Arm apparatus for conveying semiconductor wafer and processing system using same

Claim 2

An arm apparatus for conveying a semiconductor wafer, comprising; an arm base; a distal-end plate having opposite outer sides and rotatably connected to an end of the arm base so as to be invertible between both sides thereof; first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer; horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane; and an actuator for rotating the distal-end plate relative to the arm base, the actuator being supported by the arm base; wherein the distal-end plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward.

Claim 3

The apparatus according to claim 1, wherein the horizontally driving means includes an arm element which supports the arm base pivotally in a horizontal plane.

Claim 4

The apparatus according to claim 1, wherein the distal-end plate has dimensions permitting the water to be taken out from a container in which the wafer is stored.

Claim 5

The apparatus according to claim 1, wherein the actuator comprises a bidirectional rotary actuator located on the arm base, and first and second engaging means are respectively provided on the arm base and the distal-end plate, so as to be engaged with each other and stop one of the first and second mount regions at the wafer-supporting position.

Claim 6

The apparatus according to claim 4, wherein the first engaging means comprises a stopper protruding from one of the arm base and the distal-end plate, and the second engaging means comprises means to be in contact with the stopper provided to the other of the arm base and the distal-end plate.

Claim 7

The apparatus according to claim 5, wherein the means to be in contact with the stopper comprises two recesses formed one on either side of the other of the arm base and the distal-end plate.

Claim 8

The apparatus according to claim 6, wherein the stopper is provided to the arm base and the recesses are provided to the distal-end plate.

Claim 9

A processing system for processing a semiconductor wafer, comprising: (a) a plurality of process chambers which house the wafer and subject it to respective processes different from each other; and (b) an arm apparatus for transferring the wafer into and from the process chambers, and comprising: an arm base, a distal-end plate having opposite outer sides and rotatably connected to an and of the arm base so as to be invertible between both sides thereof, first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer, horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane, and an actuator for rotating the distal-end plate relative to the arm base, the actuator being supported by the arm base, wherein the distal-and plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward.

Claim 10

A processing system for processing a semiconductor wafer, comprising: (a) a plurality of process chambers which house the wafer and subject it to respective processes different from each other; and (b) an arm apparatus for transferring the wafer into and from the process chambers, and comprising: an arm base, a distal-end plate having opposite outer sides and rotatably connected to an and of the arm base so as to be invertible between both sides thereof, first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer, horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane, and an actuator for rotating the distal-end plate relative to the arm base, the actuator being supported by the arm base, wherein the distal-and plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward.

Claim 11

The system according to claim 8, wherein the horizontally driving means includes an arm element which supports the arm base pivotally in a horizontal plane.

Claim 12

The system according to claim 8, wherein the distal-end plate has dimensions permitting the wafer to be taken out from a container in which the wafer is stored.

Claim 13

The system according to claim 8, wherein the actuator comprises a bidirectional rotary actuator located on the arm base, and first and second engaging means are respectively provided on the arm base and the distal-end plate, so as to be engaged with each other and stop one of the first and second mount regions at the wafer-supporting position.

Claim 14

The system according to claim 11, wherein the first engaging means comprises a stopper protruding from one of the arm base and the distal-and plate, and the second engaging means comprises means to be in contact with the stopper provided to the other of the arm base and the distal-end plate.

Claim 15

The system according to claim 12, wherein the means to be in contact with the stopper comprises two recesses formed one on either side of the other of the arm base and the distal-end plate.

Claim 16

The system according to claim 13, wherein the stopper is provided to the arm base and the recesses are provided to the distal-end plate.

Claim 17

The system according to claim 11, wherein each of the process chambers includes means for performing a process selected from a group consisting of etching of natural oxide film, CVD, and heat treatment.

Claim 18

A processing system for processing a semiconductor wafer, comprising: (a) a plurality of process chambers which house the wafer and subject it to respective processes different from each other; (b) a first arm apparatus for transferring the wafer into and from the process chambers, and comprising an arm base, a distal-end plate having opposite outer sides and rotatably connected to an end of the arm base so as to be invertible between both sides thereof. first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer, horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane, and including an arm element which supports the arm base pivotally in a horizontal plane, and an actuator for rotating the distal-end plate relative to the arm base, the actuator being supported by the arm base, wherein the distal-end plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward; (c) a wafer convey chamber connected to the process chambers, the first arm apparatus being arranged in the wafer convey chamber; (d) a load lock chamber connected to the wafer convey chamber; (e) a container for storing the wafer and positioned in the load lock chamber; and (f) a second arm apparatus for transferring the wafer into and from the container, the second arm apparatus being arranged in the wafer convey chamber and comprising an arm base, a distal-end plate having opposite outer sides and rotatably connected to an end of the arm base so as to be invertible between both sides thereof, first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer, horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane, and including an arm element which supports the arm base pivotally in a horizontal plane, and an actuator for rotating the distal-and plate relative to the arm base, the actuator being supported by the arm base, wherein the distal-end plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward.

Claim 19

A processing system for processing a semiconductor wafer, comprising: (a) a plurality of process chambers which house the wafer and subject it to respective processes different from each other; (b) a first arm apparatus for transferring the wafer into and from the process chambers, and comprising an arm base, a distal-end plate having opposite outer sides and rotatably connected to an end of the arm base so as to be invertible between both sides thereof. first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer, horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane, and including an arm element which supports the arm base pivotally in a horizontal plane, and an actuator for rotating the distal-end plate relative to the arm base, the actuator being supported by the arm base, wherein the distal-end plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward; (c) a wafer convey chamber connected to the process chambers, the first arm apparatus being arranged in the wafer convey chamber; (d) a load lock chamber connected to the wafer convey chamber; (e) a container for storing the wafer and positioned in the load lock chamber; and (f) a second arm apparatus for transferring the wafer into and from the container, the second arm apparatus being arranged in the wafer convey chamber and comprising an arm base, a distal-end plate having opposite outer sides and rotatably connected to an end of the arm base so as to be invertible between both sides thereof, first and second mount regions respectively formed on the opposite outer sides of the distal-end plate and shaped so as to support the wafer, horizontally driving means for moving the arm base and the distal-end plate integrally in a horizontal plane, and including an arm element which supports the arm base pivotally in a horizontal plane, and an actuator for rotating the distal-and plate relative to the arm base, the actuator being supported by the arm base, wherein the distal-end plate is inverted so as to position one of the first and second mount regions in a wafer-supporting position facing upward.