US3794886A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fluid cooled semiconductor socket
Assignee: Individual
•
Filing: 1972-06-26
•
Granted: 1974-02-26
•
Expires: 1992-06-26
Abstract
Abstract A fluid cooled semiconductor socket comprising a thermally conductive plate adapted to hold the semiconductor in good thermal contact with the plate at a point of the semiconductor case having a hgh thermal conductivity with the semiconductor chip inside the case. A thermally conductive fluid conduit is attached to the plate on a face directly opposite from the semiconductor. The conduit is placed so as to maximize the thermal conductivity between the point where it is placed on the plate and the semiconductor chip, but still allow the electrical leads from the semiconductor to pass through the plate and establish electrical contact on the other side without obstruction by the fluid conduit. The fluid flowing through the conduit is made to absorb and conduct away increased amounts of heat by narrowing the conduit where it is in contact with the plate so as to increase the fluid velocity and reduce the slow moving fluid boundary layer in contact with an inner wall of the conduit, and by promoting turbulence in the field flow through ths narrowed portion. The plate and conduit are imbedded in a plastic housing which is keyed to lock into a multi-socket strip which orientates the conduit ends for mating with electrical leads and with manifolds conveying the cooling fluid.
Inventors
- 👤 W Goldman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 06:42
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; Y; Y10; Y10S; Y10S165/00; Y10S165/903
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
240 words
A fluid cooled semiconductOr assembly comprising: a. a semiconductor device comprising a case having a planar exterior portion, a semiconductor chip internally mounted within the case, said planar exterior portion of the case having an area directly beneath and in thermally conducting contact with the semiconductor chip which defines a heat flux area, and a plurality of semiconductor leads which extend through and outwardly from said case with at least one of said semiconductor leads being electrically insulated from the case; b. an electrically insulative semiconductor socket housing; c. a planar, thermally conductive, semiconductor device mounting plate positioned on said housing and having a plurality of semiconductor lead receiving apertures therein; d. means for holding said housing, semiconductor device mounting plate and semiconductor device in assembled, superposed relation with the planar heat flux area of said semiconductor case in direct physical, thermally conducting contact with said planar semiconductor device mounting plate and with the semiconductor leads extending into said lead receiving apertures; and, e. a generally U-shaped thermally conductive fluid conduit confining a fluid flow and having a flatened outer part in direct physical, thermally conducting contact with the planar semiconductor mounting plate directly beneath said semiconductor case heat flux area whereby a fluid flowing through said conduit will absorb and conduct heat away from the semiconductor chip when the semiconductor device is held in said superposed relation with said thermally conductive semiconductor device mounting plate and is electrically activated.
Claim 2
Dependent Claim
240 words
A fluid cooled semiconductOr assembly comprising: a. a semiconductor device comprising a case having a planar exterior portion, a semiconductor chip internally mounted within the case, said planar exterior portion of the case having an area directly beneath and in thermally conducting contact with the semiconductor chip which defines a heat flux area, and a plurality of semiconductor leads which extend through and outwardly from said case with at least one of said semiconductor leads being electrically insulated from the case; b. an electrically insulative semiconductor socket housing; c. a planar, thermally conductive, semiconductor device mounting plate positioned on said housing and having a plurality of semiconductor lead receiving apertures therein; d. means for holding said housing, semiconductor device mounting plate and semiconductor device in assembled, superposed relation with the planar heat flux area of said semiconductor case in direct physical, thermally conducting contact with said planar semiconductor device mounting plate and with the semiconductor leads extending into said lead receiving apertures; and, e. a generally U-shaped thermally conductive fluid conduit confining a fluid flow and having a flatened outer part in direct physical, thermally conducting contact with the planar semiconductor mounting plate directly beneath said semiconductor case heat flux area whereby a fluid flowing through said conduit will absorb and conduct heat away from the semiconductor chip when the semiconductor device is held in said superposed relation with said thermally conductive semiconductor device mounting plate and is electrically activated.
Claim 3
Dependent Claim
69 words
The assembly of claim 1 characterized by said conduit having a narrowed portion of diminished cross-sectional flow area in the region of said conduit where it is in thermally conducting contact with said heat flux area whereby the velocity of fluid flowing through said narrowed portion is increased so as to reduce the boundary layer effect of the fluid layer in contact with the inner walls of said conduit.
Claim 4
Dependent Claim
41 words
The assembly of claim 1 characterized by said conduit having a flattened length including the outer part in thermal contact with said heat flux area whereby said conduit is narrowed and placed in increased thermal contact with said heat flux area.
Claim 5
Dependent Claim
40 words
The assembly of claim 1 wherein the plurality of electrical leads extending outwardly from said semiconductor case pass through the lead receiving apertures of said semiconductor mounting plate with only one of said leads in electrical contact with said plate.
Claim 6
Dependent Claim
37 words
The assembly of claim 1 wherein said conduit contains means up stream from the point of contact with said heat flux area for increasing turbulance in the fluid flowing through said conduit at said point of contact.
Claim 7
Dependent Claim
41 words
The assembly of claim 1 wherein means are provided in said conduit at the point of contact with said heat flux area for increasing the area of contact between the fluid in said conduit and an inner wall of said conduit.
Claim 8
Dependent Claim
24 words
The assembly of claim 1 wherein said conduit is positioned within said housing and has intake and outlet portions extending outwardly from said housing.
Claim 9
Dependent Claim
26 words
The assembly of claim 7 wherein said socket housing has means locking a plurality of said socket housings in a preset orientation to a socket strip.
Claim 10
Dependent Claim
42 words
The assembly of claim 8 further comprising means at preset locations on said socket housings mating respectively with said intake and outlet portions of said conduit to supply cooling fluid to said intake portion and remove cooling fluid from said outlet portion.
Claim 11
Dependent Claim
21 words
The assembly of claim 1 further comprising means for controlling the rate of said fluid flow in response to a signal.
References Cited (Backward Citations)
US2984274A
Cited
US3143592A
Cited
GB1018623A
Cited
US3292050A
Cited
US3400543A
Cited
US3405323A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-02-25 | 1977-08-27 | 1978-02-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-02-25 | 1981-08-27 | 1982-02-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-02-25 | 1985-08-27 | 1986-02-26 | $7700.00 | Window Closed / Lapsed |