US5818697A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible thin film ball grid array containing solder mask
Assignee: Ultratech Inc
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Filing: 1997-03-21
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Granted: 1998-10-06
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Expires: 2017-03-21
Abstract
Abstract An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.
Inventors
- 👤 Gregg Joseph Armezzani
- 👤 Robert Nicholas Ives
- 👤 Mark Vincent Pierson
- 👤 Terry Alan Tull
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:02
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/688; H10W70/69; H10W90/00; H10W90/701; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/0989; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/0455; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K2203/15; H05K2203/1572; H05K3/0094; H05K3/3465; H05K3/3478
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
96 words
An electronic package comprising a flexible film carrier having electronic circuitry on both major surfaces thereof, and a plurality of solder interconnection pads on a first major surface thereof; solder mask layer located on both major surfaces of said flexible film carrier; a plurality of modules located on said first major surface of said flexible film carrier and attached to said flexible film carrier by solder balls mated to solder interconnection pads on said first major surface; and wherein said solder mask is not present on areas of said first major surface located between adjacent modules.
Claim 2
Dependent Claim
96 words
An electronic package comprising a flexible film carrier having electronic circuitry on both major surfaces thereof, and a plurality of solder interconnection pads on a first major surface thereof; solder mask layer located on both major surfaces of said flexible film carrier; a plurality of modules located on said first major surface of said flexible film carrier and attached to said flexible film carrier by solder balls mated to solder interconnection pads on said first major surface; and wherein said solder mask is not present on areas of said first major surface located between adjacent modules.
Claim 3
Dependent Claim
14 words
The electronic package of claim 1 wherein said flexible film carrier is a polyimide.
Claim 4
Dependent Claim
21 words
The electronic package of claim 1 wherein said solder mask layers on both of the major surfaces is the same material.
Claim 5
Dependent Claim
16 words
The electronic package of claim 1 wherein said solder mask layers are permanent solder mask materials.
Claim 6
Dependent Claim
19 words
The electronic package of claim 1 wherein said solder mask material is an epoxy, acrylate or methacrylate based material.
Claim 7
Dependent Claim
27 words
The electronic package of claim 1 wherein said solder mask on said first major surface of said flexible film carrier contains slits at least 1/8 inch wide.
Claim 8
Dependent Claim
23 words
The electronic package of claim 1 wherein said substantially all of the areas between adjacent individual modules are free from said solder mask.
Claim 9
Dependent Claim
13 words
The electronic package of claim 1 wherein the solder balls are eutectic tin/lead.
Claim 10
Dependent Claim
22 words
The electronic package of claim 1 wherein on said second major surface there exists areas free from said solder mask between modules.
Claim 11
Dependent Claim
17 words
The electronic package of claim 1 wherein said flexible film carrier is a flexible organic film carrier.
References Cited (Backward Citations)
US4480288A
Cited
US4615781A
Cited
US5252846A
Cited
US4965700A
Cited
US5498890A
Cited
US5057969A
Cited
US5203075A
Cited
US5368884A
Cited
US5286991A
Cited
JPH07297560A
Cited
JPH08192482A
Cited
US5676301A
Cited
US5585162A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-05 | 2002-04-06 | 2002-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-05 | 2006-04-06 | 2006-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-05 | 2010-04-06 | 2010-10-06 | $7700.00 | Window Closed / Lapsed |