Patent US1777228A successfully refreshed from Google Patents.
Patent US5746565A successfully refreshed from Google Patents.
US5746565A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Robotic wafer handler
Assignee: Solitec Wafer Processing Inc
•
Filing: 1996-01-22
•
Granted: 1998-05-05
•
Expires: 2016-01-22
Abstract
Abstract A robotic wafer handler has first and second arms pivotally connected at a swing point to operate in a plane. Each arm is independently drivable through greater than 360° of rotation in the plane. The wafer handler may also include mechanisms for adjusting the plane of rotation, i.e., for providing lift and tilt.
Inventors
- 👤 Gary B. Tepolt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 23:24
CPC Classifications
B; B25; B25J; B25J9/00; B25J9/02; B25J9/04; H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7602; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10T; Y10T74/00; Y10T74/20; Y10T74/20207; Y10T74/20305; Y10T74/20323
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
125 words
A robotic wafer handler comprising: a first drive mechanism; a first arm portion coupled to said first drive mechanism, and drivable by said first drive mechanism through 360 degrees of rotation; a second drive mechanism; a second arm portion coupled to said second drive mechanism, and pivotally engaged with said first arm portion, said second arm portion drivable by said second drive mechanism through more than 360 degrees of rotation with respect to said first arm portions; a lift mechanism coupled to said first arm portion, said lift mechanism functioning to vertically lift said first and second arm portions along a vertical axis; and a tilt mechanism coupled to said first arm portion, said tilt mechanism functioning to tilt said first and second arm portions.
Claim 2
Dependent Claim
125 words
A robotic wafer handler comprising: a first drive mechanism; a first arm portion coupled to said first drive mechanism, and drivable by said first drive mechanism through 360 degrees of rotation; a second drive mechanism; a second arm portion coupled to said second drive mechanism, and pivotally engaged with said first arm portion, said second arm portion drivable by said second drive mechanism through more than 360 degrees of rotation with respect to said first arm portions; a lift mechanism coupled to said first arm portion, said lift mechanism functioning to vertically lift said first and second arm portions along a vertical axis; and a tilt mechanism coupled to said first arm portion, said tilt mechanism functioning to tilt said first and second arm portions.
Claim 3
Dependent Claim
19 words
The robotic wafer handler of claim 1, wherein said first and second arm portions substantially rotate in a plane.
Claim 4
Dependent Claim
40 words
The robotic wafer handler of claim 1, further including a lateral linear motion assembly coupled to said first arm portion, said lateral linear motion assembly functioning to move said first arm portion along an axis orthogonal to the vertical axis.
Claim 5
Dependent Claim
20 words
The robotic wafer handler of claim 3, wherein said second arm portion includes a laminated structure with an end effector.
Claim 6
Dependent Claim
24 words
The robotic wafer handler of claim 4, wherein said second arm portion includes holes and channels through which a gaseous material may be drawn.
Claim 7
Dependent Claim
14 words
The robotic wafer handler of claim 5, wherein said end effector includes a banker.
Claim 8
Dependent Claim
21 words
The robotic wafer handler of claim 6, wherein said first drive mechanism includes a motor coupled to said first arm portion.
Claim 9
Dependent Claim
26 words
The robotic wafer handler of claim 7, wherein said second drive mechanism includes a motor driven shaft driving a belt that rotates said second arm portion.
Claim 10
Dependent Claim
24 words
The robotic wafer handler of claim 8, wherein said lateral linear motion assembly includes a drive belt engaged with a plurality of cog pulleys.
Claim 11
Dependent Claim
16 words
The robotic wafer handler of claim 9, wherein said lift mechanism includes an eccentric drive mechanism.
Claim 12
Dependent Claim
16 words
The robotic wafer handler of claim 10, wherein said tilt mechanism includes an eccentric drive mechanism.
Claim 13
Dependent Claim
32 words
The robotic wafer handler of claim 11, further including position sensors for measuring relative positions of first and second arm portion rotation, and rotary motion assembly lift, tilt and lateral linear position.
Claim 14
Dependent Claim
13 words
The robotic wafer handler of claim 12, further including a motion control system.
Claim 15
Dependent Claim
216 words
A rotary assembly for collecting and depositing semiconductor wafers in a wafer processing system, comprising: a first arm portion having first and second ends; a second arm portion having first and second ends, said first end of said first arm portion pivotally connected to said first end of said second arm portion such that first and second arm portions are independently rotatable through more than 360 degrees of rotation, said second end of said second arm potion formed to accept wafers for transport; a base member coupled to said first arm portion; a first beam having first and second distal ends, said first beam pivotally coupled to said base member at said first end and coupled to an anchor at said second end; a second beam having first and second distal ends, said second beam pivotally coupled to said base member at said first end and coupled to an anchor at said second end; a first eccentric drive mechanism including a first asymmetrically rotatable wheel having an edge disposed against said first beam; and a second eccentric drive mechanism including a second asymmetrically rotatable wheel coupled to said second beam, whereby said first and second arm portions may be lifted, tilted, and simultaneously lifted and tilted through rotation of said first and second asymmetrically rotatable wheels.
Claim 16
Dependent Claim
216 words
A rotary assembly for collecting and depositing semiconductor wafers in a wafer processing system, comprising: a first arm portion having first and second ends; a second arm portion having first and second ends, said first end of said first arm portion pivotally connected to said first end of said second arm portion such that first and second arm portions are independently rotatable through more than 360 degrees of rotation, said second end of said second arm potion formed to accept wafers for transport; a base member coupled to said first arm portion; a first beam having first and second distal ends, said first beam pivotally coupled to said base member at said first end and coupled to an anchor at said second end; a second beam having first and second distal ends, said second beam pivotally coupled to said base member at said first end and coupled to an anchor at said second end; a first eccentric drive mechanism including a first asymmetrically rotatable wheel having an edge disposed against said first beam; and a second eccentric drive mechanism including a second asymmetrically rotatable wheel coupled to said second beam, whereby said first and second arm portions may be lifted, tilted, and simultaneously lifted and tilted through rotation of said first and second asymmetrically rotatable wheels.
Claim 17
Dependent Claim
41 words
The robotic wafer handler of claim 14, including a first rotational drive mechanism with a motor coupled to said first arm portion, said first rotational drive mechanism operative to rotate said first arm portion with respect to said second arm portion.
Claim 18
Dependent Claim
32 words
The robotic wafer handler of claim 15, including a second rotational drive mechanism with a motor driven shaft which drives a belt that is coupled to and rotates said second arm portion.
Claim 19
Dependent Claim
22 words
The robotic wafer handler of claim 16, further including an encoder disposed proximate to, and operationally engaged with said motor driven shaft.
Claim 20
Independent Claim
104 words
A method of transporting wafers from a starting point to a destination point in a wafer fabrication system by employing a robot having first and second linked arm portions, comprising the steps of: positioning the second arm portion below a wafer at the starting point; securing the wafer to the second arm portion by applying a vacuum through the second arm portion; tilting the second arm portion away from the starting point; rotating said first arm portion with respect to said second arm portion pivotally connected to said first arm portion; and rotating said second arm portion with respect to said first arm portion.
Claim 21
Independent Claim
104 words
A method of transporting wafers from a starting point to a destination point in a wafer fabrication system by employing a robot having first and second linked arm portions, comprising the steps of: positioning the second arm portion below a wafer at the starting point; securing the wafer to the second arm portion by applying a vacuum through the second arm portion; tilting the second arm portion away from the starting point; rotating said first arm portion with respect to said second arm portion pivotally connected to said first arm portion; and rotating said second arm portion with respect to said first arm portion.
Claim 22
Dependent Claim
15 words
The method of claim 18, further including moving said first and second arm portions laterally.
Claim 23
Dependent Claim
14 words
The method of claim 19, further including lifting said first and second arm portions.
References Cited (Backward Citations)
US4433951A
Cited
US4552505A
Cited
US4827954A
Cited
US4909701A
Cited
US4553069A
Cited
US4584045A
Cited
US4694776A
Cited
US4643627A
Cited
US4657618A
Cited
US4657620A
Cited
US4654106A
Cited
US4659413A
Cited
US4789294A
Cited
US4842680A
Cited
US4966519A
Cited
US4816116A
Cited
US5044871A
Cited
US4687542A
Cited
US4724621A
Cited
US4764076A
Cited
US4705951A
Cited
US5013385A
Cited
US5102495A
Cited
US4917556A
Cited
US5096364A
Cited
US4770590A
Cited
US5015177A
Cited
US4717461A
Cited
US4778331A
Cited
US4715921A
Cited
US5324155A
Cited
US5049029A
Cited
US5092728A
Cited
US5020475A
Cited
US5156521A
Cited
US4923054A
Cited
US5083896A
Cited
US5064340A
Cited
US5288333A
Cited
US5044752A
Cited
US5046992A
Cited
US5123804A
Cited
US5236295A
Cited
US5258047A
Cited
US5248886A
Cited
US5277579A
Cited
US5178512A
Cited
US5253663A
Cited
US5513946A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-04 | 2001-11-03 | 2002-05-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-04 | 2005-11-03 | 2006-05-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-04 | 2009-11-03 | 2010-05-05 | $7700.00 | Window Closed / Lapsed |