external contact areas to make electrical contact between the contact areas.
Claim 14
Dependent Claim
42 words
The multilayer overlay interconnect as set forth in claim 11 wherein the multilayer overlay interconnect defines at least one cut-out region within the overlay interconnect, said cut-out region operable to provide a medium of air to the at least one circuit element.
Claim 15
Dependent Claim
47 words
The multilayer overlay interconnect as set forth in claim 11 wherein the electrical contact areas between the at least one circuit element and the inner contact areas are bonded together, and the contact areas between the external contact areas and the outer contact areas are bonded together.
Claim 16
Dependent Claim
45 words
The multilayer overlay interconnect as set forth in claim 11 wherein the at least one circuit element is a plurality of circuit elements positioned relative to each other in a coplanar configuration, said plurality of circuit elements including at least one integrated circuit (IC) chip.
Claim 17
Dependent Claim
57 words
The multilayer overlay interconnect as set forth in claim 14 wherein the multilayer overlay interconnect defines at least one cut-out region within the overlay interconnect, said cut-out region operable to accommodate for substantial variations in the thicknesses of the plurality of circuit elements and/or to provide a medium of air to the at least one circuit element.
Claim 18
Dependent Claim
55 words
The multilayer overlay interconnect as set forth in claim 11 wherein the multilayer overlay interconnect further includes a heat sink and/or a substrate interconnect, said heat sink operable to provide heat dissipation for the at least one circuit element, said substrate interconnect operable to provide additional contact areas for the at least one circuit element.
Claim 19
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 11 wherein the insulating material is a polymer material.
Claim 20
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 17 wherein the polymer material is a polyimide material.
Claim 21
Dependent Claim
17 words
The multilayer overlay interconnect as set forth in claim 17 wherein the polymer material is silicone rubber.
Claim 22
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 11 wherein the insulating material is an inorganic material.
Claim 23
Dependent Claim
146 words
A multilayer overlay interconnect for removably interconnecting at least one circuit element with external contact areas, comprising: a plurality of thin flexible and compressible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible and compressible layer for making electrical contact with contact areas on the at least one circuit element; a plurality of outer contact areas positioned on the outermost flexible and compressible layer for making electrical contact with the external contact areas; and electrically conductive traces positioned on one or more of the flexible and compressible layers with interconnecting vias for interconnecting the inner and outer contact areas, wherein the compliant overlay interconnect is operable to be compressed to deform itself in a direction normal to the plane of the at least one circuit element and the external contact areas to make electrical contact between the contact areas.
Claim 24
Dependent Claim
146 words
A multilayer overlay interconnect for removably interconnecting at least one circuit element with external contact areas, comprising: a plurality of thin flexible and compressible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible and compressible layer for making electrical contact with contact areas on the at least one circuit element; a plurality of outer contact areas positioned on the outermost flexible and compressible layer for making electrical contact with the external contact areas; and electrically conductive traces positioned on one or more of the flexible and compressible layers with interconnecting vias for interconnecting the inner and outer contact areas, wherein the compliant overlay interconnect is operable to be compressed to deform itself in a direction normal to the plane of the at least one circuit element and the external contact areas to make electrical contact between the contact areas.
Claim 25
Dependent Claim
45 words
The multilayer overlay interconnect as set forth in claim 21 wherein the multilayer overlay interconnect further includes an elastomer layer, said elastomer layer operable to compress the flexible and compressible overlay interconnect together with the at least one circuit element and the external contact areas.
Claim 26
Dependent Claim
42 words
The multilayer overlay interconnect as set forth in claim 21 wherein the multilayer overlay interconnect defines at least one cut-out region within the overlay interconnect, said cut-out region operable to provide a medium of air to the at least one circuit element.
Claim 27
Dependent Claim
47 words
The multilayer overlay interconnect as set forth in claim 21 wherein the electrical contact areas between the at least one circuit element and the inner contact areas are bonded together, and the contact areas between the external contact areas and the outer contact areas are bonded together.
Claim 28
Dependent Claim
45 words
The multilayer overlay interconnect as set forth in claim 21 wherein the at least one circuit element is a plurality of circuit elements positioned relative to each other in a coplanar configuration, said plurality of circuit elements including at least one integrated circuit (IC) chip.
Claim 29
Dependent Claim
57 words
The multilayer overlay interconnect as set forth in claim 25 wherein the multilayer overlay interconnect defines at least one cut-out region within the overlay interconnect, said cut-out region operable to accommodate for substantial variations in the thicknesses of the plurality of circuit elements and/or to provide a medium of air to the at least one circuit element.
Claim 30
Dependent Claim
55 words
The multilayer overlay interconnect as set forth in claim 21 wherein the multilayer overlay interconnect further includes a heat sink and/or a substrate interconnect, said heat sink operable to provide heat dissipation for the at least one circuit element, said substrate interconnect operable to provide additional contact areas for the at least one circuit element.
Claim 31
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 21 wherein the insulating material is a polymer material.
Claim 32
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 28 wherein the polymer material is a polyimide material.
Claim 33
Dependent Claim
17 words
The multilayer overlay interconnect as set forth in claim 28 wherein the polymer material is silicone rubber.
Claim 34
Dependent Claim
18 words
The multilayer overlay interconnect as set forth in claim 21 wherein the insulating material is an inorganic material.
Claim 35
Dependent Claim
182 words
A multilayer overlay interconnect for removably interconnecting at least one integrated circuit (IC) chip in a chip package, comprising: a plurality of thin flexible and compressible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible and compressible layer for making electrical contact with contact areas on the at least one IC chip; a plurality of outer contact areas positioned on the outermost flexible and compressible layer for making electrical contact with contact areas on leads extending into the chip package; electrically conductive traces positioned on one or more of the flexible and compressible layers with interconnecting vias for interconnecting the inner and outer contact areas; and at least one cut-out region defined by the overlay interconnect, said cut-out region operable to provide a medium of air to the at least one IC chip, wherein the flexible and compressible overlay interconnect is operable to be compressed to deform itself in a direction normal to the plane of the at least one IC chip and the chip package leads to make electrical contact between the contact areas.
Claim 36
Dependent Claim
182 words
A multilayer overlay interconnect for removably interconnecting at least one integrated circuit (IC) chip in a chip package, comprising: a plurality of thin flexible and compressible layers of an insulating material; a plurality of inner contact areas positioned on an outermost flexible and compressible layer for making electrical contact with contact areas on the at least one IC chip; a plurality of outer contact areas positioned on the outermost flexible and compressible layer for making electrical contact with contact areas on leads extending into the chip package; electrically conductive traces positioned on one or more of the flexible and compressible layers with interconnecting vias for interconnecting the inner and outer contact areas; and at least one cut-out region defined by the overlay interconnect, said cut-out region operable to provide a medium of air to the at least one IC chip, wherein the flexible and compressible overlay interconnect is operable to be compressed to deform itself in a direction normal to the plane of the at least one IC chip and the chip package leads to make electrical contact between the contact areas.
References Cited (Backward Citations)
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Cited
US5029325A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-16 | 1997-02-15 | 1997-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-16 | 2001-02-15 | 2001-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-16 | 2005-02-15 | 2005-08-17 | $7700.00 | Window Closed / Lapsed |