US5796589A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ball grid array integrated circuit package that has vias located within the solder pads of a package
Assignee: Intel Corp
•
Filing: 1995-12-20
•
Granted: 1998-08-18
•
Expires: 2015-12-20
Abstract
Abstract A ball grid array (BGA) integrated circuit package which has a plurality of vias located within the solder pads of a package substrate. The substrate supports an integrated circuit which is connected to the solder pads by the vias. Solder balls used to solder the package to an external printed circuit board are attached to the solder pads of the substrate. A solder mask plug is formed within the vias to prevent the solder balls from wicking into the vias. Locating the vias within the solder pads optimizes the routing space of the substrate and increases the routing density of the package.
Inventors
- 👤 Michael Barrow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 08:17
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0094; B; B23; B23K; B23K1/00; B23K1/0008; B23K1/0016; B23K11/00; B23K11/10; B23K11/11; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; B23K2101/00; B23K2101/36; B23K2101/40; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K1/114; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/11; H05K2203/1178; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K3/3452; H05K3/3465; H05K3/3478; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
112 words
An electronic package, comprising: a substrate that has a first surface and a second opposite surface; a solder pad located on said first surface of said substrate; a via which has a longitudinal channel that extends into said substrate and terminates within and extends through said solder pad; a first layer of solder mask that is located on said second surface of said substrate and extends into said longitudinal channel of said via; and, a solder ball that is attached to said solder pad and is located over said via wherein said solder ball is blocked from extending through said longitudinal channel of said via by said first layer of solder mask.
Claim 2
Dependent Claim
112 words
An electronic package, comprising: a substrate that has a first surface and a second opposite surface; a solder pad located on said first surface of said substrate; a via which has a longitudinal channel that extends into said substrate and terminates within and extends through said solder pad; a first layer of solder mask that is located on said second surface of said substrate and extends into said longitudinal channel of said via; and, a solder ball that is attached to said solder pad and is located over said via wherein said solder ball is blocked from extending through said longitudinal channel of said via by said first layer of solder mask.
Claim 3
Dependent Claim
46 words
The package as recited in claim 1, further comprising a second layer of solder mask located on said first surface of said substrate, said second layer of solder mask has a first opening with a diameter that is larger than a diameter of said solder pad.
Claim 4
Dependent Claim
16 words
The package as recited in claim 1, further comprising a conductive layer connected to said via.
Claim 5
Dependent Claim
27 words
The package as recited in claim 3, wherein said conductive layer is located on said second surface of said substrate and said via extends through said substrate.
Claim 6
Dependent Claim
46 words
The package as recited in claim 4, further comprising a second layer of solder mask located on said first surface of said substrate, said second layer of solder mask has a first opening with a diameter that is larger than a diameter of said solder pad.
Claim 7
Dependent Claim
26 words
The package as recited in claim 3, wherein said conductive layer is located within said substrate and said via extends through a portion of said substrate.
Claim 8
Dependent Claim
46 words
The package as recited in claim 6, further comprising a second layer of solder mask located on said second surface of said substrate, said first layer of solder mask has a first opening with a diameter that is larger than a diameter of said solder pad.
Claim 9
Dependent Claim
132 words
An integrated circuit package, comprising: a substrate that has a first surface and a second opposite surface; an integrated circuit located on said second surface of said substrate; a solder pad located on said first surface of said substrate; a via which has a longitudinal channel that extends into said substrate and terminates within and extends through said solder pad; a first layer of solder mask that is located on said second surface of said substrate and extends into said longitudinal channel of said via; a solder ball that is attached to said solder pad and is located over said via wherein said solder ball is blocked from extending through said longitudinal channel of said via by said first layer of solder mask; and, an outer shell that encloses said integrated circuit.
Claim 10
Dependent Claim
132 words
An integrated circuit package, comprising: a substrate that has a first surface and a second opposite surface; an integrated circuit located on said second surface of said substrate; a solder pad located on said first surface of said substrate; a via which has a longitudinal channel that extends into said substrate and terminates within and extends through said solder pad; a first layer of solder mask that is located on said second surface of said substrate and extends into said longitudinal channel of said via; a solder ball that is attached to said solder pad and is located over said via wherein said solder ball is blocked from extending through said longitudinal channel of said via by said first layer of solder mask; and, an outer shell that encloses said integrated circuit.
Claim 11
Dependent Claim
46 words
The package as recited in claim 8, further comprising a second layer of solder mask located on said first surface of said substrate, said second layer of solder mask has a first opening with a diameter that is larger than a diameter of said solder pad.
Claim 12
Dependent Claim
16 words
The package as recited in claim 8, further comprising a conductive layer connected to said via.
Claim 13
Dependent Claim
27 words
The package as recited in claim 10, wherein said conductive layer is located on said second surface of said substrate and said via extends through said substrate.
Claim 14
Dependent Claim
46 words
The package as recited in claim 11, further comprising a second layer of solder mask located on said first surface of said substrate, said second layer of solder mask has a first opening with a diameter that is larger than a diameter of said solder pad.
Claim 15
Dependent Claim
26 words
The package as recited in claim 10, wherein said conductive layer is located within said substrate and said via extends through a portion of said substrate.
Claim 16
Dependent Claim
46 words
The package as recited in claim 13, further comprising a second layer of solder mask located on said first surface of said substrate, said second layer of solder mask has a first opening with a diameter that is larger than a diameter of said solder pad.
Claim 17
Independent Claim
98 words
A method for constructing an electronic package, comprising the steps of: a) forming a solder pad on a substrate; b) forming a via within said substrate, wherein said via is located within and extends through said solder pad and has a longitudinal channel that extends through said substrate; c) forming a solder mask on said substrate so that said solder mask extends into said longitudinal channel; d) attaching a solder ball to said solder pad over said via; and, e) reflowing said solder ball wherein said solder mask prevents said solder ball from flowing through said longitudinal channel.
Claim 18
Independent Claim
98 words
A method for constructing an electronic package, comprising the steps of: a) forming a solder pad on a substrate; b) forming a via within said substrate, wherein said via is located within and extends through said solder pad and has a longitudinal channel that extends through said substrate; c) forming a solder mask on said substrate so that said solder mask extends into said longitudinal channel; d) attaching a solder ball to said solder pad over said via; and, e) reflowing said solder ball wherein said solder mask prevents said solder ball from flowing through said longitudinal channel.
References Cited (Backward Citations)
US4935581A
Cited
US4954308A
Cited
JPH02283091A
Cited
US5136366A
Cited
US5216278A
Cited
US5241133A
Cited
US5153385A
Cited
US5219117A
Cited
JPH05144995A
Cited
US5402314A
Cited
US5285352A
Cited
US5284287A
Cited
US5254501A
Cited
US5355283A
Cited
US5493077A
Cited
US5616256A
Cited
US5523920A
Cited
US5519936A
Cited
US5541368A
Cited
US5557502A
Cited
US5634268A
Cited
US5640047A
Cited
US5637920A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-17 | 2002-02-16 | 2002-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-17 | 2006-02-16 | 2006-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-17 | 2010-02-16 | 2010-08-18 | $7700.00 | Window Closed / Lapsed |