Patent US5734560A successfully refreshed from Google Patents.
US5734560A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap
Assignee: International Business Machines Corp
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Filing: 1996-03-20
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Granted: 1998-03-31
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Expires: 2016-03-20
Abstract
Abstract A cap for attaching a chip or other device to a multi-layer electronic structure. The cap includes a plurality of pads of an electrically-conducting material attached over plated through holes of the multi-layer electronic structure. Each of the pads includes a flat upper surface for attaching the chip or other device to the multi-layer structure, provides an electrical connection between the chip or other device and the multi-layer structure, and seals the through holes to prevent solder from entering the plated through hole. The pads are physically isolated from each other.
Inventors
- 👤 James Steven Kamperman
- 👤 Thomas Patrick Gall
- 👤 David Brian Stone
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:08
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/00; H05K3/0094; H05K3/40; H05K3/4007; H05K3/4015; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/401; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/064; H05K3/10; H05K3/20; H05K3/205; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K3/46; H05K3/4611; H05K3/4614; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
92 words
A cap for attaching a chip or other device to a multi-layer electronic structure, said cap comprising: a plurality of pads of an electrically-conducting material attached over plated through holes of the multi-layer electronic structure, each of said pads including a flat upper surface for attaching said chip or other device to said multi-layer structure, providing an electrical connection between said chip or other device and said multi-layer structure, and sealing said plated through holes to prevent solder from entering said plated through holes, said pads being physically isolated from each other.
Claim 2
Dependent Claim
92 words
A cap for attaching a chip or other device to a multi-layer electronic structure, said cap comprising: a plurality of pads of an electrically-conducting material attached over plated through holes of the multi-layer electronic structure, each of said pads including a flat upper surface for attaching said chip or other device to said multi-layer structure, providing an electrical connection between said chip or other device and said multi-layer structure, and sealing said plated through holes to prevent solder from entering said plated through holes, said pads being physically isolated from each other.
Claim 3
Dependent Claim
26 words
A cap according to claim 1, wherein the cap comprises substantially similar electrically-conducting materials included in said multi-layer electronic structure that the cap is attached to.
Claim 4
Dependent Claim
25 words
A cap according to claim 1, wherein the electrically-conducting material of said pads is substantially similar to an electrically-conducting material of said plated through holes.
Claim 5
Dependent Claim
28 words
A cap according to claim 1, wherein the electrically-conducting material of said pads is substantially similar to an electrically-conducting material of an electrically-conducting layer of said multi-layer structure.
Claim 6
Dependent Claim
16 words
A cap according to claim 1, wherein each of said pads comprises a plurality of layers.
Claim 7
Dependent Claim
25 words
A cap according to claim 1, wherein one of said pads is attached over each of said plated through holes of said multi-layer electronic structure.
Claim 8
Dependent Claim
103 words
A multi-layer electronic structure, comprising: at least one core including a plurality of functional planes, said at least one core including a plurality of plated through holes formed therethrough; and a plurality of pads of an electrically-conducting material attached to plated through holes of the core, each of said pads including a flat upper surface for attaching said chip or other device to said multi-layer structure, providing an electrical connection between said chip or other device and said multi-layer structure, and sealing said plated through holes to prevent solder from entering said plated through holes, said pads being physically isolated from each other.
Claim 9
Dependent Claim
103 words
A multi-layer electronic structure, comprising: at least one core including a plurality of functional planes, said at least one core including a plurality of plated through holes formed therethrough; and a plurality of pads of an electrically-conducting material attached to plated through holes of the core, each of said pads including a flat upper surface for attaching said chip or other device to said multi-layer structure, providing an electrical connection between said chip or other device and said multi-layer structure, and sealing said plated through holes to prevent solder from entering said plated through holes, said pads being physically isolated from each other.
Claim 10
Dependent Claim
38 words
A multi-layer electronic composite structure according to claim 7, further comprising: an electronic device including a plurality of ground, signal, and power sites, at least one of said sites being attached to one of said plurality of pads.
Claim 11
Dependent Claim
24 words
A multi-layer electronic composite structure according to claim 8, wherein said electronic device is attached to said one of said pads using solder balls.
Claim 12
Dependent Claim
22 words
A multi-layer electronic composite structure according to claim 8, wherein said electronic device is directly attached to said one of said pads.
Claim 13
Dependent Claim
27 words
A multi-layer electronic structure according to claim 7, wherein the electrically-conducting material of said pads is substantially similar to an electrically-conducting material of said plated through holes.
Claim 14
Dependent Claim
30 words
A multi-layer electronic structure according to claim 7, wherein the electrically-conducting material of said pads is substantially similar to an electrically-conducting material of an electrically-conducting layer of said multi-layer structure.
Claim 15
Dependent Claim
18 words
A multi-layer electronic structure according to claim 7, wherein each of said pads comprises a plurality of layers.
Claim 16
Dependent Claim
27 words
A multi-layer structure according to claim 7, wherein one of said pads is attached over each of said plated through holes of said at least one core.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-30 | 2001-09-29 | 2002-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-30 | 2005-09-29 | 2006-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-30 | 2009-09-29 | 2010-03-31 | $7700.00 | Window Closed / Lapsed |