US4750086A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for cooling integrated circuit chips with forced coolant jet
Assignee: Unisys Corp
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Filing: 1985-12-11
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Granted: 1988-06-07
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Expires: 2005-12-11
Abstract
Abstract The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible microbellows. The surface area of the heat spreader is greater than the mating surface area of the chip. The heat spreader is attached to the bottom surface of the microbellows. The surface area of the heat spreader which mates with the surface of the chip is highly polished and coated with a highly conductive soft metal. A jet of coolant is forced into the inner surface of the microbellows.
Inventors
- 👤 Faquir C. Mittal
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 17:51
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/776; H10W40/772; Y; Y10; Y10S; Y10S165/00; Y10S165/908
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
212 words
An apparatus which cools integrated circuit chips comprising: a housing including a chamber therein and a board having said chips mounted thereon, each chip extending into said chamber and having a substantially planar surface defining a first surface area; a plurality of flexible heat conducting microbellows supported in said housing and each having a planar heat receiving end adjacent a respective one of said chips; a plurality of rigid heat spreaders which each have a planar surface connected to said heat receiving end of a respective microbellows, each heat spreader having another planar surface defining a second polished and metal coated surface area greater than said first surface area of a respective chip, said second surface area of each heat spreader being in planar contact with said first surface area of a respective chip; means for conducting a fluid coolant into each microbellows, said conducting means being supported in said chamber and having respective open ends extending into each microbellows such that they are spaced apart and detached from the heat receiving end; and, each open end being shaped as a nozzle which discharges a high velocity jet of said fluid coolant directly onto the corresponding microbellows heat receiving end to cool the corresponding heat spreader and compress it against a chip.
Claim 2
Independent Claim
212 words
An apparatus which cools integrated circuit chips comprising: a housing including a chamber therein and a board having said chips mounted thereon, each chip extending into said chamber and having a substantially planar surface defining a first surface area; a plurality of flexible heat conducting microbellows supported in said housing and each having a planar heat receiving end adjacent a respective one of said chips; a plurality of rigid heat spreaders which each have a planar surface connected to said heat receiving end of a respective microbellows, each heat spreader having another planar surface defining a second polished and metal coated surface area greater than said first surface area of a respective chip, said second surface area of each heat spreader being in planar contact with said first surface area of a respective chip; means for conducting a fluid coolant into each microbellows, said conducting means being supported in said chamber and having respective open ends extending into each microbellows such that they are spaced apart and detached from the heat receiving end; and, each open end being shaped as a nozzle which discharges a high velocity jet of said fluid coolant directly onto the corresponding microbellows heat receiving end to cool the corresponding heat spreader and compress it against a chip.
Claim 3
Dependent Claim
18 words
The apparatus of claim 1 wherein each heat spreader is formed of a heat conductive, electrically insulative metal.
Claim 4
Dependent Claim
21 words
The apparatus of claim 1 wherein each heat spreader has a thickness of from about 0.025 inches to about 0.035 inches.
Claim 5
Dependent Claim
17 words
The apparatus of claim 1 wherein each heat spreader is connected to said microbellows by a solder.
Claim 6
Dependent Claim
21 words
The apparatus of claim 1 wherein each heat spreader is connected to said microbellows by a heat conductive, thermally insulative adhesive.
Claim 7
Dependent Claim
27 words
The apparatus of claim 1 wherein each second surface area is coated with a heat conductive, electrically insulative metal different from the metal of each heat spreader.
Claim 8
Dependent Claim
25 words
The apparatus of claim 1 including: means for moving said fluid coolant into each microbellows, said moving means including a pump and a heat exchanger.
Claim 9
Dependent Claim
13 words
The apparatus of claim 1 wherein said chamber includes an inert fluid therein.
Claim 10
Independent Claim
122 words
An apparatus which cools an integrated circuit chip comprising: a conduit means for carrying a fluid coolant along a predetermined path to and from said chip; said conduit means including a flexible member which forms a portion of said path for said coolant; said flexible member having a heat receiving end with a heat spreader attached thereto, and said heat spreader having a surface in contact with said chip; a nozzle inside of said flexible member and in close proximity to said heat receiving end but detached therefrom; said nozzle being shaped to discharge a jet of said fluid coolant against said heat receiving end of said flexible member which in turn cools said heat spreader and compresses it against said chip.
Claim 11
Independent Claim
122 words
An apparatus which cools an integrated circuit chip comprising: a conduit means for carrying a fluid coolant along a predetermined path to and from said chip; said conduit means including a flexible member which forms a portion of said path for said coolant; said flexible member having a heat receiving end with a heat spreader attached thereto, and said heat spreader having a surface in contact with said chip; a nozzle inside of said flexible member and in close proximity to said heat receiving end but detached therefrom; said nozzle being shaped to discharge a jet of said fluid coolant against said heat receiving end of said flexible member which in turn cools said heat spreader and compresses it against said chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-07 | 1991-12-07 | 1992-06-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-07 | 1995-12-07 | 1996-06-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-07 | 1999-12-07 | 2000-06-07 | $7700.00 | Window Closed / Lapsed |